{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,27]],"date-time":"2026-02-27T15:54:20Z","timestamp":1772207660819,"version":"3.50.1"},"publisher-location":"Singapore","reference-count":26,"publisher":"Springer Nature Singapore","isbn-type":[{"value":"9789819906161","type":"print"},{"value":"9789819906178","type":"electronic"}],"license":[{"start":{"date-parts":[[2023,1,1]],"date-time":"2023-01-01T00:00:00Z","timestamp":1672531200000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"},{"start":{"date-parts":[[2023,1,1]],"date-time":"2023-01-01T00:00:00Z","timestamp":1672531200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023]]},"DOI":"10.1007\/978-981-99-0617-8_40","type":"book-chapter","created":{"date-parts":[[2023,2,23]],"date-time":"2023-02-23T14:04:57Z","timestamp":1677161097000},"page":"555-569","update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":2,"title":["Surface Defect Detection of Electronic Components Based on FaSB R-CNN"],"prefix":"10.1007","author":[{"given":"Zihao","family":"Zheng","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wenjing","family":"Zhao","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Haodong","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xinying","family":"Xu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"297","published-online":{"date-parts":[[2023,2,24]]},"reference":[{"issue":"6","key":"40_CR1","doi-asserted-by":"publisher","first-page":"1290","DOI":"10.1109\/JPROC.2013.2246531","volume":"101","author":"SY Hui","year":"2013","unstructured":"Hui, S.Y.: Planar wireless charging technology for portable electronic products and Qi. Proc. IEEE 101(6), 1290\u20131301 (2013)","journal-title":"Proc. IEEE"},{"issue":"1","key":"40_CR2","doi-asserted-by":"publisher","first-page":"33","DOI":"10.1109\/TEPM.2004.830501","volume":"27","author":"J Li","year":"2004","unstructured":"Li, J., Shrivastava, P., Zong, G., et al.: Printed circuit board recycling: a state-of-the-art survey. IEEE Trans. Electron. Packag. Manuf. 27(1), 33\u201342 (2004)","journal-title":"IEEE Trans. Electron. Packag. Manuf."},{"issue":"1","key":"40_CR3","doi-asserted-by":"publisher","first-page":"355","DOI":"10.32604\/cmc.2022.017698","volume":"71","author":"J Onshaunjit","year":"2022","unstructured":"Onshaunjit, J., Srinonchat, J.: Algorithmic scheme for concurrent detection and classification of printed circuit board defects. Comput. Mater. Continua 71(1), 355\u2013367 (2022)","journal-title":"Comput. Mater. Continua"},{"issue":"2","key":"40_CR4","doi-asserted-by":"publisher","first-page":"203","DOI":"10.1007\/s10845-008-0074-8","volume":"19","author":"PC Chang","year":"2008","unstructured":"Chang, P.C., Chen, L.Y., Fan, C.Y.: A case-based evolutionary model for defect classification of printed circuit board images. J. Intell. Manuf. 19(2), 203\u2013214 (2008)","journal-title":"J. Intell. Manuf."},{"issue":"3","key":"40_CR5","doi-asserted-by":"publisher","first-page":"97","DOI":"10.1108\/CW-08-2015-0039","volume":"42","author":"SY Wang","year":"2016","unstructured":"Wang, S.Y., Zhao, Y., Wen, L.: PCB welding spot detection with image processing method based on automatic threshold image segmentation algorithm and mathematical morphology. Circuit World 42(3), 97\u2013103 (2016)","journal-title":"Circuit World"},{"issue":"15","key":"40_CR6","doi-asserted-by":"publisher","first-page":"7645","DOI":"10.3390\/app12157645","volume":"12","author":"J Kim","year":"2022","unstructured":"Kim, J., Seo, D., Moon, J.: Design and implementation of an HCPS-based PCB smart factory system for next-generation intelligent manufacturing. Appl. Sci. Basel 12(15), 7645 (2022)","journal-title":"Appl. Sci. Basel"},{"issue":"5","key":"40_CR7","doi-asserted-by":"publisher","first-page":"291","DOI":"10.1108\/SSMT-04-2021-0013","volume":"33","author":"A Sezer","year":"2021","unstructured":"Sezer, A., Altan, A.: Detection of solder paste defects with an optimization-based deep learning model using image processing techniques. Soldering Surf. Mount Technol. 