{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2022,3,29]],"date-time":"2022-03-29T09:53:32Z","timestamp":1648547612302},"reference-count":14,"publisher":"Springer Science and Business Media LLC","issue":"8","license":[{"start":{"date-parts":[[2014,6,16]],"date-time":"2014-06-16T00:00:00Z","timestamp":1402876800000},"content-version":"tdm","delay-in-days":0,"URL":"http:\/\/www.springer.com\/tdm"}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":["Sci. China Inf. Sci."],"published-print":{"date-parts":[[2014,8]]},"DOI":"10.1007\/s11432-014-5138-0","type":"journal-article","created":{"date-parts":[[2014,6,19]],"date-time":"2014-06-19T07:35:13Z","timestamp":1403163313000},"page":"1-7","update-policy":"http:\/\/dx.doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["A CMOS compatible process for monolithic integration of high-aspect-ratio bulk silicon microstructures"],"prefix":"10.1007","volume":"57","author":[{"given":"Liang","family":"Qian","sequence":"first","affiliation":[]},{"given":"ZhenChuan","family":"Yang","sequence":"additional","affiliation":[]},{"given":"GuiZhen","family":"Yan","sequence":"additional","affiliation":[]}],"member":"297","published-online":{"date-parts":[[2014,6,16]]},"reference":[{"key":"5138_CR1","doi-asserted-by":"crossref","first-page":"306","DOI":"10.1109\/JPROC.2007.911064","volume":"96","author":"G K Fedder","year":"2008","unstructured":"Fedder G K, Howe R T, Liu T J K, et al. Technologies for cofabricating MEMS and electronics. Proc IEEE, 2008, 96: 306\u2013322","journal-title":"Proc IEEE"},{"key":"5138_CR2","doi-asserted-by":"crossref","first-page":"609","DOI":"10.1109\/IEDM.1995.499295","volume-title":"Proceedings of International Electron Devices Meeting, San Francisco","author":"J H Smith","year":"1995","unstructured":"Smith J H, Montague S, Sniegowski J J, et al. Embedded micromechanical device for the monolithic integration of MEMS with CMOS. In: Proceedings of International Electron Devices Meeting, San Francisco, 1995. 609\u2013612"},{"key":"5138_CR3","doi-asserted-by":"crossref","first-page":"1860","DOI":"10.1109\/JSSC.2002.804345","volume":"37","author":"J A Geen","year":"2002","unstructured":"Geen J A, Sherman S J, Chang J F, et al. Single-chip surface micromachined integrated gyroscope with 50\u00b0\/h Allan deviation. IEEE J Solid-State Circuit, 2002, 37: 1860\u20131866","journal-title":"IEEE J Solid-State Circuit"},{"key":"5138_CR4","doi-asserted-by":"crossref","first-page":"13","DOI":"10.1109\/MEMSYS.1996.493822","volume-title":"Proceedings of IEEE Micro Electro Mechanical Systems Workshop, San Diego","author":"G K Fedder","year":"1996","unstructured":"Fedder G K, Santhanam S, Reed M L. Laminated high-aspect ratio microstructures in a conventional CMOS process. In: Proceedings of IEEE Micro Electro Mechanical Systems Workshop, San Diego, 1996. 13\u201318"},{"key":"5138_CR5","doi-asserted-by":"crossref","first-page":"93","DOI":"10.1109\/84.993443","volume":"11","author":"H K Xie","year":"2002","unstructured":"Xie H K, Zhu X, Gabriel K J, et al. Post-CMOS processing for high-aspect-ratio integrated silicon microstructures. J Microelectromech Syst, 2002, 11: 93\u2013101","journal-title":"J Microelectromech Syst"},{"key":"5138_CR6","doi-asserted-by":"crossref","first-page":"1152","DOI":"10.1109\/JMEMS.2007.906079","volume":"16","author":"H W Qu","year":"2007","unstructured":"Qu H W, Xie H K. Process development for CMOS-MEMS sensors with robust isolated bulk silicon microstructures. J Microelectromech Syst, 2007, 16: 1152\u20131161","journal-title":"J Microelectromech Syst"},{"key":"5138_CR7","doi-asserted-by":"crossref","first-page":"336","DOI":"10.1088\/0960-1317\/15\/2\/013","volume":"15","author":"J Chae","year":"2005","unstructured":"Chae J, Kulah H, Najafi K. A CMOS-compatible high aspect ratio silicon-on-glass in-plane micro-accelerometer. J Micromech Microeng, 2005, 15: 336\u2013345","journal-title":"J Micromech Microeng"},{"key":"5138_CR8","first-page":"1122","volume-title":"Proceedings of 13th International Conference on Solid-State Sensors, Actuators, Microsystems, Seoul","author":"T D Chen","year":"2005","unstructured":"Chen T D, Kelly T W, Collins D, et al. The next generation integrated MEMS and CMOS process on SOI wafers for overdamped accelerometers. In: Proceedings of 13th International Conference on Solid-State Sensors, Actuators, Microsystems, Seoul, 2005. 