{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,18]],"date-time":"2025-11-18T12:14:25Z","timestamp":1763468065800,"version":"3.40.2"},"publisher-location":"Berlin, Heidelberg","reference-count":47,"publisher":"Springer Berlin Heidelberg","isbn-type":[{"type":"print","value":"9783642283673"},{"type":"electronic","value":"9783642283680"}],"license":[{"start":{"date-parts":[[2012,1,1]],"date-time":"2012-01-01T00:00:00Z","timestamp":1325376000000},"content-version":"tdm","delay-in-days":0,"URL":"http:\/\/www.springer.com\/tdm"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2012]]},"DOI":"10.1007\/978-3-642-28368-0_24","type":"book-chapter","created":{"date-parts":[[2012,2,21]],"date-time":"2012-02-21T07:51:46Z","timestamp":1329810706000},"page":"364-382","source":"Crossref","is-referenced-by-count":11,"title":["A Qualitative Security Analysis of a New Class of 3-D Integrated Crypto Co-processors"],"prefix":"10.1007","author":[{"given":"Jonathan","family":"Valamehr","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ted","family":"Huffmire","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Cynthia","family":"Irvine","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ryan","family":"Kastner","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"\u00c7etin Kaya","family":"Ko\u00e7","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Timothy","family":"Levin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Timothy","family":"Sherwood","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"297","reference":[{"issue":"6","key":"24_CR1","doi-asserted-by":"publisher","first-page":"520","DOI":"10.1109\/MDT.2005.150","volume":"22","author":"C. Ababei","year":"2005","unstructured":"Ababei, C., Feng, Y., Goplen, B., Mogal, H., Zhang, T., Bazargan, K., Sapatnekar, S.: Placement and Routing in 3D Integrated Circuits. IEEE Design and Test of Computers\u00a022(6), 520\u2013531 (2005)","journal-title":"IEEE Design and Test of Computers"},{"key":"24_CR2","doi-asserted-by":"crossref","unstructured":"Ac\u0131i\u00e7mez, O., Seifert, J.P., Koc, C.K.: Micro-architectural cryptanalysis. IEEE Security and Privacy Magazine\u00a05(4) (July-August 2007)","DOI":"10.1109\/MSP.2007.91"},{"key":"24_CR3","doi-asserted-by":"crossref","unstructured":"Aciicmez, O., Schindler, W., Ko\u00e7, \u00c7.K.: Improving Brumley and Boneh timing attack on unprotected SSL implementations. In: Proceedings of the 12th ACM Conference on Computer and Communications Security, pp. 139\u2013146 (November 2005)","DOI":"10.1145\/1102120.1102140"},{"issue":"4","key":"24_CR4","doi-asserted-by":"publisher","first-page":"62","DOI":"10.1109\/MSP.2007.91","volume":"5","author":"O. Aciicmez","year":"2007","unstructured":"Aciicmez, O., Seifert, J.P., Ko\u00e7, \u00c7.K.: Micro-architectural cryptanalysis. IEEE Security & Privacy\u00a05(4), 62\u201364 (2007)","journal-title":"IEEE Security & Privacy"},{"key":"24_CR5","series-title":"Lecture Notes in Computer Science","doi-asserted-by":"publisher","first-page":"29","DOI":"10.1007\/3-540-36400-5_4","volume-title":"Cryptographic Hardware and Embedded Systems - CHES 2002","author":"D. Agrawal","year":"2003","unstructured":"Agrawal, D., Archambeault, B., Rao, J.R., Rohatgi, P.: The EM side-channel(s). In: Kaliski Jr., B.S., Ko\u00e7, \u00c7.K., Paar, C. (eds.) CHES 2002. LNCS, vol.