{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2022,3,29]],"date-time":"2022-03-29T17:18:01Z","timestamp":1648574281161},"reference-count":22,"publisher":"Springer Science and Business Media LLC","issue":"2","license":[{"start":{"date-parts":[[2011,7,30]],"date-time":"2011-07-30T00:00:00Z","timestamp":1311984000000},"content-version":"tdm","delay-in-days":0,"URL":"http:\/\/www.springer.com\/tdm"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Circuits Syst Signal Process"],"published-print":{"date-parts":[[2012,4]]},"DOI":"10.1007\/s00034-011-9339-0","type":"journal-article","created":{"date-parts":[[2011,7,29]],"date-time":"2011-07-29T15:00:52Z","timestamp":1311951652000},"page":"689-702","source":"Crossref","is-referenced-by-count":3,"title":["Minimization of Via-Induced Signal Reflection in On-Chip High Speed Interconnect Lines"],"prefix":"10.1007","volume":"31","author":[{"given":"K.","family":"Soorya\u00a0Krishna","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"M. S.","family":"Bhat","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"297","published-online":{"date-parts":[[2011,7,30]]},"reference":[{"key":"9339_CR1","first-page":"657","volume-title":"IEEE International Electron Devices Meeting","author":"P. Bai","year":"2005","unstructured":"P. Bai, C. Auth, S. Balakrishnan, M. Bost, R. Brain, V. Chikarmane, R.\u00a0Heussner, M.\u00a0Hussein, J.\u00a0Hwang, D.\u00a0Ingerly et al., A\u00a065\u00a0nm logic technology featuring 35\u00a0nm gate lengths, enhanced channel strain, 8\u00a0Cu interconnect layers, low k ILD and 0.57\u00a0\u03bc2 SRAM cell, in IEEE International Electron Devices Meeting (2005), pp.\u00a0657\u2013660"},{"key":"9339_CR2","first-page":"262","volume-title":"9th Electronics Packaging Technology Conference","author":"R.W.Y. Chang","year":"2007","unstructured":"R.W.Y. Chang, K.Y. See, E.K. Chua, Comprehensive analysis of the impact of via design on high-speed signal integrity, in 9th Electronics Packaging Technology Conference (2007), pp.\u00a0262\u2013266"},{"issue":"3","key":"9339_CR3","first-page":"818","volume":"51","author":"H. Chen","year":"2003","unstructured":"H. Chen, Q. Li, L. Tsang, C.C. Huang, V. Jandhyala, Analysis of a large number of vias and differential signaling in multilayered structures. IEEE Trans. Adv. Packag. 51(3), 818\u2013829 (2003)","journal-title":"IEEE Trans. Adv. Packag."},{"issue":"2","key":"9339_CR4","doi-asserted-by":"crossref","first-page":"206","DOI":"10.1109\/22.216458","volume":"41","author":"Q. Gu","year":"2002","unstructured":"Q. Gu, Y.E. Yang, M.A. Tassoudji, Modeling and analysis of vias in multilayered integrated circuits. IEEE Trans. Microw. Theory Tech. 41(2), 206\u2013214 (2002)","journal-title":"IEEE Trans. Microw. Theory Tech."},{"key":"9339_CR5","doi-asserted-by":"crossref","DOI":"10.1002\/9780470423899","volume-title":"Advanced Signal Integrity for High-Speed Digital Designs","author":"S.H. Hall","year":"2009","unstructured":"S.H. Hall, H.L. Heck, Advanced Signal Integrity for High-Speed Digital Designs (Wiley, New York, 2009)"},{"key":"9339_CR6","volume-title":"High Speed Digital System Design: A\u00a0Handbook of Interconnect Theory and Design Practices","author":"S.H. Hall","year":"2000","unstructured":"S.H. Hall, G.W. Hall, J.A. McCall, High Speed Digital System Design: A\u00a0Handbook of Interconnect Theory and Design Practices (Wiley, New York, 2000)"},{"issue":"1","key":"9339_CR7","doi-asserted-by":"crossref","first-page":"211","DOI":"10.1109\/TADVP.2007.908033","volume":"31","author":"K.T. Hsu","year":"2008","unstructured":"K.T. Hsu, G.H. Shiue, C.M. Lin, T.W. Huang, R.B. Wu, Design of reflectionless vias using neural network-based approach. IEEE Trans. Adv. Packag. 