{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,16]],"date-time":"2026-05-16T16:06:31Z","timestamp":1778947591629,"version":"3.51.4"},"reference-count":27,"publisher":"Springer Science and Business Media LLC","issue":"5","license":[{"start":{"date-parts":[[2013,5,18]],"date-time":"2013-05-18T00:00:00Z","timestamp":1368835200000},"content-version":"tdm","delay-in-days":0,"URL":"http:\/\/www.springer.com\/tdm"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["J Intell Manuf"],"published-print":{"date-parts":[[2014,10]]},"DOI":"10.1007\/s10845-013-0785-3","type":"journal-article","created":{"date-parts":[[2013,5,17]],"date-time":"2013-05-17T07:44:32Z","timestamp":1368776672000},"page":"933-943","source":"Crossref","is-referenced-by-count":26,"title":["Hierarchical indices to detect equipment condition changes with high dimensional data for semiconductor manufacturing"],"prefix":"10.1007","volume":"25","author":[{"given":"Hui-Chun","family":"Yu","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kuo-Yi","family":"Lin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chen-Fu","family":"Chien","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"297","published-online":{"date-parts":[[2013,5,18]]},"reference":[{"key":"785_CR1","unstructured":"Blue, J., Roussy, A., Thieullen, A., & Pinaton, J. (2012). Efficient FDC based on hierarchical tool condition monitoring scheme. In Proceedings of the Advanced Semiconductor Manufacturing Conference (359\u2013364). New York: Saratoga, Springs, May 2012."},{"key":"785_CR2","unstructured":"Chao, A., Tseng, S., Wong, D. S., Jane, S., & Lee, S. (2008). Systematic applications of multivariate analysis to monitoring of equipment health in semiconductor manufacturing. In Proceedings of the 2008 Winter Simulation Conference (pp. 2330\u20132334). Florida: Miami, Dec 2008."},{"issue":"4","key":"785_CR3","doi-asserted-by":"crossref","first-page":"522","DOI":"10.1109\/TSM.2009.2028215","volume":"22","author":"A Chen","year":"2009","unstructured":"Chen, A., & Blue, J. (2009). Recipe-independent indicator for tool health diagnosis and predictive maintenance. IEEE Transactions on Semiconductor Manufacturing, 22(4), 522\u2013535.","journal-title":"IEEE Transactions on Semiconductor Manufacturing"},{"issue":"15","key":"785_CR4","doi-asserted-by":"crossref","first-page":"3351","DOI":"10.1080\/00207540600677617","volume":"45","author":"A Chen","year":"2007","unstructured":"Chen, A., & Wu, G. (2007). Real-time health prognosis and dynamic preventive maintenance. International Journal of Production Research, 45(15), 3351\u20133379.","journal-title":"International Journal of Production Research"},{"issue":"3","key":"785_CR5","doi-asserted-by":"crossref","first-page":"447","DOI":"10.1007\/s10845-009-0302-x","volume":"22","author":"W Chen","year":"2011","unstructured":"Chen, W., & Chien, C.-F. (2011). Measuring relative performance of wafer fabrication operations: A case study. Journal of Intelligent Manufacturing, 22(3), 447\u2013457.","journal-title":"Journal of Intelligent Manufacturing"},{"issue":"3","key":"785_CR6","doi-asserted-by":"crossref","first-page":"509","DOI":"10.1080\/00207540600792515","volume":"45","author":"C-F Chien","year":"2007","unstructured":"Chien, C.-F., Chen, H., Wu, J., & Hu, C. (2007). Construct the OGE for promoting tool group productivity in semiconductor manufacturing. International Journal of Production Research, 45(3), 509\u2013524.","journal-title":"International Journal of Production Research"},{"issue":"2","key":"785_CR7","doi-asserted-by":"crossref","first-page":"496","DOI":"10.1016\/j.ijpe.2010.07.022","volume":"128","author":"C-F Chien","year":"2010","unstructured":"Chien, C.-F., Chen, Y., & Peng, J. (2010). Manufacturing intelligence for semiconductor demand forecast based on technology diffusion and product life cycle. International Journal of Production Economics, 128(2), 496\u2013509.","journal-title":"International Journal of Production Economics"},{"issue":"4","key":"785_CR8","doi-asserted-by":"crossref","first-page":"429","DOI":"10.1007\/s10845-005-0016-7","volume":"17","author":"C-F Chien","year":"2006","unstructured":"Chien, C.