{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,13]],"date-time":"2026-02-13T20:35:11Z","timestamp":1771014911573,"version":"3.50.1"},"reference-count":30,"publisher":"Springer Science and Business Media LLC","issue":"2","license":[{"start":{"date-parts":[[2022,12,17]],"date-time":"2022-12-17T00:00:00Z","timestamp":1671235200000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"},{"start":{"date-parts":[[2022,12,17]],"date-time":"2022-12-17T00:00:00Z","timestamp":1671235200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":["J Intell Manuf"],"published-print":{"date-parts":[[2024,2]]},"DOI":"10.1007\/s10845-022-02067-z","type":"journal-article","created":{"date-parts":[[2022,12,17]],"date-time":"2022-12-17T17:02:31Z","timestamp":1671296551000},"page":"633-646","update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":12,"title":["A novel hypergraph convolution network for wafer defect patterns identification based on an unbalanced dataset"],"prefix":"10.1007","volume":"35","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-8681-4053","authenticated-orcid":false,"given":"Yuxi","family":"Xie","sequence":"first","affiliation":[]},{"given":"Shaofan","family":"Li","sequence":"additional","affiliation":[]},{"given":"C. T.","family":"Wu","sequence":"additional","affiliation":[]},{"given":"Zhipeng","family":"Lai","sequence":"additional","affiliation":[]},{"given":"Miao","family":"Su","sequence":"additional","affiliation":[]}],"member":"297","published-online":{"date-parts":[[2022,12,17]]},"reference":[{"issue":"107","key":"2067_CR1","first-page":"637","volume":"110","author":"S Bai","year":"2021","unstructured":"Bai, S., Zhang, F., & Torr, P. H. (2021). Hypergraph convolution and hypergraph attention. Pattern Recognition, 110(107), 637.","journal-title":"Pattern Recognition"},{"key":"2067_CR2","unstructured":"Berge, C. (1973). Graphs and hypergraphs. AGRIS."},{"issue":"2","key":"2067_CR3","doi-asserted-by":"publisher","first-page":"163","DOI":"10.1109\/TSM.2019.2902657","volume":"32","author":"S Cheon","year":"2019","unstructured":"Cheon, S., Lee, H., Kim, C. O., & Lee, S. H. (2019). Convolutional neural network for wafer surface defect classification and the detection of unknown defect class. IEEE Transactions on Semiconductor Manufacturing, 32(2), 163\u2013170.","journal-title":"IEEE Transactions on Semiconductor Manufacturing"},{"key":"2067_CR4","unstructured":"Chou, W., Shao, J., Chung, R., Chen, L., Chen, A., & Zhou, L. (2019). Semiconductors\u2014The next wave: Opportunities and winning strategies for semiconductor companies."},{"issue":"12","key":"2067_CR5","doi-asserted-by":"publisher","first-page":"1857","DOI":"10.1016\/j.patrec.2005.03.007","volume":"26","author":"F Di Palma","year":"2005","unstructured":"Di Palma, F., De Nicolao, G., Miraglia, G., Pasquinetti, E., & Piccinini, F. (2005). Unsupervised spatial pattern classification of electrical-wafer-sorting maps in semiconductor manufacturing. Pattern Recognition Letters, 26(12), 1857\u20131865.","journal-title":"Pattern Recognition Letters"},{"key":"2067_CR6","doi-asserted-by":"crossref","unstructured":"Feng, Y., You, H., Zhang, Z., Ji, R., & Gao, Y. (2019). Hypergraph neural networks. In Proceedings of the AAAI conference on artificial intelligence (pp 3558\u20133565).","DOI":"10.1609\/aaai.v33i01.33013558"},{"key":"2067_CR7","unstructured":"Garey, M. R., & Johnson, D. S. (1979). Computers and intractability (Vol. 174). San Francisco: Freeman."},{"key":"2067_CR8","doi-asserted-by":"crossref","unstructured":"He, K., Zhang, X., Ren, S., & Sun, J. (2016). Deep residual learning for image recognition. In Proceedings of the IEEE conference on computer vision and pattern recognition (pp 770\u2013778).","DOI":"10.1109\/CVPR.2016.90"},{"issue":"5","key":"2067_CR9","doi-asserted-by":"publisher","first-page":"429","DOI":"10.3233\/IDA-2002-6504","volume":"6","author":"N Japkowicz","year":"2002","unstructured":"Japkowicz, N., & Stephen, S. (2002). The class imbalance problem: A systematic study. Intelligent Data Analysis, 6(5), 429\u2013449.","journal-title":"Intelligent Data Analysis"},{"issue":"4","key":"2067_CR10","doi-asserted-by":"publisher","first-page":"625","DOI":"10.1109\/TSM.2008.2005375","volume":"21","author":"YS Jeong","year":"2008","unstructured":"Jeong, Y. S., Kim, S. J., & Jeong, M. K. (2008). Automatic identification of defect patterns in semiconductor wafer maps using spatial correlogram and dynamic time warping. IEEE Transactions on Semiconductor manufacturing, 21(4), 625\u2013637.","journal-title":"IEEE