{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2022,8,24]],"date-time":"2022-08-24T18:25:29Z","timestamp":1661365529275},"reference-count":23,"publisher":"Springer Science and Business Media LLC","issue":"3","license":[{"start":{"date-parts":[[2010,2,13]],"date-time":"2010-02-13T00:00:00Z","timestamp":1266019200000},"content-version":"tdm","delay-in-days":0,"URL":"http:\/\/www.springer.com\/tdm"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["J Intell Manuf"],"published-print":{"date-parts":[[2012,6]]},"DOI":"10.1007\/s10845-010-0383-6","type":"journal-article","created":{"date-parts":[[2010,2,12]],"date-time":"2010-02-12T09:28:54Z","timestamp":1265966934000},"page":"443-455","source":"Crossref","is-referenced-by-count":6,"title":["Advanced semiconductor fabrication process control using dual filter exponentially weighted moving average"],"prefix":"10.1007","volume":"23","author":[{"given":"Hyo-Heon","family":"Ko","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jihyun","family":"Kim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sang-Hoon","family":"Park","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jun-Geol","family":"Baek","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sung-Shick","family":"Kim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"297","published-online":{"date-parts":[[2010,2,13]]},"reference":[{"issue":"1","key":"383_CR1","doi-asserted-by":"crossref","first-page":"55","DOI":"10.1007\/s10845-008-0103-7","volume":"20","author":"S. Bassetto","year":"2009","unstructured":"Bassetto S., Siadat A. (2009) Operational methods for improving manufacturing control plans: Case study in a semiconductor industry. Journal of intelligent manufacturing 20(1): 55\u201365","journal-title":"Journal of intelligent manufacturing"},{"issue":"7","key":"383_CR2","doi-asserted-by":"crossref","first-page":"893","DOI":"10.1016\/S0967-0661(03)00154-0","volume":"12","author":"C. A. Bode","year":"2004","unstructured":"Bode C. A., Ko B. S., Edgar T. F. (2004) Run-to-run control and performance monitoring of overlay in semiconductor manufacturing. Control Engineering Practice 12(7): 893\u2013900","journal-title":"Control Engineering Practice"},{"key":"383_CR3","doi-asserted-by":"crossref","unstructured":"Boning, D., Moyne, W., Smith, T., Moyne, J., & Hurwitz, A. (1995). Practical Issues in Run Process Control. In Proceedings of the sixth annual SEMI\/IEEE ASMC, Boston.","DOI":"10.1109\/ASMC.1995.484371"},{"key":"383_CR4","first-page":"943","volume":"34","author":"G. E. P. Box","year":"1963","unstructured":"Box G. E. P., Jenkins G. M. (1963) Future contributions to adaptive quality control: Simultaneous estimation of dynamics: Nonzero Costs. Bulletin of the International Statistical Institute 34: 943\u2013974","journal-title":"Bulletin of the International Statistical Institute"},{"key":"383_CR5","volume-title":"Statistical control by monitoring and feedback adjustment","author":"G. E. P. Box","year":"1997","unstructured":"Box G. E. P., Luce\u00f1o S. (1997) Statistical control by monitoring and feedback adjustment. Wiley-Interscience, New York"},{"issue":"2","key":"383_CR6","doi-asserted-by":"crossref","first-page":"193","DOI":"10.1109\/66.286855","volume":"7","author":"S. W. Butler","year":"1994","unstructured":"Butler S. W., Stefani J. A. (1994) Supervisory run-to-run control of a polysilicon gate etch using in situ ellipsometry. IEEE Transactions on Semiconductor Manufacturing 7(2): 193\u2013201","journal-title":"IEEE Transactions on Semiconductor Manufacturing"},{"issue":"3","key":"383_CR7","doi-asserted-by":"crossref","first-page":"379","DOI":"10.1023\/A:1024657911399","volume":"14","author":"C.