{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,6]],"date-time":"2026-06-06T06:21:28Z","timestamp":1780726888697,"version":"3.54.1"},"reference-count":32,"publisher":"Springer Science and Business Media LLC","issue":"1","license":[{"start":{"date-parts":[[2023,11,9]],"date-time":"2023-11-09T00:00:00Z","timestamp":1699488000000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"},{"start":{"date-parts":[[2023,11,9]],"date-time":"2023-11-09T00:00:00Z","timestamp":1699488000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"}],"funder":[{"DOI":"10.13039\/100017420","name":"Penta Foundation UK","doi-asserted-by":"publisher","award":["EURIPIDES2"],"award-info":[{"award-number":["EURIPIDES2"]}],"id":[{"id":"10.13039\/100017420","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":["J Intell Manuf"],"published-print":{"date-parts":[[2025,1]]},"DOI":"10.1007\/s10845-023-02245-7","type":"journal-article","created":{"date-parts":[[2023,11,9]],"date-time":"2023-11-09T16:02:41Z","timestamp":1699545761000},"page":"357-372","update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":6,"title":["Natural language processing (NLP) and association rules (AR)-based knowledge extraction for intelligent fault analysis: a case study in semiconductor industry"],"prefix":"10.1007","volume":"36","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-0002-5203","authenticated-orcid":false,"given":"Zhiqiang","family":"Wang","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Kenneth","family":"Ezukwoke","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Anis","family":"Hoayek","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Mireille","family":"Batton-Hubert","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xavier","family":"Boucher","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"297","published-online":{"date-parts":[[2023,11,9]]},"reference":[{"key":"2245_CR1","doi-asserted-by":"crossref","unstructured":"Agrawal, R., Imieli\u0144ski, T., & Swami, A. (1993). Mining association rules between sets of items in large databases. In Proceedings of the 1993 ACM SIGMOD international conference on management of data (pp. 207\u2013216). Association for Computing Machinery, New York, NY, United States.","DOI":"10.1145\/170035.170072"},{"key":"2245_CR2","doi-asserted-by":"publisher","DOI":"10.1016\/j.ssci.2022.105711","volume":"150","author":"S Antomarioni","year":"2022","unstructured":"Antomarioni, S., Ciarapica, F. E., & Bevilacqua, M. (2022). Association rules and social network analysis for supporting failure mode effects and criticality analysis: Framework development and insights from an onshore platform. Safety Science, 150, 105711.","journal-title":"Safety Science"},{"key":"2245_CR3","doi-asserted-by":"publisher","DOI":"10.1016\/j.ress.2020.107305","volume":"209","author":"F Antonello","year":"2021","unstructured":"Antonello, F., Baraldi, P., Shokry, A., Zio, E., Gentile, U., & Serio, L. (2021). Association rules extraction for the identification of functional dependencies in complex technical infrastructures. Reliability Engineering & System Safety, 209, 107305.","journal-title":"Reliability Engineering & System Safety"},{"key":"2245_CR4","volume-title":"Reliability of electronic components: A practical guide to electronic systems manufacturing","author":"TI Bajenescu","year":"2012","unstructured":"Bajenescu, T. I., & Bazu, M. I. (2012). Reliability of electronic components: A practical guide to electronic systems manufacturing. Springer."