{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,30]],"date-time":"2026-04-30T16:59:22Z","timestamp":1777568362651,"version":"3.51.4"},"reference-count":21,"publisher":"Springer Science and Business Media LLC","issue":"3","license":[{"start":{"date-parts":[[2009,7,30]],"date-time":"2009-07-30T00:00:00Z","timestamp":1248912000000},"content-version":"tdm","delay-in-days":0,"URL":"http:\/\/www.springer.com\/tdm"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["J Intell Manuf"],"published-print":{"date-parts":[[2011,6]]},"DOI":"10.1007\/s10845-009-0298-2","type":"journal-article","created":{"date-parts":[[2009,7,29]],"date-time":"2009-07-29T15:12:11Z","timestamp":1248880331000},"page":"399-412","source":"Crossref","is-referenced-by-count":47,"title":["UNISON analysis to model and reduce step-and-scan overlay errors for semiconductor manufacturing"],"prefix":"10.1007","volume":"22","author":[{"given":"Chen-Fu","family":"Chien","sequence":"first","affiliation":[]},{"given":"Chia-Yu","family":"Hsu","sequence":"additional","affiliation":[]}],"member":"297","published-online":{"date-parts":[[2009,7,30]]},"reference":[{"key":"298_CR1","doi-asserted-by":"crossref","first-page":"424","DOI":"10.1117\/12.953171","volume":"1088","author":"J. D. Buckley","year":"1989","unstructured":"Buckley J. D., Karatzas C. (1989) Step and scan: A system overview of a new lithography tool. Proceedings of SPIE: Optical\/Laser Microlithography II 1088: 424\u2013433","journal-title":"Proceedings of SPIE: Optical\/Laser Microlithography II"},{"issue":"11","key":"298_CR2","doi-asserted-by":"crossref","first-page":"2547","DOI":"10.1080\/0020754031000087256","volume":"41","author":"C.-F. Chien","year":"2003","unstructured":"Chien C.-F., Chang K.-H., Chen C.-P. (2003) Design of a sampling strategy for measuring and compensating for overlay errors in semiconductor manufacturing. International Journal of Production Research 41(11): 2547\u20132561","journal-title":"International Journal of Production Research"},{"issue":"4","key":"298_CR3","doi-asserted-by":"crossref","first-page":"429","DOI":"10.1007\/s10845-005-0016-7","volume":"17","author":"C.-F. Chien","year":"2006","unstructured":"Chien C.-F., Hsu C.-Y. (2006) A novel method for determining machine subgroups and backups with an empirical study for semiconductor manufacturing. Journal of Intelligent Manufacturing 17(4): 429\u2013440","journal-title":"Journal of Intelligent Manufacturing"},{"issue":"1","key":"298_CR4","doi-asserted-by":"crossref","first-page":"20","DOI":"10.1016\/j.ijpe.2006.03.010","volume":"107","author":"C.-F. Chien","year":"2007","unstructured":"Chien C.-F., Wang H.-J., Wang M. (2007) A UNISON framework for analyzing alternative strategies of IC final testing for enhancing overall operational effectiveness. International Journal of Production Economics 107(1): 20\u201330","journal-title":"International Journal of Production Economics"},{"issue":"4","key":"298_CR5","doi-asserted-by":"crossref","first-page":"704","DOI":"10.1109\/TSM.2003.818955","volume":"16","author":"C.-F. Chien","year":"2003","unstructured":"Chien C.-F., Wu J.-Z. (2003) Analyzing repair decisions in the site imbalance problem of semiconductor test machines. IEEE Transactions on Semiconductor Manufacturing 16(4): 704\u2013711","journal-title":"IEEE Transactions on Semiconductor Manufacturing"},{"key":"298_CR6","doi-asserted-by":"crossref","first-page":"932","DOI":"10.1117\/12.175485","volume":"2197","author":"D. J. Cronin","year":"1994","unstructured":"Cronin D. J., Gallatin G. M. (1994) Micrascan II overlay error analysis. Proceedings of SPIE: Optical\/Laser Microlithography VII 2197: 932\u2013942","journal-title":"Proceedings of SPIE: Optical\/Laser Microlithography