-C. Chiu","year":"2003","unstructured":"Chiu C.-C., Shao Y. E., Lee T.-S. (2003) Identification of process disturbance using SPC\/EPC and neural networks. Journal of intelligent manufacturing 14(3): 379\u2013388","journal-title":"Journal of intelligent manufacturing"},{"issue":"2","key":"383_CR8","doi-asserted-by":"crossref","first-page":"184","DOI":"10.1080\/00224065.1997.11979749","volume":"29","author":"E. Del Castillo","year":"1997","unstructured":"Del Castillo E., Hurwitz A. (1997) Run-to-run process control; literature review and extensions. Journal of Quality Technology 29(2): 184\u2013185","journal-title":"Journal of Quality Technology"},{"issue":"2","key":"383_CR9","doi-asserted-by":"crossref","first-page":"285","DOI":"10.1109\/66.670178","volume":"11","author":"E. Del Castillo","year":"1998","unstructured":"Del Castillo E., Yeh J. Y. (1998) An adaptive run-to-run optimizing controller for linear and nonlinear semiconductor processes. IEEE Transactions on Semi-conductor Manufacturing 11(2): 285\u2013295","journal-title":"IEEE Transactions on Semi-conductor Manufacturing"},{"key":"383_CR10","doi-asserted-by":"crossref","first-page":"271","DOI":"10.1080\/00224065.1993.11979473","volume":"25","author":"A. Ingolfsson","year":"1993","unstructured":"Ingolfsson A., Sachs E. (1993) Stability and sensitivity of an EWMA controller. Journal of Quality Technology 25: 271\u2013287","journal-title":"Journal of Quality Technology"},{"key":"383_CR11","volume-title":"Quality planning and analysis","author":"J. M. Juran","year":"1980","unstructured":"Juran J. M., Gryna F. M. Jr. (1980) Quality planning and analysis (2nd ed.). McGraw-Hill, New York","edition":"2"},{"issue":"1","key":"383_CR12","doi-asserted-by":"crossref","first-page":"41","DOI":"10.1080\/00224065.1986.11978984","volume":"18","author":"V. E. Kane","year":"1986","unstructured":"Kane V. E. (1986) Process capability indices. Journal of Quality Technology 18(1): 41\u201352","journal-title":"Journal of Quality Technology"},{"issue":"4","key":"383_CR13","first-page":"43","volume":"26","author":"C. Kymal","year":"2006","unstructured":"Kymal C., Patiyasevi P. (2006) Semiconductor quality initiatives: How to maintain quality in this fast-changing industry. Quality Digest 26(4): 43\u201348","journal-title":"Quality Digest"},{"key":"383_CR14","first-page":"32","volume":"5044","author":"D. W. Laidler","year":"2003","unstructured":"Laidler D. W., Leray P., Crow D. A., Robert K. E. (2003) Knowledge-based APC methodology for overlay control. Proceedings of SPIE-the International Society for Optical Engineering 5044: 32\u201343","journal-title":"Proceedings of SPIE-the International Society for Optical Engineering"},{"issue":"4\/6","key":"383_CR15","doi-asserted-by":"crossref","first-page":"1162","DOI":"10.1016\/j.mee.2008.12.079","volume":"86","author":"L. D. Liao","year":"2009","unstructured":"Liao L. D., Chao P. C. P., Lin Y. J., Miaou S. G., Chang M., Huang J. S. (2009) Precision micro-\/nano-machining in a scanning electron microscope by run-to-run control based on image feedbacks. Microelectronic engineering 86(4\/6): 1162\u20131168","journal-title":"Microelectronic engineering"},{"key":"383_CR16","volume-title":"Semiconductor lithography: Principles, practices, and materials","author":"W. M. Moreau","year":"1998","unstructured":"Moreau W. M. (1998) Semiconductor lithography: Principles, practices, and materials. Plenum Press, New York"},{"key":"383_CR17","volume-title":"Run-to-run control in semiconductor manufacturing","author":"J. Moyne","year":"2001","unstructured":"Moyne