},{"issue":"7","key":"2245_CR5","doi-asserted-by":"publisher","first-page":"5748","DOI":"10.1109\/TIE.2019.2931220","volume":"67","author":"N Dimitriou","year":"2019","unstructured":"Dimitriou, N., Leontaris, L., Vafeiadis, T., Ioannidis, D., Wotherspoon, T., Tinker, G., & Tzovaras, D. (2019). Fault diagnosis in microelectronics attachment via deep learning analysis of 3-D laser scans. IEEE Transactions on Industrial Electronics, 67(7), 5748\u20135757.","journal-title":"IEEE Transactions on Industrial Electronics"},{"key":"2245_CR6","doi-asserted-by":"publisher","unstructured":"Ezukwoke, K., Hoayek, A., Batton-Hubert, M., & Boucher, X. (2022). GCVAE: Generalized-controllable variational autoencoder. https:\/\/doi.org\/10.48550\/ARXIV.2206.04225.","DOI":"10.48550\/ARXIV.2206.04225"},{"key":"2245_CR7","doi-asserted-by":"crossref","unstructured":"Ezukwoke, K., Toubakh, H., Hoayek, A., Batton-Hubert, M., Boucher, X., & Gounet, P. (2021). Intelligent fault analysis decision flow in semiconductor industry 4.0 using natural language processing with deep clustering. In 2021 IEEE 17th international conference on automation science and engineering (CASE) (pp. 429\u2013436). IEEE.","DOI":"10.1109\/CASE49439.2021.9551492"},{"key":"2245_CR8","doi-asserted-by":"crossref","unstructured":"Grabner, C., Safont-Andreu, A., Burmer, C., & Schekotihin, K. (2022). A BERT-based report classification for semiconductor failure analysis. In ISTFA 2022 (pp. 28\u201335). ASM International.","DOI":"10.31399\/asm.cp.istfa2022p0028"},{"key":"2245_CR9","doi-asserted-by":"crossref","unstructured":"Gu, A., Terada, M., Stegmann, H., Rodgers, T., Fu, C., & Yang, Y. (2022). From system to package to interconnect: An artificial intelligence powered 3d x-ray imaging solution for semiconductor package structural analysis and correlative microscopic failure analysis. In: 2022 IEEE international symposium on the physical and failure analysis of integrated circuits (IPFA) (pp. 1\u20135). IEEE.","DOI":"10.1109\/IPFA55383.2022.9915756"},{"key":"2245_CR10","doi-asserted-by":"publisher","first-page":"1","DOI":"10.18637\/jss.v014.i15","volume":"14","author":"M Hahsler","year":"2005","unstructured":"Hahsler, M., Gr\u00fcn, B., & Hornik, K. (2005). arules\u2014A computational environment for mining association rules and frequent item sets. Journal of Statistical Software, 14, 1\u201325.","journal-title":"Journal of Statistical Software"},{"issue":"5786","key":"2245_CR11","doi-asserted-by":"publisher","first-page":"504","DOI":"10.1126\/science.1127647","volume":"313","author":"GE Hinton","year":"2006","unstructured":"Hinton, G. E., & Salakhutdinov, R. R. (2006). Reducing the dimensionality of data with neural networks. Science, 313(5786), 504\u2013507.","journal-title":"Science"},{"key":"2245_CR12","doi-asserted-by":"crossref","unstructured":"Hollnagel, E. (2018). Safety-I and safety-II: The past and future of safety management (pp. 61\u201390). CRC Press.","DOI":"10.1201\/9781315607511-4"},{"key":"2245_CR13","doi-asserted-by":"publisher","first-page":"823","DOI":"10.1007\/s10845-020-01591-0","volume":"32","author":"C-Y Hsu","year":"2021","unstructured":"Hsu, C.-Y., & Liu, W.-C. (2021). Multiple time-series convolutional neural network for fault detection and diagnosis and empirical study in semiconductor manufacturing. Journal of Intelligent Manufacturing, 32, 823\u2013836.","journal-title":"Journal of Intelligent Manufacturing"},{"key":"2245_CR14","doi-asserted-by":"crossref","unstructured":"Ji, C.-R., & Deng, Z.-H. (2007). Mining frequent ordered patterns without candidate generation. In Fourth International Conference on Fuzzy Systems and Knowledge Discovery (FSKD 2007) (Vol. 1, pp. 402\u2013406). IEEE.","DOI":"10.1109\/FSKD.2007.402"},{"key":"2245_CR15","doi-asserted-by":"publisher","unstructured":"Kingma, D. P., & Ba, J. (2014). Adam: A method for stochastic optimization. arXiv preprint. https:\/\/doi.org\/10.48550\/arXiv.1412.6980.","DOI":"10.48550\/arXiv.1412.6980"},{"key":"2245_CR16","doi-asserted-by":"publisher","unstructured":"Kingma, D. P., & Welling, M. (2013). Auto-encoding variational bayes. arXiv preprint. https:\/\/doi.org\/10.48550\/arXiv.1312.6114.","DOI":"10.48550\/arXiv.1312.6114"},{"issue":"10","key":"2245_CR17","doi-asserted-by":"publisher","first-page":"04019104","DOI":"10.1061\/(ASCE)ST.1943-541X.0002402","volume":"145","author":"S Mangalathu","year":"2019","unstructured":"Mangalathu, S., & Jeon, J.