VII"},{"key":"298_CR7","doi-asserted-by":"crossref","first-page":"389","DOI":"10.1117\/12.174141","volume":"2196","author":"D. Fink","year":"1994","unstructured":"Fink D., Sullivan N. T., Lekas J. S. (1994) Overlay sample plan optimization for the detection of higher order contributions to misalignment. Proceedings of SPIE: Integrated Circuit Metrology, Inspection, and Process Control VIII 2196: 389\u2013399","journal-title":"Proceedings of SPIE: Integrated Circuit Metrology, Inspection, and Process Control VIII"},{"key":"298_CR8","doi-asserted-by":"crossref","first-page":"7164","DOI":"10.1143\/JJAP.38.7164","volume":"38","author":"J. Hong","year":"1999","unstructured":"Hong J., Lee J., Park J., Cho H., Moon J. (1999) Optimization of sample plan for overlay and alignment accuracy improvement. Japanese Journal of Applied Physics 38: 7164\u20137167","journal-title":"Japanese Journal of Applied Physics"},{"issue":"4","key":"298_CR9","doi-asserted-by":"crossref","first-page":"501","DOI":"10.1109\/TASE.2007.906142","volume":"4","author":"R. Leachman","year":"2007","unstructured":"Leachman R., Ding S., Chien C.-F. (2007) Economic efficiency analysis of wafer fabrication. IEEE Transactions on Automation Science and Engineering 4(4): 501\u2013512","journal-title":"IEEE Transactions on Automation Science and Engineering"},{"key":"298_CR10","doi-asserted-by":"crossref","first-page":"362","DOI":"10.1117\/12.275996","volume":"3051","author":"H. J. Levinson","year":"1997","unstructured":"Levinson H. J., Preil M. E., Lord P. J. (1997) Minimization of total overlay errors on product wafers using an advanced optimization scheme. Proceedings of SPIE: Optical Microlithography X 3051: 362\u2013373","journal-title":"Proceedings of SPIE: Optical Microlithography X"},{"issue":"2","key":"298_CR11","doi-asserted-by":"crossref","first-page":"229","DOI":"10.1109\/66.762881","volume":"12","author":"Z.-C. Lin","year":"1999","unstructured":"Lin Z.-C., Wu W.-J. (1999) Multiple linear regression analysis of the overlay accuracy model. IEEE Transaction on Semiconductor Manufacturing 12(2): 229\u2013237","journal-title":"IEEE Transaction on Semiconductor Manufacturing"},{"key":"298_CR12","doi-asserted-by":"crossref","first-page":"78","DOI":"10.1117\/12.933563","volume":"334","author":"D. MacMillen","year":"1982","unstructured":"MacMillen D., Ryden W. D. (1982) Analysis of image field placement deviations of a 5\u00a0\u00d7 microlithographic reduction lens. Proceedings of SPIE: Optical Microlithography-Technology 334: 78\u201389","journal-title":"Proceedings of SPIE: Optical Microlithography-Technology"},{"key":"298_CR13","volume-title":"Design and analysis of experiments","author":"D. C. Montgomery","year":"2001","unstructured":"Montgomery D. C. (2001) Design and analysis of experiments. Wiley, New York"},{"key":"298_CR14","doi-asserted-by":"crossref","first-page":"72","DOI":"10.1117\/12.350780","volume":"3677","author":"J. C. Pellegrini","year":"1999","unstructured":"Pellegrini J. C., Hatab Z. R., Brsh M., Glass T. R. (1999) Super sparse overlay sampling plans: An evaluation of methods and algorithms for optimizing overlay quality control and metrology tool throughput. Proceedings of SPIE: Metrology, Inspection, and Process Control for Microlithography XIII 3677: 72\u201382","journal-title":"Proceedings of SPIE: Metrology, Inspection, and Process Control for Microlithography XIII"},{"key":"298_CR15","doi-asserted-by":"crossref","first-page":"348","DOI":"10.1117\/12.308743","volume":"3332","author":"B. Rangarajan","year":"1998","unstructured":"Rangarajan B., Templeton M., Capodieci L., Subramanian R., Scranton A. (1998) Optimal sampling strategies for sub-100\u00a0nm overlay. Proceedings of SPIE: Metrology, Inspection, and Process Control for