J., Del Castillo E., Hurwitz A. M. (2001) Run-to-run control in semiconductor manufacturing. CRC Press LLC, New York"},{"issue":"3","key":"383_CR18","doi-asserted-by":"crossref","first-page":"179","DOI":"10.1016\/j.jprocont.2005.06.002","volume":"16","author":"S. J. Qin","year":"2006","unstructured":"Qin S. J., Cherry G., Good R. (2006) Semiconductor manufacturing process control and monitoring: A fab-wide framework. Journal of process control 16(3): 179\u2013191","journal-title":"Journal of process control"},{"issue":"2","key":"383_CR19","doi-asserted-by":"crossref","first-page":"133","DOI":"10.1109\/66.79725","volume":"4","author":"E. Sachs","year":"1991","unstructured":"Sachs E., Guo R., Ha S., Hu A. (1991) Process control system for VLSI fabrication. IEEE Transaction on Semiconductor Manufacturing 4(2): 133\u2013144","journal-title":"IEEE Transaction on Semiconductor Manufacturing"},{"issue":"1","key":"383_CR20","doi-asserted-by":"crossref","first-page":"26","DOI":"10.1109\/66.350755","volume":"8","author":"E. Sachs","year":"1995","unstructured":"Sachs E., Hu A., Ingolfsson A. (1995) Run to run process control: Combining SPC and feedback control. IEEE Transactions on Semiconductor Manufacturing 8(1): 26\u201343","journal-title":"IEEE Transactions on Semiconductor Manufacturing"},{"issue":"2","key":"383_CR21","doi-asserted-by":"crossref","first-page":"121","DOI":"10.1109\/3476.622882","volume":"20","author":"T. Smith","year":"1997","unstructured":"Smith T., Boning D. (1997) Self-tuning EWMA controller utilizing artificial neural network function approximation techniques. IEEE Transactions of Components, Packaging and Manufacturing Technology 20(2): 121\u2013132","journal-title":"IEEE Transactions of Components, Packaging and Manufacturing Technology"},{"issue":"2","key":"383_CR22","doi-asserted-by":"crossref","first-page":"153","DOI":"10.1108\/09576060310459447","volume":"14","author":"T. Yang","year":"2003","unstructured":"Yang T., Chen C. M., Su C. T. (2003) Quality management practice in semiconductor manufacturing industries\u2014Empirical studies in Taiwan. Integrated Manufacturing Systems 14(2): 153\u2013159","journal-title":"Integrated Manufacturing Systems"},{"issue":"3","key":"383_CR23","doi-asserted-by":"crossref","first-page":"209","DOI":"10.1023\/A:1008818817588","volume":"9","author":"F. Zorriassatine","year":"1998","unstructured":"Zorriassatine F., Tannock J. D. T. (1998) Review of neural networks for statistical process control. Journal of intelligent manufacturing 9(3): 209\u2013224","journal-title":"Journal of intelligent manufacturing"}],"container-title":["Journal of Intelligent Manufacturing"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/s10845-010-0383-6.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/link.springer.com\/article\/10.1007\/s10845-010-0383-6\/fulltext.html","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/s10845-010-0383-6","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,5,30]],"date-time":"2019-05-30T22:11:47Z","timestamp":1559254307000},"score":1,"resource":{"primary":{"URL":"http:\/\/link.springer.com\/10.1007\/s10845-010-0383-6"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2010,2,13]]},"references-count":23,"journal-issue":{"issue":"3","published-print":{"date-parts":[[2012,6]]}},"alternative-id":["383"],"URL":"https:\/\/doi.org\/10.1007\/s10845-010-0383-6","relation":{},"ISSN":["0956-5515","1572-8145"],"issn-type":[{"value":"0956-5515","type":"print"},{"value":"1572-8145","type":"electronic"}],"subject":[],"published":{"date-parts":[[2010,2,13]]}}}