\u00a02523, pp. 29\u201345. Springer, Heidelberg (2003)"},{"issue":"11","key":"24_CR6","doi-asserted-by":"publisher","first-page":"2395","DOI":"10.1109\/TED.2005.857187","volume":"52","author":"A. Akturk","year":"2005","unstructured":"Akturk, A., Goldsman, N., Metze, G.: Self-Consistent Modeling of Heating and MOSFET Performance in 3-D Integrated Circuits. IEEE Transactions on Electron Devices\u00a052(11), 2395\u20132403 (2005)","journal-title":"IEEE Transactions on Electron Devices"},{"issue":"5","key":"24_CR7","doi-asserted-by":"publisher","first-page":"602","DOI":"10.1109\/5.929647","volume":"89","author":"K. Banerjee","year":"2001","unstructured":"Banerjee, K., Souri, S.J., Kapur, P., Saraswat, K.C.: 3-D ICs: A Novel Chip Design for Improving Deep Submicron Interconnect Performance and Systems-on-Chip Integration. Proceedings of the IEEE\u00a089(5), 602\u2013633 (2001)","journal-title":"Proceedings of the IEEE"},{"issue":"6","key":"24_CR8","doi-asserted-by":"publisher","first-page":"512","DOI":"10.1109\/MDT.2005.125","volume":"22","author":"Benkart","year":"2005","unstructured":"Benkart, et al.: 3D Chip Stack Technology Using Through-Chip Interconnects. IEEE Design and Test of Compus\u00a022(6), 512\u2013518 (2005)","journal-title":"IEEE Design and Test of Compus"},{"key":"24_CR9","unstructured":"Bernstein, D.J.: Cache-timing attacks on AES (April 2005), Revised version of earlier 2004-11 version, http:\/\/cr.yp.to\/antiforgery\/cachetiming-20050414.pdf"},{"key":"24_CR10","doi-asserted-by":"crossref","unstructured":"Black, B., Annavaram, M., Brekelbaum, N., DeVale, J., Jiang, L., Loh, G.H., McCauley, D., Morrow, P., Nelson, D.W., Pantuso, D., Reed, P., Rupley, J., Shankar, S., Shen, J., Webb, C.: Die Stacking (3D) Microarchitecture. In: Proceedings of the 39th Annual IEEE\/ACM International Symposium on Microarchitecture, pp. 469\u2013479 (December 2006)","DOI":"10.1109\/MICRO.2006.18"},{"key":"24_CR11","series-title":"Lecture Notes in Computer Science","doi-asserted-by":"crossref","first-page":"37","DOI":"10.1007\/3-540-69053-0_4","volume-title":"Advances in Cryptology - EUROCRYPT \u201997","author":"D. Boneh","year":"1997","unstructured":"Boneh, D., DeMillo, R.A., Lipton, R.J.: On the importance of checking cryptographic protocols for faults. In: Fumy, W. (ed.) EUROCRYPT 1997. LNCS, vol.\u00a01233, pp. 37\u201351. Springer, Heidelberg (1997)"},{"key":"24_CR12","unstructured":"Brumley, D., Boneh, D.: Remote Timing Attacks Are Practical. In: Proceedings of the 12th USENIX Security Symposium (2003)"},{"issue":"6","key":"24_CR13","doi-asserted-by":"publisher","first-page":"498","DOI":"10.1109\/MDT.2005.136","volume":"22","author":"W.R. Davis","year":"2005","unstructured":"Davis, W.R., Wilson, J., Mick, S., Xu, J., Hua, H., Mineo, C., Sule, A.M., Steer, M., Franzon, P.D.: Demystifying 3D ICs: The Pros and Cons of Going Vertical. IEEE Design and Test of Computers\u00a022(6), 498\u2013510 (2005)","journal-title":"IEEE Design and Test of Computers"},{"key":"24_CR14","series-title":"Lecture Notes in Computer Science","doi-asserted-by":"publisher","first-page":"251","DOI":"10.1007\/3-540-44709-1_21","volume-title":"Cryptographic Hardware and Embedded Systems - CHES 2001","author":"K. Gandolfi","year":"2001","unstructured":"Gandolfi, K., Mourtel, C., Olivier, F.: Electromagnetic analysis: Concrete results. In: Ko\u00e7, \u00c7.K., Naccache, D., Paar, C. (eds.) CHES 2001. LNCS, vol.