-F., & Hsu, C. (2006). A novel method for determining machine subgroups and backups with an empirical study for semiconductor manufacturing. Journal of Intelligent Manufacturing, 17(4), 429\u2013439.","journal-title":"Journal of Intelligent Manufacturing"},{"key":"785_CR9","doi-asserted-by":"crossref","unstructured":"Chien, C.-F., & Hsu, C. (2011). UNISON Analysis to Model and Reduce Step-and-Scan Overlay Errors for Semiconductor Manufacturing. Journal of Intelligent Manufacturing, 22(3), 399\u2013412.","DOI":"10.1007\/s10845-009-0298-2"},{"key":"785_CR10","doi-asserted-by":"crossref","unstructured":"Chien, C.-F., Hsu, C., & Chang, K. (2013). Overall Wafer Effectiveness (OWE): A Novel Industry Standard for Semiconductor Ecosystem as a Whole. Computers & Industrial Engineering, 65(1), 117\u2013127.","DOI":"10.1016\/j.cie.2011.11.024"},{"key":"785_CR11","doi-asserted-by":"crossref","unstructured":"Chien, C.-F., Hsu, C., & Hsiao, C. (2012). Manufacturing intelligence to forecast and reduce semiconductor cycle time. Journal of Intelligent Manufacturing, 23(6), 2281\u20132294.","DOI":"10.1007\/s10845-011-0572-y"},{"key":"785_CR12","doi-asserted-by":"crossref","unstructured":"Chien, C.-F., & Wu, J. (2003). Analyzing repair decisions in the site imbalance problem of semiconductor test machines. IEEE Transactions on Semiconductor Manufacturing, 16(4), 704\u2013711.","DOI":"10.1109\/TSM.2003.818955"},{"issue":"6","key":"785_CR13","doi-asserted-by":"crossref","first-page":"2151","DOI":"10.1007\/s10845-011-0561-1","volume":"23","author":"C-F Chien","year":"2012","unstructured":"Chien, C.-F., & Zheng, J. (2012). Mini-max regret strategy for robust capacity expansion decisions in semiconductor manufacturing. Journal of Intelligent Manufacturing, 23(6), 2151\u20132159.","journal-title":"Journal of Intelligent Manufacturing"},{"issue":"1","key":"785_CR14","doi-asserted-by":"crossref","first-page":"92","DOI":"10.1109\/TSM.2007.914373","volume":"21","author":"F-T Cheng","year":"2008","unstructured":"Cheng, F.-T., Chen, Y., Su, Y., & Zeng, D. (2008). Evaluating reliance level of a virtual metrology system. IEEE Transactions on Semiconductor Manufacturing, 21(1), 92\u2013103.","journal-title":"IEEE Transactions on Semiconductor Manufacturing"},{"key":"785_CR15","doi-asserted-by":"crossref","unstructured":"Cheng, F.-T., Huang, H., & Kao, C. (2007). Dual-phase virtual metrology scheme. IEEE Transactions on Semiconductor Manufacturing, 20(4), 566\u2013571.","DOI":"10.1109\/TSM.2007.907633"},{"key":"785_CR16","volume-title":"Statistical Methods for Research Worker","author":"RA Fisher","year":"1925","unstructured":"Fisher, R. A. (1925). Statistical Methods for Research Worker. Edinburg and London: Oliver and Boyd."},{"key":"785_CR17","volume-title":"Techniques in Statistical Analysis","author":"H Hotelling","year":"1947","unstructured":"Hotelling, H. (1947). Multivariate quality control. In C. Eisenhart, M. W. Hastay, & W. A. Wallis (Eds.), Techniques in Statistical Analysis. New York: McGraw-Hill."},{"issue":"5","key":"785_CR18","doi-asserted-by":"crossref","first-page":"303","DOI":"10.1080\/10170669.2012.702135","volume":"29","author":"C-Y Hsu","year":"2012","unstructured":"Hsu, C.-Y., Chien, C., & Chen, P. (2012). Manufacturing intelligence for early warning of key equipment excursion for advanced equipment control in semiconductor manufacturing. Journal of the Chinese Institute of Industrial Engineers, 29(5), 303\u2013313.","journal-title":"Journal of the Chinese Institute of Industrial Engineers"},{"issue":"432","key":"785_CR19","doi-asserted-by":"crossref","first-page":"1380","DOI":"10.1080\/01621459.1995.10476643","volume":"90","author":"RA Liu","year":"1995","unstructured":"Liu, R. A. (1995). Control Charts for Multivariate Processes. Journal of the American Statistical