{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,24]],"date-time":"2026-03-24T03:17:02Z","timestamp":1774322222035,"version":"3.50.1"},"reference-count":38,"publisher":"Springer Science and Business Media LLC","issue":"5","license":[{"start":{"date-parts":[[2024,5,14]],"date-time":"2024-05-14T00:00:00Z","timestamp":1715644800000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"},{"start":{"date-parts":[[2024,5,14]],"date-time":"2024-05-14T00:00:00Z","timestamp":1715644800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":["J Intell Manuf"],"published-print":{"date-parts":[[2025,6]]},"DOI":"10.1007\/s10845-024-02413-3","type":"journal-article","created":{"date-parts":[[2024,5,14]],"date-time":"2024-05-14T20:20:11Z","timestamp":1715718011000},"page":"3271-3284","update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":5,"title":["A multimodal fusion method for soldering quality online inspection"],"prefix":"10.1007","volume":"36","author":[{"given":"Jian","family":"Xie","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yu","family":"Guo","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Daoyuan","family":"Liu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4446-1733","authenticated-orcid":false,"given":"Shaohua","family":"Huang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kaiwen","family":"Zheng","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yaning","family":"Tao","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"297","published-online":{"date-parts":[[2024,5,14]]},"reference":[{"key":"2413_CR1","doi-asserted-by":"publisher","unstructured":"Arevalo, J., Solorio, T., Montes-y-G\u00f3mez, M., & Gonz\u00e1lez, F. A. (2017). Gated multimodal units for information fusion. arXiv:1702.01992. https:\/\/doi.org\/10.48550\/arXiv.1702.01992.","DOI":"10.48550\/arXiv.1702.01992"},{"key":"2413_CR2","doi-asserted-by":"publisher","first-page":"217","DOI":"10.1016\/j.promfg.2020.01.029","volume":"38","author":"S Cao","year":"2019","unstructured":"Cao, S., Parviziomran, I., Park, S., & Won, D. (2019a). Statistical Analysis for Component Shift in pick and place process of Surface Mount Technology. Procedia Manufacturing, 38, 217\u2013224. https:\/\/doi.org\/10.1016\/j.promfg.2020.01.029.","journal-title":"Procedia Manufacturing"},{"key":"2413_CR3","doi-asserted-by":"publisher","first-page":"210","DOI":"10.1016\/j.promfg.2020.01.316","volume":"39","author":"S Cao","year":"2019","unstructured":"Cao, S., Parviziomran, I., Yang, H., Park, S., & Won, D. (2019b). Prediction of component shifts in pick and place process of surface mount technology using support vector regression. Procedia Manufacturing, 39, 210\u2013217. https:\/\/doi.org\/10.1016\/j.promfg.2020.01.316.","journal-title":"Procedia Manufacturing"},{"key":"2413_CR4","doi-asserted-by":"publisher","first-page":"101004","DOI":"10.1016\/j.aei.2019.101004","volume":"43","author":"W Dai","year":"2020","unstructured":"Dai, W., Mujeeb, A., Erdt, M., & Sourin, A. (2020). Soldering defect detection in automatic optical inspection. Advanced Engineering Informatics, 43, 101004. https:\/\/doi.org\/10.1016\/j.aei.2019.101004.","journal-title":"Advanced Engineering Informatics"},{"key":"2413_CR5","doi-asserted-by":"publisher","unstructured":"Dorfer, M., Arzt, A., & Widmer, G. (2016). Towards score following in sheet music images. arXiv:1612.05050. https:\/\/doi.org\/10.48550\/arXiv.1612.05050.","DOI":"10.48550\/arXiv.1612.05050"},{"key":"2413_CR6","doi-asserted-by":"publisher","unstructured":"He, K., Zhang, X., Ren, S., & Sun, J. (2016). Deep residual learning for image recognition. Proceedings of the IEEE conference on computer vision and pattern recognition, Las