1122\u20131125"},{"key":"5138_CR9","doi-asserted-by":"crossref","first-page":"919","DOI":"10.1109\/JMEMS.2010.2055540","volume":"19","author":"H Takao","year":"2010","unstructured":"Takao H, Ichikawa T, Nakata T, et al. A versatile integration technology of SOI-MEMS\/CMOS devices using microbridge interconnection structures. J Microelectromech Syst, 2010, 19: 919\u2013926","journal-title":"J Microelectromech Syst"},{"key":"5138_CR10","first-page":"605","volume-title":"Proceedings of IEEE MEMS Maastricht, Netherland","author":"G Z Yan","year":"2004","unstructured":"Yan G Z, Zhu Y, Wang C W, et al. Integrated bulk micromachined gyroscope using deep trench isolation technology. In: Proceedings of IEEE MEMS Maastricht, Netherland, 2004. 605\u2013608"},{"key":"5138_CR11","first-page":"1130","volume-title":"Proceedings of 13th International Conference on Solid-State Sensors, Actuators and Microsystems, Seoul","author":"Y Zhu","year":"2005","unstructured":"Zhu Y, Yan G Z, Fan J, et al. Post-CMOS process for high-aspect-ratio monolithically integrated single crystal silicon microstructures. In: Proceedings of 13th International Conference on Solid-State Sensors, Actuators and Microsystems, Seoul, 2005. 1130\u20131133"},{"key":"5138_CR12","doi-asserted-by":"crossref","first-page":"636","DOI":"10.1088\/0960-1317\/15\/3\/027","volume":"15","author":"Y Zhu","year":"2005","unstructured":"Zhu Y, Yan G Z, Fan J, et al. Fabrication of keyhole-free ultra-deep high-aspect-ratio isolation trench and its applications. J Micromech Microeng, 2005, 15: 636\u2013642","journal-title":"J Micromech Microeng"},{"key":"5138_CR13","first-page":"506","volume-title":"Proceedings of the 4th Annual IEEE International Conference on Nano\/Micro Engineering and Molecular Systems, Shenzhen","author":"X Mao","year":"2009","unstructured":"Mao X, Yang Z C, Li Z H, et al. The method of prevent footing effect in making SOI micro-mechanical structure. In: Proceedings of the 4th Annual IEEE International Conference on Nano\/Micro Engineering and Molecular Systems, Shenzhen, 2009. 506\u2013509"},{"key":"5138_CR14","doi-asserted-by":"crossref","first-page":"97","DOI":"10.1007\/s00542-003-0313-z","volume":"10","author":"C Chang","year":"2004","unstructured":"Chang C, Abe T, Esashi M. Trench filling characteristics of low stress TEOS\/ozone oxide deposited by PECVD and SACVD. Microsyst Technol, 2004, 10: 97\u2013102","journal-title":"Microsyst Technol"}],"container-title":["Science China Information Sciences"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/s11432-014-5138-0.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/link.springer.com\/article\/10.1007\/s11432-014-5138-0\/fulltext.html","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/s11432-014-5138-0","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,6,1]],"date-time":"2019-06-01T15:37:57Z","timestamp":1559403477000},"score":1,"resource":{"primary":{"URL":"http:\/\/link.springer.com\/10.1007\/s11432-014-5138-0"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,6,16]]},"references-count":14,"journal-issue":{"issue":"8","published-print":{"date-parts":[[2014,8]]}},"alternative-id":["5138"],"URL":"https:\/\/doi.org\/10.1007\/s11432-014-5138-0","relation":{},"ISSN":["1674-733X","1869-1919"],"issn-type":[{"value":"1674-733X","type":"print"},{"value":"1869-1919","type":"electronic"}],"subject":[],"published":{"date-parts":[[2014,6,16]]}}}