\u00a02162, pp. 251\u2013261. Springer, Heidelberg (2001)"},{"key":"24_CR15","doi-asserted-by":"crossref","unstructured":"Groger, M., Harb, S.M., Morris, D., Eisenstadt, W.R., Puligundla, S.: High Speed I\/O and Thermal Effect Characterization of 3D Stacked ICs. In: Proceedings of the IEEE International Conference on 3D System Integration (3D IC), pp. 1\u20135 (September 2009)","DOI":"10.1109\/3DIC.2009.5306528"},{"key":"24_CR16","unstructured":"Gueron, S.: White paper: Advanced encryption standard (AES) instructions set, Intel corporation (July 2008)"},{"key":"24_CR17","doi-asserted-by":"crossref","unstructured":"Alex Halderman, J., Schoen, S.D., Heninger, N., Clarkson, W., Paul, W., Calandrino, J.A., Feldman, A.J., Appelbaum, J., Felten, E.W.: Lest we remember: Cold-boot attacks on encryption keys. In: Proceedings of the USENIX Security Symposium, Sec 2008 (June 2008)","DOI":"10.1145\/1506409.1506429"},{"key":"24_CR18","doi-asserted-by":"crossref","unstructured":"Hollosi, B., Zhang, T., Nair, R.S.P., Xie, Y., Di, J., Smith, S.: Investigation and Comparison of Thermal Distribution in Synchronous and Asynchronous 3D ICs. In: Proceedings of the IEEE International Conference on 3D System Integration (3D IC), pp. 1\u20135 (September 2009)","DOI":"10.1109\/3DIC.2009.5306544"},{"issue":"6","key":"24_CR19","doi-asserted-by":"publisher","first-page":"540","DOI":"10.1109\/MDT.2005.151","volume":"22","author":"P. Jacob","year":"2005","unstructured":"Jacob, P., Erdogan, O., Zia, A., Belemjian, P.M., Kraft, R.P., McDonald, J.F.: Predicting the performance of a 3D processor-memory chip stack. IEEE Design and Test of Computers\u00a022(6), 540\u2013547 (2005)","journal-title":"IEEE Design and Test of Computers"},{"key":"24_CR20","doi-asserted-by":"crossref","unstructured":"Kleiner, M.B., K\u00fchn, S.A., Weber, W.: Performance Improvement of the Memory Hierarchy of RISC Systems by Applications of 3-D Technology. In: Proceedings of the IEEE International Symposium on Circuits and Systems (ISCAS), pp. 2305\u20132308 (1995)","DOI":"10.1109\/ISCAS.1995.523890"},{"key":"24_CR21","series-title":"Lecture Notes in Computer Science","doi-asserted-by":"crossref","first-page":"388","DOI":"10.1007\/3-540-48405-1_25","volume-title":"Advances in Cryptology - CRYPTO \u201999","author":"P.C. Kocher","year":"1999","unstructured":"Kocher, P.C., Jaffe, J., Jun, B.: Differential power analysis. In: Wiener, M. (ed.) CRYPTO 1999. LNCS, vol.\u00a01666, pp. 388\u2013397. Springer, Heidelberg (1999)"},{"key":"24_CR22","series-title":"Lecture Notes in Computer Science","doi-asserted-by":"crossref","first-page":"104","DOI":"10.1007\/3-540-68697-5_9","volume-title":"Advances in Cryptology - CRYPTO \u201996","author":"P.C. Kocher","year":"1996","unstructured":"Kocher, P.C.: Timing Attacks on Implementations of Diffie-Hellman, RSA, DSS, and Other Systems. In: Koblitz, N. (ed.) CRYPTO 1996. LNCS, vol.\u00a01109, pp. 104\u2013113. Springer, Heidelberg (1996)"},{"issue":"11","key":"24_CR23","doi-asserted-by":"publisher","first-page":"43","DOI":"10.1109\/6.880953","volume":"37","author":"J. Kumagai","year":"2000","unstructured":"Kumagai, J.: Chip detectives. IEEE Spectrum\u00a037(11), 43 (2000)","journal-title":"IEEE Spectrum"},{"issue":"6","key":"24_CR24","doi-asserted-by":"publisher","first-page":"556","DOI":"10.1109\/MDT.2005.134","volume":"22","author":"C.C. Liu","year":"2005","unstructured":"Liu, C.C., Ganusov, I., Burtscher, M., Tiwari, S.: Bridging the Processor-Memory Performance Gap with 3D IC Technology. IEEE Design and Test\u00a022(6), 556\u2013564 (2005)","journal-title":"IEEE Design and Test"},{"key":"24_CR25","doi-asserted-by":"crossref","unstructured":"Loh, G.D.: 3D-Stacked Memory Architectures for Multi-Core Processors. In: Proceedings of the 35th Annual International Symposium on Computer Architecture (ISCA), pp. 453\u2013464 ( June 2008)","DOI":"10.1145\/1394608.1382159"},{"key":"24_CR26","doi-asserted-by":"crossref","unstructured":"Loi, G.L., Agrawal, B., Srivastava, N., Lin, S.