31(1), 211\u2013218 (2008)","journal-title":"IEEE Trans. Adv. Packag."},{"issue":"5","key":"9339_CR8","doi-asserted-by":"crossref","first-page":"446","DOI":"10.1002\/mop.21013","volume":"46","author":"C.C. Huang","year":"2005","unstructured":"C.C. Huang, K.L. Lai, L. Tsang, X. Gu, C.J. Ong, Transmission and scattering on interconnects with via structures. Microw. Opt. Technol. Lett. 46(5), 446\u2013452 (2005)","journal-title":"Microw. Opt. Technol. Lett."},{"key":"9339_CR9","unstructured":"Interconnect Technology 2007 Report, http:\/\/itrs.net\/Interconnect.pdf"},{"issue":"1","key":"9339_CR10","doi-asserted-by":"crossref","first-page":"256","DOI":"10.1109\/TED.2009.2034508","volume":"57","author":"G. Katti","year":"2009","unstructured":"G. Katti, M. Stucchi, K. De Meyer, W. Dehaene, Electrical modeling and characterization of through silicon via for three-dimensional ICs. IEEE Trans. Electron Devices 57(1), 256\u2013262 (2009)","journal-title":"IEEE Trans. Electron Devices"},{"key":"9339_CR11","first-page":"1378","volume-title":"Proceedings of the Electronic Components and Technology Conference","author":"Y.W. Kim","year":"2005","unstructured":"Y.W. Kim, J.H. Kim, H.W. Yang, O.K. Kwon, C. Ryu, B.Y. Min, A new via hole structure of MLB (multi-layered printed circuit board) for RF and high speed systems, in Proceedings of the Electronic Components and Technology Conference (2005), pp. 1378\u20131382"},{"issue":"7","key":"9339_CR12","doi-asserted-by":"crossref","first-page":"1229","DOI":"10.1109\/22.85393","volume":"39","author":"P. Kok","year":"2002","unstructured":"P. Kok, D. De Zutter, Capacitance of a circular symmetric model of a via hole including finite ground plane thickness. IEEE Trans. Microw. Theory Tech. 39(7), 1229\u20131234 (2002)","journal-title":"IEEE Trans. Microw. Theory Tech."},{"issue":"7","key":"9339_CR13","doi-asserted-by":"crossref","first-page":"1229","DOI":"10.1109\/22.299761","volume":"42","author":"P.A. Kok","year":"2002","unstructured":"P.A. Kok, D. De Zutter, Scalar magnetostatic potential approach to the prediction of the excess inductance of grounded vias and vias through a hole in a ground plane. IEEE Trans. Microw. Theory Tech. 42(7), 1229\u20131237 (2002)","journal-title":"IEEE Trans. Microw. Theory Tech."},{"issue":"2","key":"9339_CR14","doi-asserted-by":"crossref","first-page":"483","DOI":"10.1109\/TCAPT.2003.815119","volume":"26","author":"D.H. Kwon","year":"2003","unstructured":"D.H. Kwon, J. Kim, K.H. Kim, S.C. Choi, J.H. Lim, J.H. Park, L. Choi, S.W. Hwang, S.H. Lee, Characterization and modeling of a new via structure in multilayered printed circuit boards. IEEE Trans. Compon. Packag. Technol. 26(2), 483\u2013489 (2003)","journal-title":"IEEE Trans. Compon. Packag. Technol."},{"issue":"2","key":"9339_CR15","doi-asserted-by":"crossref","first-page":"206","DOI":"10.1109\/TADVP.2002.803310","volume":"25","author":"E. Laermans","year":"2002","unstructured":"E. Laermans, J. De Geest, D. De Zutter, F. Olyslager, S. Sercu, D. Morlion, Modeling complex via hole structures. IEEE Trans. Adv. Packag. 25(2), 206\u2013214 (2002)","journal-title":"IEEE Trans. Adv. Packag."