{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2023,4,16]],"date-time":"2023-04-16T01:07:42Z","timestamp":1681607262232},"reference-count":13,"publisher":"Springer Science and Business Media LLC","issue":"1","license":[{"start":{"date-parts":[[2014,11,19]],"date-time":"2014-11-19T00:00:00Z","timestamp":1416355200000},"content-version":"tdm","delay-in-days":0,"URL":"http:\/\/www.springer.com\/tdm"}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":["J Electron Test"],"published-print":{"date-parts":[[2015,2]]},"DOI":"10.1007\/s10836-014-5495-z","type":"journal-article","created":{"date-parts":[[2014,11,21]],"date-time":"2014-11-21T12:45:47Z","timestamp":1416573947000},"page":"107-117","update-policy":"http:\/\/dx.doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":1,"title":["Improving Semiconductor Reliability with Advanced Engineering Methods in Test Program Development"],"prefix":"10.1007","volume":"31","author":[{"given":"Stefan","family":"Vock","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Omar","family":"Escalona","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Colin","family":"Turner","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"297","published-online":{"date-parts":[[2014,11,19]]},"reference":[{"issue":"11","key":"5495_CR1","doi-asserted-by":"crossref","first-page":"2143","DOI":"10.1109\/TVLSI.2011.2168433","volume":"20","author":"X Chen","year":"2012","unstructured":"Chen X, Wang Y, Cao Y, Ma Y, Yang H (2012) Variation-aware supply voltage assignment for simultaneous power and aging optimization. IEEE Trans Very Large Scale Integration (VLSI) Syst 20(11):2143\u20132147","journal-title":"IEEE Trans Very Large Scale Integration (VLSI) Syst"},{"issue":"12","key":"5495_CR2","doi-asserted-by":"crossref","first-page":"2214","DOI":"10.1109\/TVLSI.2012.2228886","volume":"21","author":"S Han","year":"2013","unstructured":"Han S, Kim B-S, Kim J (2013) Variation-aware aging analysis in digital ICs. IEEE Trans Very Large Scale Integration (VLSI) Syst 21(12):2214\u20132225","journal-title":"IEEE Trans Very Large Scale Integration (VLSI) Syst"},{"key":"5495_CR3","unstructured":"Infineon Technologies AG (2014) Company home webpage, viewed June 2014, < http:\/\/www.infineon.com\/cms\/en\/product\/index.html >"},{"key":"5495_CR4","unstructured":"ITRS (2013) International Technology Roadmap for Semiconductors 2013 Edition, viewed June 2014, < http:\/\/public.itrs.net\/ >"},{"issue":"4","key":"5495_CR5","doi-asserted-by":"crossref","first-page":"701","DOI":"10.1109\/TR.2011.2161051","volume":"60","author":"S-L Jeng","year":"2011","unstructured":"Jeng S-L, Huang B-Y, Meeker WQ (2011) Accelerated destructive degradation tests robust to distribution misspecification. IEEE Trans Reliab 60(4):701\u2013711","journal-title":"IEEE Trans Reliab"},{"key":"5495_CR6","doi-asserted-by":"crossref","unstructured":"Journal of Electronic Testing (2012) Special Issue on Testing of Three-Dimensional Stacked Integrated Circuits, 28(1)","DOI":"10.1007\/s10836-012-5279-2"},{"key":"5495_CR7","doi-asserted-by":"crossref","unstructured":"Meeker WQ (2010) Trends in the Statistical Assessment of Reliability, in Advances in Degradation Modeling, Statistics for Industry and Technology. In: Nikulin MS et al (ed) Springer","DOI":"10.1007\/978-0-8176-4924-1_1"},{"key":"5495_CR8","unstructured":"Nahar A, Butler KM, Carulli JM, Weinberger, C (2009) Quality improvement and cost reduction using statistical outlier methods, Proc. IEEE International Conference on Computer Design, pp. 64\u201369"},{"issue":"1","key":"5495_CR9","doi-asserted-by":"crossref","first-page":"29","DOI":"10.1109\/TVLSI.2010.2093938","volume":"20","author":"A Nourivand","year":"2012","unstructured":"Nourivand A, Al-Khalili AJ, Savaria Y (2012) Postsilicon tuning of standby supply voltage in SRAMs to reduce yield losses Due to parametric data-retention failures. IEEE Trans Very Large Scale Integration (VLSI) Syst 20(1):29\u201341","journal-title":"IEEE Trans Very Large Scale Integration (VLSI) Syst"},{"issue":"7","key":"5495_CR10","doi-asserted-by":"crossref","first-page":"925","DOI":"10.1016\/j.microrel.2013.03.011","volume":"53","author":"E Suhir","year":"2013","unstructured":"Suhir E (2013) Could electronics reliability be predicted, quantified and assured? Microelectron Reliab 53(7):925\u2013936, ISSN 0026\u20132714","journal-title":"Microelectron Reliab"},{"issue":"3","key":"5495_CR11","doi-asserted-by":"crossref","first-page":"365","DOI":"10.1007\/s10836-011-5276-x","volume":"28","author":"S Vock","year":"2012","unstructured":"Vock S, Escalona O, Turner C, Owens F (2012) Challenges for semiconductor test engineering: a review paper. J Electron Test Theory Appl 28(3):365\u2013374","journal-title":"J Electron Test Theory Appl"},{"key":"5495_CR12","author":"S Vock","year":"2014","unstructured":"Vock S, Escalona O, Turner C, Owens F (2014) The Use of software engineering methods for efficacious test program creation: a supportive evidence based case study. J Electron Test Theory Appl. doi: 10.1007\/s10836-014-5462-8","journal-title":"J Electron Test Theory Appl"},{"key":"5495_CR13","unstructured":"Vock S, Escalona OJ, Owens FJ (2010) Commercial Challenges and Quality Robustness Issue in Semiconductor Manufacture Test and Measurement, Proc. 27th International Manufacturing Conference, Galway Institute of Technology, < http:\/\/eprints.ulster.ac.uk >"}],"container-title":["Journal of Electronic Testing"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/s10836-014-5495-z.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/link.springer.com\/article\/10.1007\/s10836-014-5495-z\/fulltext.html","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/s10836-014-5495-z","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,8,17]],"date-time":"2019-08-17T17:32:51Z","timestamp":1566063171000},"score":1,"resource":{"primary":{"URL":"http:\/\/link.springer.com\/10.1007\/s10836-014-5495-z"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,11,19]]},"references-count":13,"journal-issue":{"issue":"1","published-print":{"date-parts":[[2015,2]]}},"alternative-id":["5495"],"URL":"https:\/\/doi.org\/10.1007\/s10836-014-5495-z","relation":{},"ISSN":["0923-8174","1573-0727"],"issn-type":[{"value":"0923-8174","type":"print"},{"value":"1573-0727","type":"electronic"}],"subject":[],"published":{"date-parts":[[2014,11,19]]}}}