Vegas, NV, USA. https:\/\/doi.org\/10.1109\/CVPR.2016.90.","DOI":"10.1109\/CVPR.2016.90"},{"issue":"8","key":"2413_CR7","doi-asserted-by":"publisher","first-page":"1735","DOI":"10.1162\/neco.1997.9.8.1735","volume":"9","author":"S Hochreiter","year":"1997","unstructured":"Hochreiter, S., & Schmidhuber, J. (1997). Long short-term memory. Neural Computation, 9(8), 1735\u20131780. https:\/\/doi.org\/10.1162\/neco.1997.9.8.1735.","journal-title":"Neural Computation"},{"key":"2413_CR8","doi-asserted-by":"publisher","first-page":"102132","DOI":"10.1016\/j.rcim.2021.102132","volume":"71","author":"N Khader","year":"2021","unstructured":"Khader, N., & Yoon, S. W. (2021). Adaptive optimal control of stencil printing process using reinforcement learning. Robotics and Computer Integrated Manufacturing, 71, 102132. https:\/\/doi.org\/10.1016\/j.rcim.2021.102132.","journal-title":"Robotics and Computer Integrated Manufacturing"},{"key":"2413_CR9","doi-asserted-by":"publisher","unstructured":"Kong, Y., Chae, J., Kim, M., Lee, Y., & Cho, K. (2020). Study on SMT Quality Monitoring by Auto Optical Inspection. 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), Singapore, Singapore. https:\/\/doi.org\/10.1109\/EPTC50525.2020.9315137.","DOI":"10.1109\/EPTC50525.2020.9315137"},{"key":"2413_CR10","doi-asserted-by":"publisher","first-page":"641","DOI":"10.1007\/s10845-016-1270-6","volume":"30","author":"CFJ Kuo","year":"2019","unstructured":"Kuo, C. F. J., Fang, T. Y., Lee, C. L., & Wu, H. C. (2019). Automated optical inspection system for surface mount device light emitting diodes. Journal of Intelligent Manufacturing, 30, 641\u2013655. https:\/\/doi.org\/10.1007\/s10845-016-1270-6.","journal-title":"Journal of Intelligent Manufacturing"},{"key":"2413_CR11","doi-asserted-by":"publisher","unstructured":"Laurier, C., Grivolla, J., & Herrera, P. (2008). Multimodal music mood classification using audio and lyrics. 2008 seventh international conference on machine learning and applications, San Diego, CA, USA. https:\/\/doi.org\/10.1109\/ICMLA.2008.96.","DOI":"10.1109\/ICMLA.2008.96"},{"key":"2413_CR12","doi-asserted-by":"publisher","first-page":"315","DOI":"10.1016\/j.neucom.2022.02.077","volume":"488","author":"H Li","year":"2022","unstructured":"Li, H., Hao, K., Wei, B., Tang, X. S., & Hu, Q. (2022). A reliable solder joint inspection method based on a light-weight point cloud network and modulated loss. Neurocomputing, 488, 315\u2013327. https:\/\/doi.org\/10.1016\/j.neucom.2022.02.077.","journal-title":"Neurocomputing"},{"key":"2413_CR15","doi-asserted-by":"publisher","unstructured":"Liu, Z., Shen, Y., Lakshminarasimhan, V. B., Liang, P. P., Zadeh, A., & Morency, L. P. (2018). Efficient low-rank multimodal fusion with modality-specific factors. arXiv:1806.00064. https:\/\/doi.org\/10.48550\/arXiv.1806.00064.","DOI":"10.48550\/arXiv.1806.00064"},{"issue":"10\u201311","key":"2413_CR13","doi-asserted-by":"publisher","first-page":"1077","DOI":"10.1080\/0951192X.2021.1901319","volume":"35","author":"T Liu","year":"2022","unstructured":"Liu, T., Bao, J., Wang, J., & Wang, J. (2022). Deep learning for industrial image: Challenges, methods for enriching the sample space and restricting the hypothesis space, and possible issue. International Journal of Computer Integrated Manufacturing, 35(10\u201311), 1077\u20131106. https:\/\/doi.org\/10.1080\/0951192X.2021.1901319.","journal-title":"International Journal of Computer Integrated Manufacturing"},{"key":"2413_CR14","doi-asserted-by":"publisher","first-page":"601","DOI":"10.1016\/j.jmsy.2023.05.026","volume":"68","author":"T Liu","year":"2023","unstructured":"Liu, T., Zheng, P., & Bao, J. (2023). Deep learning-based welding image recognition: A comprehensive review. Journal of Manufacturing Systems, 68, 601\u2013625. https:\/\/doi.org\/10.1016\/j.jmsy.2023.05.026.","journal-title":"Journal of Manufacturing