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Such anomalies in the heat transfer of the printing process need to be detected at an early stage. Understanding heat transfer is crucial, and simulation models can offer insights while reducing the need for costly experiments. Traditional numerical solvers for heat transfer can be complex to adapt to diverse printed part geometries, and their reliance on predefined mathematical models limits their flexibility. Our physics-informed deep learning (PIDL) approach eliminates the need for discretization, simplifying the analysis of complex geometries and enabling automation. The drawback of parametric PIDL is their scalability for high-dimensional problems. Computational time, energy and cost of training prevent real-time analysis. It often takes only a few seconds to print a single layer. We can show an energy efficient transfer and training strategy to reduce the computational effort of PIDL significantly. The approach is able to quantify relevant effects of thermal stresses and mitigate errors during selective laser melting (SLM). To this end, heat transfer is modelled, simulated and analysed using high-dimensional data obtained from printing experiments with different geometries of metal components. The proposed method is applied to the solving forward problem of heat transfer prediction. The governing results are based on the heat equation, which is integrated into a deep neural network (DNN).<\/jats:p>","DOI":"10.1007\/s10489-024-05402-4","type":"journal-article","created":{"date-parts":[[2024,4,3]],"date-time":"2024-04-03T10:02:07Z","timestamp":1712138527000},"page":"4736-4755","update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":18,"title":["Physics-informed deep learning to quantify anomalies for real-time fault mitigation in 3D printing"],"prefix":"10.1007","volume":"54","author":[{"ORCID":"https:\/\/orcid.org\/0009-0000-1902-9362","authenticated-orcid":false,"given":"Benjamin","family":"Uhrich","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Nils","family":"Pfeifer","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Martin","family":"Sch\u00e4fer","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Oliver","family":"Theile","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Erhard","family":"Rahm","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"297","published-online":{"date-parts":[[2024,4,3]]},"reference":[{"key":"5402_CR1","doi-asserted-by":"publisher","first-page":"107552","DOI":"10.1016\/j.matdes.2018.107552","volume":"164","author":"S Liu","year":"2019","unstructured":"Liu S, Shin YC (2019) Additive manufacturing of Ti6Al4V alloy: a review. 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