Microlithography XII 3332: 348\u2013359","journal-title":"Proceedings of SPIE: Metrology, Inspection, and Process Control for Microlithography XII"},{"key":"298_CR16","doi-asserted-by":"crossref","first-page":"448","DOI":"10.1117\/12.354357","volume":"3679","author":"J. V. Schoot","year":"1999","unstructured":"Schoot J. V., Bornebroek F., Suddendorf M., Mulder M., van der Spek J., Stoeten J., Hunter A. (1999) 0.7 NA DUV step & scan system for 150\u00a0nm imaging with improved overlay. Proceedings of SPIE: Optical Microlithography XII 3679: 448\u2013463","journal-title":"Proceedings of SPIE: Optical Microlithography XII"},{"key":"298_CR17","doi-asserted-by":"crossref","first-page":"49","DOI":"10.1117\/12.209256","volume":"2440","author":"H. Sewell","year":"1994","unstructured":"Sewell H. (1994) Step and scan: The maturing technology. Proceedings SPIE: Optical\/Laser Microlithography VIII 2440: 49\u201360","journal-title":"Proceedings SPIE: Optical\/Laser Microlithography VIII"},{"key":"298_CR18","doi-asserted-by":"crossref","first-page":"180","DOI":"10.1117\/12.968366","volume":"921","author":"M. A. Brink van den","year":"1988","unstructured":"van den Brink M. A., de Mol C. G. M., George R. A. (1988) Matching performance for multiple wafer steppers using an advanced metrology procedure. Proceedings SPIE: Integrated Circuit Metrology, Inspection, and Process Control II 921: 180\u2013197","journal-title":"Proceedings SPIE: Integrated Circuit Metrology, Inspection, and Process Control II"},{"key":"298_CR19","doi-asserted-by":"crossref","first-page":"734","DOI":"10.1117\/12.240936","volume":"2726","author":"M. Brink van den","year":"1996","unstructured":"van den Brink M., Jasper H., Slonaker S., Wijnhoven P., Klaassen F. (1996) Step-and-scan and step-and-repeat: A technology comparison. Proceedings of SPIE: Optical Microlithography IX 2726: 734\u2013753","journal-title":"Proceedings of SPIE: Optical Microlithography IX"},{"issue":"3","key":"298_CR20","doi-asserted-by":"crossref","first-page":"401","DOI":"10.1007\/s00291-007-0120-5","volume":"30","author":"J.-Z. Wu","year":"2008","unstructured":"Wu J.-Z., Chien C.-F. (2008) Modeling strategic semiconductor assembly outsourcing decisions based on empirical settings. OR Spectrum 30(3): 401\u2013430","journal-title":"OR Spectrum"},{"key":"298_CR21","doi-asserted-by":"crossref","first-page":"817","DOI":"10.1117\/12.276002","volume":"3051","author":"G. Zwart","year":"1997","unstructured":"Zwart G., van den Brink M., George R., Satriasaputra D., Baselmans J., Butler H., van Schoot J., de Klerk J. (1997) Performance of a step and scan system for DUV lithography. Proceedings of SPIE: Optical Microlithography X 3051: 817\u2013829","journal-title":"Proceedings of SPIE: Optical Microlithography X"}],"container-title":["Journal of Intelligent Manufacturing"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/s10845-009-0298-2.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/link.springer.com\/article\/10.1007\/s10845-009-0298-2\/fulltext.html","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/s10845-009-0298-2","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,5,31]],"date-time":"2019-05-31T02:11:45Z","timestamp":1559268705000},"score":1,"resource":{"primary":{"URL":"http:\/\/link.springer.com\/10.1007\/s10845-009-0298-2"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,7,30]]},"references-count":21,"journal-issue":{"issue":"3","published-print":{"date-parts":[[2011,6]]}},"alternative-id":["298"],"URL":"https:\/\/doi.org\/10.1007\/s10845-009-0298-2","relation":{},"ISSN":["0956-5515","1572-8145"],"issn-type":[{"value":"0956-5515","type":"print"},{"value":"1572-8145","type":"electronic"}],"subject":[],"published":{"date-parts":[[2009,7,30]]}}}