33(5), 291\u2013298 (2021)","journal-title":"Soldering Surf. Mount Technol."},{"issue":"10","key":"40_CR8","doi-asserted-by":"publisher","first-page":"3349","DOI":"10.1109\/TPAMI.2020.2983686","volume":"43","author":"J Wang","year":"2021","unstructured":"Wang, J., Sun, K., Cheng, T., et al.: Deep high-resolution representation learning for visual recognition. IEEE Trans. Pattern Anal. Mach. Intell. 43(10), 3349\u20133364 (2021)","journal-title":"IEEE Trans. Pattern Anal. Mach. Intell."},{"issue":"1","key":"40_CR9","doi-asserted-by":"publisher","first-page":"4","DOI":"10.1109\/TNNLS.2020.2978386","volume":"32","author":"Z Wu","year":"2021","unstructured":"Wu, Z., Pan, S., Chen, F., et al.: A comprehensive survey on graph neural networks. IEEE Trans. Neural Netw. Learn. Syst. 32(1), 4\u201324 (2021)","journal-title":"IEEE Trans. Neural Netw. Learn. Syst."},{"key":"40_CR10","unstructured":"Ren, S., He, K., Girshick, R., et al.: Faster R-CNN: towards real-time object detection with region proposal networks. In: 29th Annual Conference on Neural Information Processing Systems, Montreal, Canada, pp. 770\u2013778 (2016)"},{"issue":"2","key":"40_CR11","doi-asserted-by":"publisher","first-page":"386","DOI":"10.1109\/TPAMI.2018.2844175","volume":"42","author":"K He","year":"2020","unstructured":"He, K., Gkioxari, G., Dollar, P., et al.: Mask R-CNN. IEEE Trans. Pattern Anal. Mach. Intell. 42(2), 386\u2013397 (2020)","journal-title":"IEEE Trans. Pattern Anal. Mach. Intell."},{"issue":"10","key":"40_CR12","doi-asserted-by":"publisher","first-page":"3388","DOI":"10.1109\/TPAMI.2020.2981890","volume":"43","author":"K Oksuz","year":"2020","unstructured":"Oksuz, K., Cam, B., Kalkan, S., Akbas, E.: Imbalance problems in object detection: a review. IEEE Trans. Pattern Anal. Mach. Intel. 43(10), 3388\u20133415 (2020)","journal-title":"IEEE Trans. Pattern Anal. Mach. Intel."},{"issue":"11","key":"40_CR13","doi-asserted-by":"publisher","first-page":"3542","DOI":"10.1016\/j.patcog.2015.04.018","volume":"48","author":"YL Li","year":"2015","unstructured":"Li, Y.L., Wang, S.J., et al.: Feature representation for statistical-learning-based object detection: a review. Pattern Recogn. 48(11), 3542\u20133559 (2015)","journal-title":"Pattern Recogn."},{"issue":"5","key":"40_CR14","doi-asserted-by":"publisher","first-page":"361","DOI":"10.1111\/mice.12263","volume":"32","author":"YJ Cha","year":"2017","unstructured":"Cha, Y.J., Choi, W., Oral, B.: Deep learning-based crack damage detection using convolutional neural networks. Comput. Aided Civil Infrastruct. Eng. 32(5), 361\u2013378 (2017)","journal-title":"Comput. Aided Civil Infrastruct. Eng."},{"issue":"9","key":"40_CR15","doi-asserted-by":"publisher","first-page":"731","DOI":"10.1111\/mice.12334","volume":"33","author":"YJ Cha","year":"2018","unstructured":"Cha, Y.J., Choi, W., Suh, G., et al.: Autonomous structural visual inspection using region-based deep learning for detecting multiple damage types. Comput. Aided Civil Infrastruct. Eng. 33(9), 731\u2013747 (2018)","journal-title":"Comput. Aided Civil Infrastruct. Eng."},{"issue":"4","key":"40_CR16","doi-asserted-by":"publisher","first-page":"1486","DOI":"10.1109\/TSMC.2018.2871750","volume":"50","author":"X Tao","year":"2020","unstructured":"Tao, X., Zhang, D., Wang, Z., Liu, X., et al.: Detection of power line insulator defects using aerial images analyzed with convolutional neural networks. IEEE Trans. Syst. Man Cybern. Syst. 50(4), 1486\u20131498 (2020)","journal-title":"IEEE Trans. Syst. Man Cybern. Syst."