-C., Sherwood, T., Banerjee, K.: A Thermally-Aware Performance Analysis of Vertically Integrated (3-D) Processor-Memory Hierarchy. In: Proceedings of the 43nd Design Automation Conference, DAC (June 2006)","DOI":"10.1109\/DAC.2006.229426"},{"key":"24_CR27","unstructured":"Massit, C., Gerard, N.: Three-dimensional multichip module. United State Patent, US 5373189 (December 1994)"},{"key":"24_CR28","doi-asserted-by":"crossref","unstructured":"Matsumoto, K., Taira, Y.: Thermal resistance measurements of interconnections and modeling of thermal conduction path, for the investigation of the thermal resistance of a three- dimensional (3D) chip stack. In: Proceedings of the 13th IEEE International Symposium on Consumer Electronics (ISCE 2009), pp. 598\u2013602 ( July 2009)","DOI":"10.1109\/ISCE.2009.5156918"},{"key":"24_CR29","doi-asserted-by":"crossref","unstructured":"Miura, et al.: A 195Gb\/s 1.2W 3D-Stacked Inductive Inter-Chip Wireless Superconnect with Transmit Power Control Scheme. In: IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, pp. 264\u2013265 (February 2005)","DOI":"10.1109\/JSSC.2005.858625"},{"key":"24_CR30","doi-asserted-by":"crossref","unstructured":"Mysore, S., Agrawal, B., Lin, S.C., Srivastava, N., Banerjee, K., Sherwood, T.: Introspective 3-D chips. In: Proceedings of the 12th International Conference on Architectural Support for Programming Languages and Operating Systems (ASPLOS), San Jose, CA (October 2006)","DOI":"10.1145\/1168857.1168890"},{"key":"24_CR31","unstructured":"National Security\u00a0Agency (NSA). NSA Suite B Cryptography, http:\/\/www.nsa.gov\/ia\/programs\/suiteb_cryptography"},{"key":"24_CR32","unstructured":"National\u00a0Institute of\u00a0Standards and Technology (NIST). Suite B Implementer\u2019s Guide to NIST SP 800-56A. CryptoBytes, RSA Laboratories 4(1), 6\u201310 (2009)"},{"key":"24_CR33","unstructured":"Percival, C.: Cache missing for fun and profit. In: Proceedings of the Technical BSD Conference (BSDCan 2005), Ottowa, Canada (May 2005)"},{"key":"24_CR34","doi-asserted-by":"crossref","unstructured":"Puttaswamy, K., Loh, G.H.: Implementing Caches in a 3D Technology for High Performance Processors. In: IEEE International Conference on Computer Design (ICCD 2006), pp. 525\u2013532 (2005)","DOI":"10.1109\/ICCD.2005.65"},{"key":"24_CR35","doi-asserted-by":"crossref","unstructured":"Puttaswamy, K., Loh, G.H.: Thermal analysis of a 3D die-stacked high-performance microprocessor. In: Proceedings of the 16th ACM Great Lakes symposium on VLSI, pp. 19\u201324 (May 2006)","DOI":"10.1145\/1127908.1127915"},{"key":"24_CR36","series-title":"Lecture Notes in Computer Science","doi-asserted-by":"publisher","first-page":"200","DOI":"10.1007\/3-540-45418-7_17","volume-title":"Smart Card Programming and Security","author":"J.-J. Quisquater","year":"2001","unstructured":"Quisquater, J.-J., Samyde, D.: ElectroMagnetic analysis (EMA): Measures and counter-measures for smart cards. In: Attali, S., Jensen, T. (eds.) E-smart 2001. LNCS, vol.\u00a02140, pp. 200\u2013210. Springer, Heidelberg (2001)"},{"key":"24_CR37","unstructured":"Quisquater, J.