Transactions on Semiconductor manufacturing"},{"issue":"3","key":"2067_CR11","doi-asserted-by":"publisher","first-page":"286","DOI":"10.1109\/TSM.2019.2916835","volume":"32","author":"CH Jin","year":"2019","unstructured":"Jin, C. H., Na, H. J., Piao, M., Pok, G., & Ryu, K. H. (2019). A novel DBSCAN-based defect pattern detection and classification framework for wafer bin map. IEEE Transactions on Semiconductor Manufacturing, 32(3), 286\u2013292.","journal-title":"IEEE Transactions on Semiconductor Manufacturing"},{"issue":"8","key":"2067_CR12","doi-asserted-by":"crossref","first-page":"3573","DOI":"10.1109\/TNNLS.2017.2732482","volume":"29","author":"SH Khan","year":"2017","unstructured":"Khan, S. H., Hayat, M., Bennamoun, M., Sohel, F. A., & Togneri, R. (2017). Cost-sensitive learning of deep feature representations from imbalanced data. IEEE Transactions on Neural Networks and Learning Systems, 29(8), 3573\u20133587.","journal-title":"IEEE Transactions on Neural Networks and Learning Systems"},{"key":"2067_CR13","unstructured":"Krizhevsky, A., Sutskever, I., & Hinton, G. E. (2012). Imagenet classification with deep convolutional neural networks. Advances in Neural Information Processing Systems, 25."},{"issue":"3","key":"2067_CR14","doi-asserted-by":"publisher","first-page":"395","DOI":"10.1109\/TSM.2018.2841416","volume":"31","author":"K Kyeong","year":"2018","unstructured":"Kyeong, K., & Kim, H. (2018). Classification of mixed-type defect patterns in wafer bin maps using convolutional neural networks. IEEE Transactions on Semiconductor Manufacturing, 31(3), 395\u2013402.","journal-title":"IEEE Transactions on Semiconductor Manufacturing"},{"key":"2067_CR15","doi-asserted-by":"crossref","unstructured":"Li, P., & Milenkovic, O. (2017). Inhomogeneous hypergraph clustering with applications. Advances in Neural Information Processing Systems, 30.","DOI":"10.1007\/978-3-319-70139-4"},{"key":"2067_CR16","unstructured":"Mariani, G., Scheidegger, F., Istrate, R., Bekas, C., & Malossi, C (2018). Bagan: Data augmentation with balancing gan. arXiv:1803.09655"},{"issue":"2","key":"2067_CR17","doi-asserted-by":"publisher","first-page":"196","DOI":"10.1109\/TSM.2013.2243766","volume":"26","author":"L Milor","year":"2013","unstructured":"Milor, L. (2013). A survey of yield modeling and yield enhancement methods. IEEE Transactions on Semiconductor Manufacturing, 26(2), 196\u2013213.","journal-title":"IEEE Transactions on Semiconductor Manufacturing"},{"issue":"2","key":"2067_CR18","doi-asserted-by":"publisher","first-page":"309","DOI":"10.1109\/TSM.2018.2795466","volume":"31","author":"T Nakazawa","year":"2018","unstructured":"Nakazawa, T., & Kulkarni, D. V. (2018). Wafer map defect pattern classification and image retrieval using convolutional neural network. IEEE Transactions on Semiconductor Manufacturing, 31(2), 309\u2013314.","journal-title":"IEEE Transactions on Semiconductor Manufacturing"},{"issue":"3","key":"2067_CR19","doi-asserted-by":"publisher","first-page":"436","DOI":"10.1109\/TSM.2020.2994357","volume":"33","author":"M Saqlain","year":"2020","unstructured":"Saqlain, M., Abbas, Q., & Lee, J. Y. (2020). A deep convolutional neural network for wafer defect identification on an imbalanced dataset in semiconductor manufacturing processes. IEEE Transactions on Semiconductor Manufacturing, 33(3), 436\u2013444.","journal-title":"IEEE Transactions on Semiconductor Manufacturing"},{"issue":"2","key":"2067_CR20","doi-asserted-by":"publisher","first-page":"171","DOI":"10.1109\/TSM.2019.2904306","volume":"32","author":"M Saqlain","year":"2019","unstructured":"Saqlain, M., Jargalsaikhan, B., & Lee, J. Y. (2019). A voting ensemble classifier for wafer map defect patterns identification in semiconductor manufacturing. IEEE Transactions on Semiconductor Manufacturing, 32(2), 171\u2013182.","journal-title":"IEEE Transactions on Semiconductor Manufacturing"},{"key":"2067_CR21","unstructured":"Semiconductor, G. (2019). Semiconductors: As the backbone of the connected world, the industry\u2019s future is bright. In KMPG\u2019s 14th Annu Glob Semicond outlook Rep (pp. 1\u201324)."},{"key":"2067_CR22","unstructured":"Simonyan, K., & Zisserman, A. (2014). Very deep convolutional networks for large-scale image recognition. arXiv:1409.1556"},{"key":"2067_CR23","unstructured":"STATISTA. (2019). Monthly semiconductor sales worldwide from 2012 to 2020 (in billion u.s. dollars). Statista Gmbh: Hamburg, Germany."