},{"issue":"8","key":"40_CR17","doi-asserted-by":"publisher","first-page":"638","DOI":"10.1111\/mice.12367","volume":"33","author":"Y Xue","year":"2018","unstructured":"Xue, Y., Li, Y.: A fast detection method via region-based fully convolutional neural networks for shield tunnel lining defects. Comput. Aided Civil Infrastruct. Eng. 33(8), 638\u2013654 (2018)","journal-title":"Comput. Aided Civil Infrastruct. Eng."},{"issue":"2","key":"40_CR18","doi-asserted-by":"publisher","first-page":"110","DOI":"10.1049\/trit.2019.0019","volume":"4","author":"D Rw","year":"2019","unstructured":"Rw, D., Lh, D., Gp, L., Hong, L.: TDD-Net: a tiny defect detection network for printed circuit boards. CAAI Trans. Intell. Technol. 4(2), 110\u2013116 (2019)","journal-title":"CAAI Trans. Intell. Technol."},{"issue":"2","key":"40_CR19","doi-asserted-by":"publisher","first-page":"257","DOI":"10.1109\/TIM.2017.2775345","volume":"67","author":"JW Chen","year":"2018","unstructured":"Chen, J.W., Liu, Z.G., Wang, H.R., et al.: Automatic defect detection of fasteners on the catenary support device using deep convolutional neural network. IEEE Trans. Instrum. Meas. 67(2), 257\u2013269 (2018)","journal-title":"IEEE Trans. Instrum. Meas."},{"issue":"9","key":"40_CR20","doi-asserted-by":"publisher","first-page":"1678","DOI":"10.3390\/app8091678","volume":"8","author":"YT Li","year":"2018","unstructured":"Li, Y.T., Huang, H.S., Xie, Q.S., et al.: Research on a surface defect detection algorithm based on MobileNet-SSD. Appl. Sci. 8(9), 1678 (2018)","journal-title":"Appl. Sci."},{"issue":"4","key":"40_CR21","doi-asserted-by":"publisher","first-page":"389","DOI":"10.1111\/mice.12500","volume":"35","author":"CB Zhang","year":"2020","unstructured":"Zhang, C.B., Chang, C.C., Jamshidi, M.: Concrete bridge surface damage detection using a single-stage detector. Comput. Aided Civil Infrastruct. Eng. 35(4), 389\u2013409 (2020)","journal-title":"Comput. Aided Civil Infrastruct. Eng."},{"key":"40_CR22","unstructured":"Dai, J.F., Li, Y., He, K.M., Sun, J.: R-FCN: object detection via region-based fully convolutional networks. In: 30th Conference on Neural Information Processing Systems, Barcelona, Spain (2013)"},{"key":"40_CR23","doi-asserted-by":"crossref","unstructured":"Wang, J., Chen, K., Yang, S., et al.: Region proposal by guided anchoring. In: 32nd IEEE Conference on Computer Vision and Pattern Recognition, pp. 2960\u20132969. IEEE Computer SOC, Long Beach, CA (2019)","DOI":"10.1109\/CVPR.2019.00308"},{"key":"40_CR24","doi-asserted-by":"publisher","first-page":"133529","DOI":"10.1109\/ACCESS.2019.2941547","volume":"7","author":"QC Mao","year":"2019","unstructured":"Mao, Q.C., Sun, H.M., Liu, Y.B., et al.: Mini-YOLOv3: real-time object detector for embedded applications. IEEE Access 7, 133529\u2013133538 (2019)","journal-title":"IEEE Access"},{"key":"40_CR25","doi-asserted-by":"crossref","unstructured":"Wei, L., Dragomir, A., Dumitru, E., et al.: SSD: single shot MultiBox detector. In: 14th European Conference on Computer Vision, pp. 21\u201337. Springer-verlag Berlin, Amsterdam, Netherlands (2016)","DOI":"10.1007\/978-3-319-46448-0_2"},{"key":"40_CR26","doi-asserted-by":"crossref","unstructured":"Lin, T.Y., Dollar, P., Girshick, R., et al.: Feature pyramid networks for object detection. In: 30th IEEE Conference on Computer Vision and Pattern Recognition, pp. 936\u2013944, IEEE, Honolulu, HI (2017)","DOI":"10.1109\/CVPR.2017.106"}],"container-title":["Communications in Computer and Information Science","Cognitive Systems and Information