Systems"},{"issue":"12","key":"2413_CR16","doi-asserted-by":"publisher","first-page":"2490","DOI":"10.1109\/TCPMT.2019.2934487","volume":"9","author":"H Lu","year":"2019","unstructured":"Lu, H., Wang, H., Sang, W. Y., & Won, D. (2019). Real-time stencil printing process optimization using a hybrid multi-layer online sequential extreme learning machine and evolutionary search approach. IEEE Transactions on Components Packaging and Manufacturing Technology, 9(12), 2490\u20132498. https:\/\/doi.org\/10.1109\/TCPMT.2019.2934487.","journal-title":"IEEE Transactions on Components Packaging and Manufacturing Technology"},{"key":"2413_CR17","doi-asserted-by":"publisher","first-page":"100933","DOI":"10.1016\/j.aei.2019.100933","volume":"42","author":"A Mujeeb","year":"2019","unstructured":"Mujeeb, A., Dai, W., Erdt, M., & Sourin, A. (2019). One class based feature learning approach for defect detection using deep autoencoders. Advanced Engineering Informatics, 42, 100933. https:\/\/doi.org\/10.1016\/j.aei.2019.100933.","journal-title":"Advanced Engineering Informatics"},{"key":"2413_CR18","doi-asserted-by":"publisher","first-page":"806","DOI":"10.1016\/J.JMAPRO.2020.12.050","volume":"62","author":"Q Nazir","year":"2021","unstructured":"Nazir, Q., & Shao, C. (2021). Online tool condition monitoring for ultrasonic metal welding via sensor fusion and machine learning. Journal of Manufacturing Processes, 62, 806\u2013816. https:\/\/doi.org\/10.1016\/J.JMAPRO.2020.12.050.","journal-title":"Journal of Manufacturing Processes"},{"key":"2413_CR19","doi-asserted-by":"publisher","unstructured":"Neumayer, R., & Rauber, A. (2007). Integration of text and audio features for genre classification in music information retrieval. Advances in Information Retrieval, ECIR 2007, Berlin, Heidelberg. https:\/\/doi.org\/10.1007\/978-3-540-71496-5_78.","DOI":"10.1007\/978-3-540-71496-5_78"},{"key":"2413_CR20","doi-asserted-by":"publisher","unstructured":"Ngiam, J., Khosla, A., Kim, M., Nam, J., Lee, H., & Ng, A. Y. (2011). Multimodal deep learning. Proceedings of the 28th International Conference on International Conference on Machine Learning, Bellevue, Washington, USA. https:\/\/doi.org\/10.5555\/3104482.3104569.","DOI":"10.5555\/3104482.3104569"},{"key":"2413_CR21","doi-asserted-by":"publisher","unstructured":"Radosavovic, I., Kosaraju, R. P., Girshick, R., He, K., & Doll\u00e1r, P. (2020). Designing network design spaces. 2020 IEEE\/CVF conference on computer vision and pattern recognition (CVPR), Seattle, WA, USA. https:\/\/doi.org\/10.1109\/CVPR42600.2020.01044.","DOI":"10.1109\/CVPR42600.2020.01044"},{"key":"2413_CR22","doi-asserted-by":"publisher","unstructured":"Raihan, F., & Ce, W. (2017). PCB defect detection using OpenCV with image subtraction method. 2017 International Conference on Information Management and Technology (ICIMTech), Yogyakarta, Indonesia. https:\/\/doi.org\/10.1109\/ICIMTech.2017.8273538.","DOI":"10.1109\/ICIMTech.2017.8273538"},{"key":"2413_CR23","doi-asserted-by":"publisher","unstructured":"Schindler, A., & Rauber, A. (2015). An audio-visual approach to music genre classification through affective color features. Advances in Information Retrieval, ECIR 2015, Vienna, Austria. https:\/\/doi.org\/10.1007\/978-3-319-16354-3_8.","DOI":"10.1007\/978-3-319-16354-3_8"},{"issue":"1","key":"2413_CR24","doi-asserted-by":"publisher","first-page":"2949","DOI":"10.5555\/2627435.2697059","volume":"15","author":"N Srivastava","year":"2012","unstructured":"Srivastava, N., & Salakhutdinov, R. R. (2012). Multimodal learning with deep boltzmann machines. The Journal of Machine Learning Research, 15(1), 2949\u20132980. https:\/\/doi.org\/10.5555\/2627435.2697059.","journal-title":"The Journal of Machine Learning