-J., Samyde, D.: Side Channel Cryptanalysis. In: Proceedings of the Workshop on the Security of Communications on the Internet (SECI), pp. 179\u2013184 (September 2002)"},{"issue":"2","key":"24_CR38","doi-asserted-by":"publisher","first-page":"357","DOI":"10.1109\/JPROC.2005.862423","volume":"94","author":"D. Saha","year":"2006","unstructured":"Saha, D., Mukhopadhyay, D., RoyChowdhury, D.: Cryptographic processors - a survey. Proceedings of the IEEE\u00a094(2), 357\u2013369 (2006)","journal-title":"Proceedings of the IEEE"},{"key":"24_CR39","doi-asserted-by":"crossref","unstructured":"Saha, D., Mukhopadhyay, D., RoyChowdhury, D.: A Diagonal Fault Attack on the Advanced Encryption Standard. Cryptology ePrint Archive 581 (2009)","DOI":"10.1007\/978-3-642-02384-2_26"},{"issue":"3","key":"24_CR40","doi-asserted-by":"publisher","first-page":"429","DOI":"10.1016\/0026-2714(95)93069-M","volume":"35","author":"J.M. Soden","year":"1995","unstructured":"Soden, J.M., Anderson, R.E.: IC failure analysis: Techniques and tools for quality and reliability improvement. Microelectronics and Reliability\u00a035(3), 429\u2013453 (1995)","journal-title":"Microelectronics and Reliability"},{"key":"24_CR41","doi-asserted-by":"crossref","unstructured":"Sun, H., Liu, J., Anigundi, R.S., Zheng, N., Lu, J.-Q., Rose, K., Zhang, T.: 3D DRAM design and application to 3D multicore systems. IEEE Design and Test of Computers\u00a026(5) (September 2009)","DOI":"10.1109\/MDT.2009.105"},{"key":"24_CR42","unstructured":"Tam, P.: Ottawa firm rescues data from Swissair black box. The Ottawa Citizen (March 21, 2000)"},{"key":"24_CR43","volume-title":"IEEE International Conference on Computer Design","author":"Y.-F. Tsai","year":"2005","unstructured":"Tsai, Y.-F., Xie, Y., Vijaykrishnan, N., Irwin, M.J.: Three-Dimensional Cache Design Exploration Using 3DCacti. In: IEEE International Conference on Computer Design. IEEE, Los Alamitos (2005)"},{"key":"24_CR44","unstructured":"Wheeler, B., Byrne, J.: A Guide to Processors for Network Security. Technical Report, The Linley Group (August 2010)"},{"key":"24_CR45","doi-asserted-by":"crossref","unstructured":"Wu, L., Weaver, C., Austin, T.: CryptoManiac: A Fast Flexible Architecture for Secure Communication. In: Proceedings of the 28th Annual International Symposium on Computer Architecture (ISCA), pp. 110\u2013119 (June-July 2001)","DOI":"10.1145\/384285.379256"},{"key":"24_CR46","doi-asserted-by":"crossref","unstructured":"Yoshikawa, H., Kawasaki, A., Iizuka, T., Nishimura, Y., Tanida, K., Akiyama, K., Sekiguchi, M., Matsuo, M., Fukuchi, S., Takahashi, K.: Chip scale camera module (CSCM) using through-silicon-via (TSV). In: Proceedings of the International Solid-State Circuits Conference (ISSCC), San Francisco, CA (February 2009)","DOI":"10.1109\/ISSCC.2009.4977515"},{"issue":"6","key":"24_CR47","doi-asserted-by":"publisher","first-page":"548","DOI":"10.1109\/MDT.2005.138","volume":"22","author":"A. Zeng","year":"2005","unstructured":"Zeng, A., Lu, J., Rose, K., Gutmann, R.J.: First-Order Performance Prediction of Cache Memory with Wafer-Level 3D Integration. IEEE Design and Test of Computers\u00a022(6), 548\u2013555 (2005)","journal-title":"IEEE Design and Test of Computers"}],"container-title":["Lecture Notes in Computer Science","Cryptography and Security: From Theory to Applications"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/978-3-642-28368-0_24","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,3,21]],"date-time":"2025-03-21T10:23:40Z","timestamp":1742552620000},"score":1,"resource":{"primary":{"URL":"http:\/\/link.springer.com\/10.1007\/978-3-642-28368-0_24"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012]]},"ISBN":["9783642283673","9783642283680"],"references-count":47,"URL":"https:\/\/doi.org\/10.1007\/978-3-642-28368-0_24","relation":{},"ISSN":["0302-9743","1611-3349"],"issn-type":[{"type":"print","value":"0302-9743"},{"type":"electronic","value":"1611-3349"}],"subject":[],"published":{"date-parts":[[2012]]}}}