Association, 90(432), 1380\u20131387.","journal-title":"Journal of the American Statistical Association"},{"issue":"1","key":"785_CR20","doi-asserted-by":"crossref","first-page":"46","DOI":"10.2307\/1269551","volume":"34","author":"CA Lowry","year":"1992","unstructured":"Lowry, C. A., Woodall, W. H., Champ, C. W., & Rigdon, S. E. (1992). A multivariate exponentially weighted moving average control chart. Technometrics, 34(1), 46\u201353.","journal-title":"Technometrics"},{"key":"785_CR21","volume-title":"Introduction to statistical quality control","author":"DC Montgomery","year":"1997","unstructured":"Montgomery, D. C. (1997). Introduction to statistical quality control (3rd ed.). New York: Wiley.","edition":"3"},{"issue":"4","key":"785_CR22","doi-asserted-by":"crossref","first-page":"301","DOI":"10.1080\/0740817X.2011.587863","volume":"44","author":"X Ning","year":"2012","unstructured":"Ning, X., & Tsung, F. (2012). A density-based statistical process control scheme for high-dimensional and mixed-type observations. IIE Transactions, 44(4), 301\u2013311.","journal-title":"IIE Transactions"},{"key":"785_CR23","doi-asserted-by":"crossref","unstructured":"Rebai, M., Kacem, I., & Adjallah, K. (2012). Earliness-tardiness minimization on a single machine to schedule preventive maintenance tasks: Metaheuristic and exact methods. Journal of Intelligent Manufacturing, 23(4), 1207\u20131224.","DOI":"10.1007\/s10845-010-0425-0"},{"issue":"3","key":"785_CR24","doi-asserted-by":"crossref","first-page":"469","DOI":"10.1016\/S0377-2217(01)00197-7","volume":"139","author":"H Wang","year":"2002","unstructured":"Wang, H. (2002). A survey of maintenance policies of deteriorating systems. European Journal of Operational Research, 139(3), 469\u2013489.","journal-title":"European Journal of Operational Research"},{"issue":"1","key":"785_CR25","doi-asserted-by":"crossref","first-page":"128","DOI":"10.1016\/j.cie.2011.11.020","volume":"65","author":"J-Z Wu","year":"2013","unstructured":"Wu, J.-Z. (2013). Inventory write-down prediction for semiconductor manufacturing considering inventory age, accounting principle, and product structure with real settings. Computers & Industrial Engineering, 65(1), 128\u2013136.","journal-title":"Computers & Industrial Engineering"},{"issue":"3","key":"785_CR26","doi-asserted-by":"crossref","first-page":"345","DOI":"10.1109\/TSM.2004.831948","volume":"17","author":"X Yao","year":"2004","unstructured":"Yao, X., Fernadez-Gaucherand, E., Fu, M., & Marcus, S. (2004). Optimal preventive maintenance scheduling in semiconductor manufacturing. IEEE Transactions on Semiconductor Manufacturing, 17(3), 345\u2013356.","journal-title":"IEEE Transactions on Semiconductor Manufacturing"},{"key":"785_CR27","unstructured":"Yue, H. H., & Tomoyasu, M. (2004). Weighted principal component analysis and its applications to improve FDC performance. In Proceedings of the 43rd IEEE Conference on Decision and Control (pp. 4262\u20134267). Paradise Island: Bahamas, Dec 2004."}],"container-title":["Journal of Intelligent Manufacturing"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/s10845-013-0785-3.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/link.springer.com\/article\/10.1007\/s10845-013-0785-3\/fulltext.html","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/s10845-013-0785-3","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,5,31]],"date-time":"2019-05-31T02:11:58Z","timestamp":1559268718000},"score":1,"resource":{"primary":{"URL":"http:\/\/link.springer.com\/10.1007\/s10845-013-0785-3"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,5,18]]},"references-count":27,"journal-issue":{"issue":"5","published-print":{"date-parts":[[2014,10]]}},"alternative-id":["785"],"URL":"https:\/\/doi.org\/10.1007\/s10845-013-0785-3","relation":{},"ISSN":["0956-5515","1572-8145"],"issn-type":[{"value":"0956-5515","type":"print"},{"value":"1572-8145","type":"electronic"}],"subject":[],"published":{"date-parts":[[2013,5,18]]}}}