},{"issue":"2","key":"2067_CR24","doi-asserted-by":"publisher","first-page":"315","DOI":"10.1109\/TSM.2018.2825482","volume":"31","author":"G Tello","year":"2018","unstructured":"Tello, G., Al-Jarrah, O. Y., Yoo, P. D., Al-Hammadi, Y., Muhaidat, S., & Lee, U. (2018). Deep-structured machine learning model for the recognition of mixed-defect patterns in semiconductor fabrication processes. IEEE Transactions on Semiconductor Manufacturing, 31(2), 315\u2013322.","journal-title":"IEEE Transactions on Semiconductor Manufacturing"},{"issue":"3","key":"2067_CR25","doi-asserted-by":"publisher","first-page":"310","DOI":"10.1109\/TSM.2019.2925361","volume":"32","author":"J Wang","year":"2019","unstructured":"Wang, J., Yang, Z., Zhang, J., Zhang, Q., & Chien, W. T. K. (2019). Adabalgan: An improved generative adversarial network with imbalanced learning for wafer defective pattern recognition. IEEE Transactions on Semiconductor Manufacturing, 32(3), 310\u2013319.","journal-title":"IEEE Transactions on Semiconductor Manufacturing"},{"issue":"1","key":"2067_CR26","first-page":"1","volume":"28","author":"MJ Wu","year":"2014","unstructured":"Wu, M. J., Jang, J. S. R., & Chen, J. L. (2014). Wafer map failure pattern recognition and similarity ranking for large-scale data sets. IEEE Transactions on Semiconductor Manufacturing, 28(1), 1\u201312.","journal-title":"IEEE Transactions on Semiconductor Manufacturing"},{"issue":"11","key":"2067_CR27","doi-asserted-by":"publisher","first-page":"1101","DOI":"10.1109\/34.244673","volume":"15","author":"Z Wu","year":"1993","unstructured":"Wu, Z., & Leahy, R. (1993). An optimal graph theoretic approach to data clustering: Theory and its application to image segmentation. IEEE Transactions on Pattern Analysis and Machine Intelligence, 15(11), 1101\u20131113.","journal-title":"IEEE Transactions on Pattern Analysis and Machine Intelligence"},{"issue":"1","key":"2067_CR28","doi-asserted-by":"publisher","first-page":"4","DOI":"10.1109\/TNNLS.2020.2978386","volume":"32","author":"Z Wu","year":"2020","unstructured":"Wu, Z., Pan, S., Chen, F., Long, G., Zhang, C., & Philip, S. Y. (2020). A comprehensive survey on graph neural networks. IEEE Transactions on Neural Networks and Learning Systems, 32(1), 4\u201324.","journal-title":"IEEE Transactions on Neural Networks and Learning Systems"},{"key":"2067_CR29","unstructured":"Zhang, Z., Cui, P., & Zhu, W. (2020). Deep learning on graphs: A survey. IEEE Transactions on Knowledge and Data Engineering."},{"key":"2067_CR30","doi-asserted-by":"publisher","first-page":"57","DOI":"10.1016\/j.aiopen.2021.01.001","volume":"1","author":"J Zhou","year":"2020","unstructured":"Zhou, J., Cui, G., Hu, S., Zhang, Z., Yang, C., Liu, Z., Wang, L., Li, C., & Sun, M. (2020). Graph neural networks: A review of methods and applications. AI Open, 1, 57\u201381.","journal-title":"AI Open"}],"container-title":["Journal of Intelligent Manufacturing"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/s10845-022-02067-z.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/link.springer.com\/article\/10.1007\/s10845-022-02067-z\/fulltext.html","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/s10845-022-02067-z.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,10,10]],"date-time":"2024-10-10T16:45:13Z","timestamp":1728578713000},"score":1,"resource":{"primary":{"URL":"https:\/\/link.springer.com\/10.1007\/s10845-022-02067-z"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,12,17]]},"references-count":30,"journal-issue":{"issue":"2","published-print":{"date-parts":[[2024,2]]}},"alternative-id":["2067"],"URL":"https:\/\/doi.org\/10.1007\/s10845-022-02067-z","relation":{},"ISSN":["0956-5515","1572-8145"],"issn-type":[{"value":"0956-5515","type":"print"},{"value":"1572-8145","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,12,17]]},"assertion":[{"value":"9 July 2022","order":1,"name":"received","label":"Received","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"6 December 2022","order":2,"name":"accepted","label":"Accepted","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"17 December 2022","order":3,"name":"first_online","label":"First Online","group":{"name":"ArticleHistory","label":"Article History"}},{"order":1,"name":"Ethics","group":{"name":"EthicsHeading","label":"Declarations"}},{"value":"All authors certify that they have no affiliations with or involvement in any organization or entity with any financial interest or non-financial interest in the subject matter or materials discussed in this manuscript.","order":2,"name":"Ethics","group":{"name":"EthicsHeading","label":"Conflict of interest"}}]}}