},{"issue":"7","key":"9339_CR16","doi-asserted-by":"crossref","first-page":"1724","DOI":"10.1109\/TMTT.2009.2022883","volume":"57","author":"E.X. Liu","year":"2009","unstructured":"E.X. Liu, E.P. Li, Z.Z. Oo, X. Wei, Y. Zhang, R. Vahldieck, Novel methods for modeling of multiple vias in multilayered parallel-plate structures. IEEE Trans. Microw. Theory Tech. 57(7), 1724\u20131733 (2009)","journal-title":"IEEE Trans. Microw. Theory Tech."},{"issue":"12","key":"9339_CR17","doi-asserted-by":"crossref","first-page":"2154","DOI":"10.1109\/22.106558","volume":"39","author":"S. Maeda","year":"2002","unstructured":"S. Maeda, T. Kashiwa, I. Fukai, Full wave analysis of propagation characteristics of a through hole using the finite-difference time-domain method. IEEE Trans. Microw. Theory Tech. 39(12), 2154\u20132159 (2002)","journal-title":"IEEE Trans. Microw. Theory Tech."},{"issue":"6","key":"9339_CR18","doi-asserted-by":"crossref","first-page":"770","DOI":"10.1109\/22.130973","volume":"38","author":"T. Onojima","year":"2002","unstructured":"T. Onojima, T. Kashiwa, N. Yoshida, I. Fukai, Three-dimensional analysis of a through hole with radiation characteristics by the spatial network method. IEEE Trans. Microw. Theory Tech. 38(6), 770\u2013778 (2002)","journal-title":"IEEE Trans. Microw. Theory Tech."},{"issue":"1","key":"9339_CR19","doi-asserted-by":"crossref","first-page":"21","DOI":"10.1109\/22.3477","volume":"36","author":"J.P. Quine","year":"2002","unstructured":"J.P. Quine, H.F. Webster, H.H. Glascock, R.O. Carlson, Characterization of via connections in silicon circuit boards. IEEE Trans. Microw. Theory Tech. 36(1), 21\u201327 (2002)","journal-title":"IEEE Trans. Microw. Theory Tech."},{"key":"9339_CR20","volume-title":"Basics of CMOS Cell Design","author":"E. Sicard","year":"2007","unstructured":"E. Sicard, S.D. Bendhia, Basics of CMOS Cell Design (McGraw-Hill, New York, 2007)"},{"issue":"6","key":"9339_CR21","doi-asserted-by":"crossref","first-page":"1008","DOI":"10.1109\/22.3626","volume":"36","author":"T. Wang","year":"2002","unstructured":"T. Wang, R.F. Harrington, J.R. Mautz, Quasi-static analysis of a microstrip via through a hole in a ground plane. IEEE Trans. Microw. Theory Tech. 36(6), 1008\u20131013 (2002)","journal-title":"IEEE Trans. Microw. Theory Tech."},{"issue":"1","key":"9339_CR22","doi-asserted-by":"crossref","first-page":"12","DOI":"10.1109\/LMWC.2008.2008532","volume":"19","author":"B. Wu","year":"2009","unstructured":"B. Wu, L. Tsang, Modeling multiple vias with arbitrary shape of antipads and pads in high speed interconnect circuits. IEEE Microw. Wirel. Compon. Lett. 19(1), 12\u201314 (2009)","journal-title":"IEEE Microw. Wirel. Compon. Lett."}],"container-title":["Circuits, Systems, and Signal Processing"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/s00034-011-9339-0.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/link.springer.com\/article\/10.1007\/s00034-011-9339-0\/fulltext.html","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/s00034-011-9339-0","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,5,22]],"date-time":"2019-05-22T15:01:35Z","timestamp":1558537295000},"score":1,"resource":{"primary":{"URL":"http:\/\/link.springer.com\/10.1007\/s00034-011-9339-0"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2011,7,30]]},"references-count":22,"journal-issue":{"issue":"2","published-print":{"date-parts":[[2012,4]]}},"alternative-id":["9339"],"URL":"https:\/\/doi.org\/10.1007\/s00034-011-9339-0","relation":{},"ISSN":["0278-081X","1531-5878"],"issn-type":[{"value":"0278-081X","type":"print"},{"value":"1531-5878","type":"electronic"}],"subject":[],"published":{"date-parts":[[2011,7,30]]}}}