Research"},{"key":"2413_CR25","doi-asserted-by":"publisher","unstructured":"Tan, M., & Le, Q. V. (2019). Efficientnet: Rethinking model scaling for convolutional neural networks. Proceedings of the 36th International Conference on Machine Learning, PMLR. https:\/\/doi.org\/10.48550\/arXiv.1905.11946.","DOI":"10.48550\/arXiv.1905.11946"},{"issue":"3","key":"2413_CR26","doi-asserted-by":"publisher","first-page":"374","DOI":"10.1016\/j.cie.2007.08.001","volume":"54","author":"TN Tsai","year":"2008","unstructured":"Tsai, T. N. (2008). Modeling and optimization of stencil printing operations: A comparison study. Computers & Industrial Engineering, 54(3), 374\u2013389. https:\/\/doi.org\/10.1016\/j.cie.2007.08.001.","journal-title":"Computers & Industrial Engineering"},{"key":"2413_CR27","doi-asserted-by":"publisher","first-page":"102129","DOI":"10.1016\/j.rcim.2021.102129","volume":"71","author":"H Wang","year":"2021","unstructured":"Wang, H., Lu, H., Alelaumi, S. M., & Yoon, S. W. (2021). A wavelet-based multi-dimensional temporal recurrent neural network for stencil printing performance prediction. Robotics and Computer-Integrated Manufacturing, 71, 102129. https:\/\/doi.org\/10.1016\/j.rcim.2021.102129.","journal-title":"Robotics and Computer-Integrated Manufacturing"},{"issue":"1","key":"2413_CR28","doi-asserted-by":"publisher","first-page":"417","DOI":"10.1016\/j.cirp.2016.04.072","volume":"65","author":"D Weimer","year":"2016","unstructured":"Weimer, D., Scholz-Reiter, B., & Shpitalni, M. (2016). Design of deep convolutional neural network architectures for automated feature extraction in industrial inspection. CIRP Annals, 65(1), 417\u2013420. https:\/\/doi.org\/10.1016\/j.cirp.2016.04.072.","journal-title":"CIRP Annals"},{"issue":"3","key":"2413_CR31","doi-asserted-by":"publisher","first-page":"164","DOI":"10.1108\/SSMT-08-2016-0016","volume":"29","author":"H Wu","year":"2017","unstructured":"Wu, H. (2017). Solder joint defect classification based on ensemble learning. Soldering & Surface Mount Technology, 29(3), 164\u2013170. https:\/\/doi.org\/10.1108\/SSMT-08-2016-0016.","journal-title":"Soldering & Surface Mount Technology"},{"issue":"5","key":"2413_CR29","doi-asserted-by":"publisher","first-page":"517","DOI":"10.1016\/j.rcim.2014.03.003","volume":"30","author":"F Wu","year":"2014","unstructured":"Wu, F., & Zhang, X. (2014). An inspection and classification method for chip solder joints using color grads and boolean rules. Robotics and Computer Integrated Manufacturing, 30(5), 517\u2013526. https:\/\/doi.org\/10.1016\/j.rcim.2014.03.003.","journal-title":"Robotics and Computer Integrated Manufacturing"},{"issue":"3","key":"2413_CR30","doi-asserted-by":"publisher","first-page":"516","DOI":"10.1109\/TCPMT.2012.2231902","volume":"3","author":"H Wu","year":"2013","unstructured":"Wu, H., Zhang, X., Xie, H., Kuang, Y., & Ouyang, G. (2013). Classification of solder joint using feature selection based on Bayes and support vector machine. IEEE Transactions on Components Packaging and Manufacturing Technology, 3(3), 516\u2013522. https:\/\/doi.org\/10.1109\/TCPMT.2012.2231902.","journal-title":"IEEE Transactions on Components Packaging and Manufacturing Technology"},{"key":"2413_CR32","doi-asserted-by":"publisher","first-page":"1829","DOI":"10.1007\/s10845-021-01766-3","volume":"33","author":"Z Xiao","year":"2022","unstructured":"Xiao, Z., Wang, Z., Liu, D., & Wang, H. (2022). A path planning algorithm for PCB surface quality automatic inspection. Journal of Intelligent Manufacturing, 33, 1829\u20131841. https:\/\/doi.org\/10.1007\/s10845-021-01766-3.","journal-title":"Journal of Intelligent Manufacturing"},{"issue":"12","key":"2413_CR33","doi-asserted-by":"publisher","first-page":"2018","DOI":"10.1109\/TCPMT.2011.2168531","volume":"1","author":"H