{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,23]],"date-time":"2025-10-23T10:53:52Z","timestamp":1761216832912,"version":"build-2065373602"},"publisher-location":"Singapore","reference-count":14,"publisher":"Springer Nature Singapore","isbn-type":[{"type":"print","value":"9789819712762"},{"type":"electronic","value":"9789819712779"}],"license":[{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"},{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024]]},"DOI":"10.1007\/978-981-97-1277-9_20","type":"book-chapter","created":{"date-parts":[[2024,4,2]],"date-time":"2024-04-02T02:01:41Z","timestamp":1712023301000},"page":"262-276","update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["Multi-physical Field Collaborative Simulation Optimization Technology and Reliability Analysis of Power Amplifiers"],"prefix":"10.1007","author":[{"given":"Zhenbing","family":"Li","sequence":"first","affiliation":[]},{"given":"Junjie","family":"Huang","sequence":"additional","affiliation":[]},{"given":"Shilin","family":"Jia","sequence":"additional","affiliation":[]},{"given":"Jinrong","family":"Zhang","sequence":"additional","affiliation":[]},{"given":"Jialong","family":"Fu","sequence":"additional","affiliation":[]},{"given":"Xiaochuan","family":"Fang","sequence":"additional","affiliation":[]},{"given":"Gang","family":"Li","sequence":"additional","affiliation":[]},{"given":"Guangjun","family":"Wen","sequence":"additional","affiliation":[]}],"member":"297","published-online":{"date-parts":[[2024,4,3]]},"reference":[{"issue":"10","key":"20_CR1","doi-asserted-by":"publisher","first-page":"2016","DOI":"10.1109\/TCPMT.2019.2941866","volume":"9","author":"F Liu","year":"2019","unstructured":"Liu, F., et al.: Innovative Sub-5- \u03bc m microvias by picosecond UV laser for post-moore packaging interconnects. IEEE Trans. Components, Packaging Manuf. Technol. 9(10), 2016\u20132023 (2019)","journal-title":"IEEE Trans. Components, Packaging Manuf. Technol."},{"key":"20_CR2","doi-asserted-by":"crossref","unstructured":"Meneghini, M., et al.: Power GaN HEMT degradation: from time-dependent breakdown to hot-electron effects. In: 2018 IEEE International Electron Devices Meeting (IEDM), pp. 30.5.1\u201330.5.4. IEEE, San Francisco (2018)","DOI":"10.1109\/IEDM.2018.8614605"},{"key":"20_CR3","doi-asserted-by":"publisher","first-page":"986","DOI":"10.1109\/JEDS.2020.3023081","volume":"8","author":"M Mahrokh","year":"2020","unstructured":"Mahrokh, M., Yu, H., Guo, Y.: Thermal modeling of GaN HEMT devices with diamond heat-spreader. IEEE J. Electron. Devices Soc. 8, 986\u2013991 (2020)","journal-title":"IEEE J. Electron. Devices Soc."},{"key":"20_CR4","doi-asserted-by":"crossref","unstructured":"Duque, J.L., et al.: Multi-physics analysis of human exposition to electromagnetic fields by 5G systems. In: 2022 IEEE USNC-URSI Radio Science Meeting (Joint with AP-S Symposium), pp. 27\u201328. IEEE, Denver (2022)","DOI":"10.23919\/USNC-URSI52669.2022.9887446"},{"key":"20_CR5","doi-asserted-by":"crossref","unstructured":"Liu, X., Fan, M., Hu, Y., Li, H., Liu, F., Kang, J.: Simulation methods of multi-physics effects in nano-scale CMOS. In: 2022 International Electron Devices Meeting, pp. 15.4.1\u201315.4.4. IEEE, San Francisco (2022)","DOI":"10.1109\/IEDM45625.2022.10019403"},{"key":"20_CR6","doi-asserted-by":"publisher","first-page":"141153","DOI":"10.1109\/ACCESS.2019.2944162","volume":"7","author":"W Na","year":"2019","unstructured":"Na, W., Zhang, W., Yan, S., Feng, F., Zhang, W., Zhang, Y.: Automated neural network-based multiphysics parametric modeling of microwave components. IEEE Access 7, 141153\u2013141160 (2019)","journal-title":"IEEE Access"},{"key":"20_CR7","doi-asserted-by":"crossref","unstructured":"Rivi\u00e8re, N., Stokmaier, M., Goss, J.: An innovative multi-objective optimization approach for the multiphysics design of electrical machines. In: 2020 IEEE Transportation Electrification Conference & Expo (ITEC), pp. 691\u2013696. IEEE, Chicago, IL, USA (2020)","DOI":"10.1109\/ITEC48692.2020.9161650"},{"key":"20_CR8","doi-asserted-by":"crossref","unstructured":"Blair, C., L\u00f3pez Ruiz, S., Morales, M.: A MultiPhysics simulation vision from antenna element design to systems link analysis. In: 2019 International Conference on Electromagnetics in Advanced Applications, pp. 1420\u20131422. IEEE, Granada, Spain (2019)","DOI":"10.1109\/ICEAA.2019.8879074"},{"key":"20_CR9","doi-asserted-by":"crossref","unstructured":"Jia, Z.L., Xue, Z.S., Liu, X.Y., Zhang, H.H.: Electromagnetic-circuital-thermal multiphysics simulation of microwave amplifier. In: 2022 Photonics & Electromagnetics Research Symposium, pp. 1155\u20131158. IEEE, Hangzhou (2022)","DOI":"10.1109\/PIERS55526.2022.9792751"},{"key":"20_CR10","doi-asserted-by":"crossref","unstructured":"Guerrieri, S.D., Ramella, C., Catoggio, E., Bonani, F.: Variability-aware MMIC design through multiphysics modelling. In: 2022 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization, pp. 1\u20134. IEEE, Limoges, France (2022)","DOI":"10.1109\/NEMO51452.2022.10038948"},{"key":"20_CR11","doi-asserted-by":"crossref","unstructured":"Bello, H., Oyeleke, O., Usman, A.D., Bello, T., Muhammad, I., Zakariyya. O.S.: Modelling and realization of a compact CPW transmission lines using 3D mmics technology in ADS momentum. In: 2019 15th International Conference on Electronics, Computer and Computation (ICECCO), pp. 1\u20137. IEEE, Abuja, Nigeria (2019)","DOI":"10.1109\/ICECCO48375.2019.9043289"},{"key":"20_CR12","doi-asserted-by":"crossref","unstructured":"Niu, Z., Zhang, B., Fan, Y.: A 220GHz miniaturized integrated front end based on solid-state circuits. In: 2021 International Conference on Microwave and Millimeter Wave Technology, pp. 1\u20133. IEEE, Nanjing, China (2021)","DOI":"10.1109\/ICMMT52847.2021.9618072"},{"key":"20_CR13","doi-asserted-by":"crossref","unstructured":"Zhongwei, L., Zhaiqi.: Thermal stress analysis and optimization design of high temperature and high pressure valve based on the workbench. In: 2015 8th International Conference on Intelligent Computation Technology and Automation, pp. 1055\u20131058. IEEE, Nanchang, China (2015)","DOI":"10.1109\/ICICTA.2015.265"},{"issue":"19","key":"20_CR14","first-page":"1","volume":"18","author":"P Lin","year":"2021","unstructured":"Lin, P., Jianqiang, C., Zhihao, Z., Yang, H., Tong, W., Gary, Z.: Design of broadband high-gain GaN MMIC power amplifier based on reactive\/resistive matching and feedback technique. IEICE Electron. Express 18(19), 1\u20136 (2021)","journal-title":"IEICE Electron. Express"}],"container-title":["Communications in Computer and Information Science","Artificial Intelligence and Machine Learning"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/978-981-97-1277-9_20","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,23]],"date-time":"2025-10-23T10:43:30Z","timestamp":1761216210000},"score":1,"resource":{"primary":{"URL":"https:\/\/link.springer.com\/10.1007\/978-981-97-1277-9_20"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024]]},"ISBN":["9789819712762","9789819712779"],"references-count":14,"URL":"https:\/\/doi.org\/10.1007\/978-981-97-1277-9_20","relation":{},"ISSN":["1865-0929","1865-0937"],"issn-type":[{"type":"print","value":"1865-0929"},{"type":"electronic","value":"1865-0937"}],"subject":[],"published":{"date-parts":[[2024]]},"assertion":[{"value":"3 April 2024","order":1,"name":"first_online","label":"First Online","group":{"name":"ChapterHistory","label":"Chapter History"}},{"value":"IAIC","order":1,"name":"conference_acronym","label":"Conference Acronym","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"International Artificial Intelligence Conference","order":2,"name":"conference_name","label":"Conference Name","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"Nanjing","order":3,"name":"conference_city","label":"Conference City","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"China","order":4,"name":"conference_country","label":"Conference Country","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"2023","order":5,"name":"conference_year","label":"Conference Year","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"24 November 2023","order":7,"name":"conference_start_date","label":"Conference Start Date","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"26 November 2023","order":8,"name":"conference_end_date","label":"Conference End Date","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"iaic2023a","order":10,"name":"conference_id","label":"Conference ID","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"http:\/\/www.iaicconf.com\/","order":11,"name":"conference_url","label":"Conference URL","group":{"name":"ConferenceInfo","label":"Conference Information"}}]}}