Processing"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/978-981-99-0617-8_40","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,5,17]],"date-time":"2023-05-17T12:14:15Z","timestamp":1684325655000},"score":1,"resource":{"primary":{"URL":"https:\/\/link.springer.com\/10.1007\/978-981-99-0617-8_40"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023]]},"ISBN":["9789819906161","9789819906178"],"references-count":26,"URL":"https:\/\/doi.org\/10.1007\/978-981-99-0617-8_40","relation":{},"ISSN":["1865-0929","1865-0937"],"issn-type":[{"value":"1865-0929","type":"print"},{"value":"1865-0937","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023]]},"assertion":[{"value":"24 February 2023","order":1,"name":"first_online","label":"First Online","group":{"name":"ChapterHistory","label":"Chapter History"}},{"value":"ICCSIP","order":1,"name":"conference_acronym","label":"Conference Acronym","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"International Conference on Cognitive Systems and Signal Processing","order":2,"name":"conference_name","label":"Conference Name","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"Fuzhou","order":3,"name":"conference_city","label":"Conference City","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"China","order":4,"name":"conference_country","label":"Conference Country","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"2022","order":5,"name":"conference_year","label":"Conference Year","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"17 December 2022","order":7,"name":"conference_start_date","label":"Conference Start Date","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"18 December 2022","order":8,"name":"conference_end_date","label":"Conference End Date","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"7","order":9,"name":"conference_number","label":"Conference Number","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"iccsip2022","order":10,"name":"conference_id","label":"Conference ID","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"https:\/\/iccsip.fzu.edu.cn\/","order":11,"name":"conference_url","label":"Conference URL","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"Single-blind","order":1,"name":"type","label":"Type","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"EasyChair","order":2,"name":"conference_management_system","label":"Conference Management System","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"121","order":3,"name":"number_of_submissions_sent_for_review","label":"Number of Submissions Sent for Review","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"47","order":4,"name":"number_of_full_papers_accepted","label":"Number of Full Papers Accepted","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"0","order":5,"name":"number_of_short_papers_accepted","label":"Number of Short Papers Accepted","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"39% - The value is computed by the equation \"Number of Full Papers Accepted \/ Number of Submissions Sent for Review * 100\" and then rounded to a whole number.","order":6,"name":"acceptance_rate_of_full_papers","label":"Acceptance Rate of Full Papers","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"3","order":7,"name":"average_number_of_reviews_per_paper","label":"Average Number of Reviews per Paper","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"3","order":8,"name":"average_number_of_papers_per_reviewer","label":"Average Number of Papers per Reviewer","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"Yes","order":9,"name":"external_reviewers_involved","label":"External Reviewers Involved","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}}]}}