-S. (2019). Machine learning-based failure mode recognition of circular reinforced concrete bridge columns: Comparative study. Journal of Structural Engineering, 145(10), 04019104.","journal-title":"Journal of Structural Engineering"},{"key":"2245_CR18","volume-title":"Electronic failure analysis handbook: Techniques and applications for electronic and electrical packages, components, and assemblies","author":"PL Martin","year":"1999","unstructured":"Martin, P. L. (1999). Electronic failure analysis handbook: Techniques and applications for electronic and electrical packages, components, and assemblies. McGraw-Hill Education."},{"key":"2245_CR19","doi-asserted-by":"publisher","unstructured":"Mikolov, T., Chen, K., Corrado, G., & Dean, J. (2013). Efficient estimation of word representations in vector space. arXiv preprint. https:\/\/doi.org\/10.48550\/arXiv.1301.3781.","DOI":"10.48550\/arXiv.1301.3781"},{"issue":"2","key":"2245_CR20","doi-asserted-by":"publisher","first-page":"153","DOI":"10.1109\/TSM.2021.3056717","volume":"34","author":"Y Nagamura","year":"2021","unstructured":"Nagamura, Y., Arima, K., Arai, M., & Fukumoto, S. (2021). Layout feature extraction using CNN classification in root cause analysis of LSI defects. IEEE Transactions on Semiconductor Manufacturing, 34(2), 153\u2013160.","journal-title":"IEEE Transactions on Semiconductor Manufacturing"},{"key":"2245_CR21","doi-asserted-by":"crossref","unstructured":"Phua, C., & Theng, L. B. (2020). Semiconductor wafer surface: Automatic defect classification with deep CNN. In 2020 IEEE region 10 conference (TENCON) (pp. 714\u2013719). IEEE.","DOI":"10.1109\/TENCON50793.2020.9293715"},{"key":"2245_CR22","doi-asserted-by":"crossref","unstructured":"Platter, F., Safont-Andreu, A., Burmer, C., & Schekotihin, K. (2021). Report classification for semiconductor failure analysis. In ISTFA 2021 (pp. 1\u20135). ASM International.","DOI":"10.31399\/asm.cp.istfa2021p0001"},{"key":"2245_CR23","doi-asserted-by":"crossref","unstructured":"Reimers, N., & Gurevych, I. (2019). Sentence-BERT: Sentence embeddings using Siamese BERT-networks. arXiv preprint. https:\/\/doi.org\/10.48550\/arXiv.1908.10084","DOI":"10.18653\/v1\/D19-1410"},{"key":"2245_CR24","first-page":"659","volume":"741","author":"DA Reynolds","year":"2009","unstructured":"Reynolds, D. A., et al. (2009). Gaussian mixture models. Encyclopedia of. Biometrics, 741, 659\u2013663.","journal-title":"Biometrics"},{"issue":"2","key":"2245_CR25","doi-asserted-by":"publisher","first-page":"461","DOI":"10.1214\/aos\/1176344136","volume":"6","author":"G Schwarz","year":"1978","unstructured":"Schwarz, G. (1978). Estimating the dimension of a model. The Annals of Statistics, 6(2), 461\u2013464. https:\/\/doi.org\/10.1214\/aos\/1176344136","journal-title":"The Annals of Statistics"},{"key":"2245_CR26","doi-asserted-by":"publisher","DOI":"10.1016\/j.techfore.2020.120511","volume":"164","author":"A Trappey","year":"2021","unstructured":"Trappey, A., Trappey, C. V., & Hsieh, A. (2021). An intelligent patent recommender adopting machine learning approach for natural language processing: A case study for smart machinery technology mining. Technological Forecasting and Social Change, 164, 120511.","journal-title":"Technological Forecasting and Social Change"},{"key":"2245_CR27","doi-asserted-by":"crossref","unstructured":"Wang, Z., Ezukwoke, K., Hoayek, A., Batton-Hubert, M., & Boucher, X. (2022). NLP based on GCVAE for intelligent fault analysis in semiconductor industry. In 2022 IEEE 27th international conference on emerging technologies and factory automation (ETFA) (pp. 1\u20138). IEEE.","DOI":"10.1109\/ETFA52439.2022.9921524"},{"issue":"10\u201311","key":"2245_CR28","doi-asserted-by":"publisher","first-page":"1042","DOI":"10.1080\/0951192X.2020.1775302","volume":"33","author":"Z Wang","year":"2020","unstructured":"Wang, Z., Ritou, M., Da Cunha, C., & Furet, B. (2020). Contextual classification for smart machining based on unsupervised machine learning by Gaussian mixture model. International Journal of Computer Integrated Manufacturing, 33(10\u201311), 1042\u20131054.","journal-title":"International Journal of Computer Integrated Manufacturing"},{"key":"2245_CR29","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2019.113399","volume":"100","author":"A