{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,31]],"date-time":"2026-07-31T15:23:56Z","timestamp":1785511436926,"version":"3.56.0"},"publisher-location":"Berlin, Heidelberg","reference-count":9,"publisher":"Springer Berlin Heidelberg","isbn-type":[{"value":"9783642115974","type":"print"},{"value":"9783642115981","type":"electronic"}],"license":[{"start":{"date-parts":[[2010,1,1]],"date-time":"2010-01-01T00:00:00Z","timestamp":1262304000000},"content-version":"unspecified","delay-in-days":0,"URL":"http:\/\/www.springer.com\/tdm"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2010]]},"DOI":"10.1007\/978-3-642-11598-1_12","type":"book-chapter","created":{"date-parts":[[2010,2,6]],"date-time":"2010-02-06T15:22:04Z","timestamp":1265469724000},"page":"105-112","source":"Crossref","is-referenced-by-count":2,"title":["Utilisation of FIB\/SEM Technology in the Assembly of an Innovative Micro-CMM Probe"],"prefix":"10.1007","author":[{"given":"Daniel","family":"Smale","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Steve","family":"Haley","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Joel","family":"Segal","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ronaldo","family":"Ronaldo","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Svetan","family":"Ratchev","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Richard K.","family":"Leach","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"James D.","family":"Claverley","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"297","reference":[{"key":"#cr-split#-12_CR1.1","unstructured":"Tietje, C., Ratchev, S.: Design for Microassembly \u2013 A Methodology for Product Design. In: International Symposium on Assembly and Manufacturing, pp. 1-4244-0563-7\/07 (2007);"},{"key":"#cr-split#-12_CR1.2","unstructured":"Proceedings of the 2007 IEEE"},{"key":"12_CR2","doi-asserted-by":"crossref","unstructured":"Ratchev, S., Koelemeijer, S.: Micro-assembly technologies and applications. In: Fourth International Precision Assembly Seminar. International Federation for Information Processing, Chamonix, France (2008)","DOI":"10.1007\/978-0-387-77405-3"},{"issue":"1","key":"12_CR3","doi-asserted-by":"publisher","first-page":"117","DOI":"10.1016\/S1526-6125(04)70065-1","volume":"6","author":"G.N. Peggs","year":"2004","unstructured":"Peggs, G.N., Lewis, A.J., Leach, R.K.: Measuring the metrology gap - 3D metrology at the mesoscopic level. Journal of Manufacturing Processes\u00a06(1), 117\u2013124 (2004)","journal-title":"Journal of Manufacturing Processes"},{"key":"12_CR4","doi-asserted-by":"crossref","unstructured":"Stoyanov, S., Bailey, C., Leach, R., Hughes, B., Wilson, A., O\u2019Neill, W., Dorey, R., Shaw, C., Underhill, D., Almond, H.: Modelling and Prototyping the Conceptual Design of 3D CMM Micro-probe. In: Proceedings of the IEEE 2nd Electronics System Integration Technology Conference, pp. 193\u2013198 (2008)","DOI":"10.1109\/ESTC.2008.4684348"},{"key":"12_CR5","doi-asserted-by":"publisher","first-page":"365","DOI":"10.1016\/S0007-8506(07)62141-6","volume":"50","author":"H. Haitjema","year":"2001","unstructured":"Haitjema, H., Pril, W.o., Schellekens, P.H.J.: Development of a silicon-based nanoprobe system for three-dimensional measurements. CIRP Annals - Manufacturing Tech.\u00a050, 365\u2013368 (2001)","journal-title":"CIRP Annals - Manufacturing Tech."},{"key":"12_CR6","doi-asserted-by":"crossref","unstructured":"Van Brussel, H.P.: Assembly of Microsystems. ClRP Opening Session. Annals of the ClRP 49\/2\/2000 (2000)","DOI":"10.1016\/S0007-8506(07)63450-7"},{"key":"12_CR7","volume-title":"Integrated and Simultaneous Design for Robotic Assembly","author":"H. Rampersad","year":"1994","unstructured":"Rampersad, H.: Integrated and Simultaneous Design for Robotic Assembly. John Wiley & Sons Ltd., Chichester (1994)"},{"key":"12_CR8","unstructured":"Smale, D., Ratchev, S., Segal, J., Leach, R.K., Claverly, J.D.: Assembly of the stem and tip of an innovative micro-CMM probe. In: Euspen 9th International Lamdamap (Laser Metrology and Machine Performance) Conference, Brunel, London, UK (2009)"}],"container-title":["IFIP Advances in Information and Communication Technology","Precision Assembly Technologies and Systems"],"original-title":[],"link":[{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/978-3-642-11598-1_12","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,3,12]],"date-time":"2019-03-12T09:37:04Z","timestamp":1552383424000},"score":1,"resource":{"primary":{"URL":"http:\/\/link.springer.com\/10.1007\/978-3-642-11598-1_12"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2010]]},"ISBN":["9783642115974","9783642115981"],"references-count":9,"URL":"https:\/\/doi.org\/10.1007\/978-3-642-11598-1_12","relation":{},"ISSN":["1868-4238","1868-422X"],"issn-type":[{"value":"1868-4238","type":"print"},{"value":"1868-422X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2010]]}}}