Xie","year":"2012","unstructured":"Xie, H., Zhang, X., Kuang, Y., & Ouyang, G. (2012). Solder joint inspection method for chip component using improved adaboost and decision tree. IEEE Transactions on Components Packaging & Manufacturing Technology, 1(12), 2018\u20132027. https:\/\/doi.org\/10.1109\/TCPMT.2011.2168531.","journal-title":"IEEE Transactions on Components Packaging & Manufacturing Technology"},{"key":"2413_CR34","doi-asserted-by":"publisher","unstructured":"Xie, S., Girshick, R., Doll\u00e1r, P., Tu, Z., & He, K. (2017). Aggregated residual transformations for deep neural networks. 2017 IEEE Conference on Computer Vision and Pattern Recognition (CVPR), Honolulu, HI, USA. https:\/\/doi.org\/10.1109\/CVPR.2017.634.","DOI":"10.1109\/CVPR.2017.634"},{"key":"2413_CR35","doi-asserted-by":"publisher","unstructured":"Yu, X., Xue, Y., Zhang, L., Wang, L., Liu, T., & Zhu, D. (2023). NoisyNN: Exploring the Influence of Information Entropy Change in Learning Systems. arXiv:2309.10625. https:\/\/doi.org\/10.48550\/arXiv.2309.10625.","DOI":"10.48550\/arXiv.2309.10625"},{"key":"2413_CR36","doi-asserted-by":"publisher","unstructured":"Zadeh, A., Chen, M., Poria, S., Cambria, E., & Morency, L. P. (2017). Tensor Fusion Network for Multimodal Sentiment Analysis. Proceedings of the 2017 Conference on Empirical Methods in Natural Language Processing, Copenhagen, Denmark. https:\/\/doi.org\/10.18653\/v1\/D17-1115.","DOI":"10.18653\/v1\/D17-1115"},{"issue":"2","key":"2413_CR37","doi-asserted-by":"publisher","first-page":"576","DOI":"10.3390\/app11020576","volume":"11","author":"K Zhang","year":"2021","unstructured":"Zhang, K., & Shen, H. (2021). Solder joint defect detection in the connectors using improved faster-rcnn algorithm. Applied Sciences, 11(2), 576. https:\/\/doi.org\/10.3390\/app11020576.","journal-title":"Applied Sciences"},{"key":"2413_CR38","doi-asserted-by":"publisher","unstructured":"Zhang, X., Zhou, X., Lin, M., & Sun, J. (2018). Shufflenet: An extremely efficient convolutional neural network for mobile devices. 2018 IEEE\/CVF conference on computer vision and pattern recognition, Salt Lake City, UT, USA. https:\/\/doi.org\/10.1109\/CVPR.2018.00716.","DOI":"10.1109\/CVPR.2018.00716"}],"container-title":["Journal of Intelligent Manufacturing"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/s10845-024-02413-3.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/link.springer.com\/article\/10.1007\/s10845-024-02413-3\/fulltext.html","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/s10845-024-02413-3.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,5,19]],"date-time":"2025-05-19T20:50:36Z","timestamp":1747687836000},"score":1,"resource":{"primary":{"URL":"https:\/\/link.springer.com\/10.1007\/s10845-024-02413-3"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,5,14]]},"references-count":38,"journal-issue":{"issue":"5","published-print":{"date-parts":[[2025,6]]}},"alternative-id":["2413"],"URL":"https:\/\/doi.org\/10.1007\/s10845-024-02413-3","relation":{},"ISSN":["0956-5515","1572-8145"],"issn-type":[{"value":"0956-5515","type":"print"},{"value":"1572-8145","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,5,14]]},"assertion":[{"value":"5 July 2023","order":1,"name":"received","label":"Received","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"27 April 2024","order":2,"name":"accepted","label":"Accepted","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"14 May 2024","order":3,"name":"first_online","label":"First Online","group":{"name":"ArticleHistory","label":"Article History"}},{"order":1,"name":"Ethics","group":{"name":"EthicsHeading","label":"Declarations"}},{"value":"The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.","order":2,"name":"Ethics","group":{"name":"EthicsHeading","label":"Competing interest"}}]}}