Watanabe","year":"2019","unstructured":"Watanabe, A., Hirose, N., Kim, H., & Omura, I. (2019). Convolutional neural network (CNNs) based image diagnosis for failure analysis of power devices. Microelectronics Reliability, 100, 113399.","journal-title":"Microelectronics Reliability"},{"key":"2245_CR30","doi-asserted-by":"publisher","first-page":"198","DOI":"10.1016\/j.procir.2016.03.046","volume":"47","author":"S Xiao","year":"2016","unstructured":"Xiao, S., Hu, Y., Han, J., Zhou, R., & Wen, J. (2016). Bayesian networks-based association rules and knowledge reuse in maintenance decision-making of industrial product-service systems. Procedia Cirp, 47, 198\u2013203.","journal-title":"Procedia Cirp"},{"key":"2245_CR31","doi-asserted-by":"publisher","unstructured":"Xie, Y., Li, S., Wu, C., Lai, Z., & Su, M. (2022). A novel hypergraph convolution network for wafer defect patterns identification based on an unbalanced dataset. Journal of Intelligent Manufacturing, 1\u201314. https:\/\/doi.org\/10.1007\/s10845-022-02067-z.","DOI":"10.1007\/s10845-022-02067-z."},{"key":"2245_CR32","doi-asserted-by":"publisher","DOI":"10.1016\/j.ress.2021.107530","volume":"211","author":"Z Xu","year":"2021","unstructured":"Xu, Z., & Saleh, J. H. (2021). Machine learning for reliability engineering and safety applications: Review of current status and future opportunities. Reliability Engineering & System Safety, 211, 107530.","journal-title":"Reliability Engineering & System Safety"}],"updated-by":[{"DOI":"10.1007\/s10845-023-02310-1","type":"correction","label":"Correction","source":"publisher","updated":{"date-parts":[[2023,12,30]],"date-time":"2023-12-30T00:00:00Z","timestamp":1703894400000}}],"container-title":["Journal of Intelligent Manufacturing"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/s10845-023-02245-7.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/link.springer.com\/article\/10.1007\/s10845-023-02245-7\/fulltext.html","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/s10845-023-02245-7.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,4]],"date-time":"2025-01-04T23:14:15Z","timestamp":1736032455000},"score":1,"resource":{"primary":{"URL":"https:\/\/link.springer.com\/10.1007\/s10845-023-02245-7"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,11,9]]},"references-count":32,"journal-issue":{"issue":"1","published-print":{"date-parts":[[2025,1]]}},"alternative-id":["2245"],"URL":"https:\/\/doi.org\/10.1007\/s10845-023-02245-7","relation":{"correction":[{"id-type":"doi","id":"10.1007\/s10845-023-02310-1","asserted-by":"object"}]},"ISSN":["0956-5515","1572-8145"],"issn-type":[{"value":"0956-5515","type":"print"},{"value":"1572-8145","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,11,9]]},"assertion":[{"value":"29 June 2023","order":1,"name":"received","label":"Received","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"10 October 2023","order":2,"name":"accepted","label":"Accepted","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"9 November 2023","order":3,"name":"first_online","label":"First Online","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"30 December 2023","order":4,"name":"change_date","label":"Change Date","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"Correction","order":5,"name":"change_type","label":"Change Type","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"A Correction to this paper has been published:","order":6,"name":"change_details","label":"Change Details","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"https:\/\/doi.org\/10.1007\/s10845-023-02310-1","URL":"https:\/\/doi.org\/10.1007\/s10845-023-02310-1","order":7,"name":"change_details","label":"Change Details","group":{"name":"ArticleHistory","label":"Article History"}},{"order":1,"name":"Ethics","group":{"name":"EthicsHeading","label":"Declarations"}},{"value":"The authors declare that they have no conflict of interest and have no competing interests.","order":2,"name":"Ethics","group":{"name":"EthicsHeading","label":"Conflict of interest"}}]}}