{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,13]],"date-time":"2026-01-13T22:09:24Z","timestamp":1768342164491,"version":"3.49.0"},"reference-count":33,"publisher":"Springer Science and Business Media LLC","issue":"4","license":[{"start":{"date-parts":[[2024,8,1]],"date-time":"2024-08-01T00:00:00Z","timestamp":1722470400000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"},{"start":{"date-parts":[[2024,8,1]],"date-time":"2024-08-01T00:00:00Z","timestamp":1722470400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"}],"funder":[{"name":"Science and Technology on Electronic Information Control Laboratory","award":["6142105200203"],"award-info":[{"award-number":["6142105200203"]}]},{"name":"Science and Technology on Electronic Information Control Laboratory","award":["6142105200203"],"award-info":[{"award-number":["6142105200203"]}]},{"name":"Science and Technology on Electronic Information Control Laboratory","award":["6142105200203"],"award-info":[{"award-number":["6142105200203"]}]},{"name":"Science and Technology on Electronic Information Control Laboratory","award":["6142105200203"],"award-info":[{"award-number":["6142105200203"]}]},{"name":"Science and Technology on Electronic Information Control Laboratory","award":["6142105200203"],"award-info":[{"award-number":["6142105200203"]}]},{"name":"Science and Technology on Electronic Information Control Laboratory","award":["6142105200203"],"award-info":[{"award-number":["6142105200203"]}]},{"name":"Science and Technology on Electronic Information Control Laboratory","award":["6142105200203"],"award-info":[{"award-number":["6142105200203"]}]}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":["J Real-Time Image Proc"],"published-print":{"date-parts":[[2024,8]]},"DOI":"10.1007\/s11554-024-01534-5","type":"journal-article","created":{"date-parts":[[2024,8,12]],"date-time":"2024-08-12T11:03:12Z","timestamp":1723460592000},"update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":1,"title":["Automatic detection of defects in electronic plastic packaging using deep convolutional neural networks"],"prefix":"10.1007","volume":"21","author":[{"given":"Wanchun","family":"Ren","sequence":"first","affiliation":[]},{"given":"Pengcheng","family":"Zhu","sequence":"additional","affiliation":[]},{"given":"Shaofeng","family":"Cai","sequence":"additional","affiliation":[]},{"given":"Yi","family":"Huang","sequence":"additional","affiliation":[]},{"given":"Haoran","family":"Zhao","sequence":"additional","affiliation":[]},{"given":"Youji","family":"Hama","sequence":"additional","affiliation":[]},{"given":"Zhu","family":"Yan","sequence":"additional","affiliation":[]},{"given":"Tao","family":"Zhou","sequence":"additional","affiliation":[]},{"given":"Junde","family":"Pu","sequence":"additional","affiliation":[]},{"given":"Hongwei","family":"Yang","sequence":"additional","affiliation":[]}],"member":"297","published-online":{"date-parts":[[2024,8,12]]},"reference":[{"key":"1534_CR1","doi-asserted-by":"crossref","unstructured":"Cai, J.B., Li, W., Chen, X.L., et al.: Investigation on failures of plastic package devices with unidentifiable defects related to deficient molding process. In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT), Guangzhou, China, pp. 1\u20135 (2020)","DOI":"10.1109\/ICEPT50128.2020.9202908"},{"key":"1534_CR2","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1109\/TIM.2021.3123218","volume":"70","author":"ZJ Wang","year":"2021","unstructured":"Wang, Z.J., Yi, Z.X., Qin, M., et al.: Low-drift MEMS thermal wind sensor with symmetric packaging using plastic injection molding process. IEEE Trans. Instrum. Meas. 70, 1\u20138 (2021)","journal-title":"IEEE Trans. Instrum. Meas."},{"key":"1534_CR3","volume-title":"MicroSystem Based on SiP Technology","author":"S Li","year":"2023","unstructured":"Li, S.: MicroSystem Based on SiP Technology. Springer Nature Singapore, Singapore (2023)"},{"key":"1534_CR4","doi-asserted-by":"crossref","unstructured":"Angelov, G., Rusev, R., Nikolov, D., et al.: Identifying of delamination in integrated circuits using surface acoustic microscopy. In: 2021 XXX International Scientific Conference Electronics (ET), Sozopol, Bulgaria, pp. 1\u20135. IEEE (2021)","DOI":"10.1109\/ET52713.2021.9579909"},{"key":"1534_CR5","doi-asserted-by":"crossref","unstructured":"Kravchenko, G., Bohm, C.: A study of chip top delamination in plastic encapsulated packages under temperature loading. In: 2007 9th Electronics Packaging Technology Conference, Singapore, pp. 675\u2013679. IEEE (2007)","DOI":"10.1109\/EPTC.2007.4469777"},{"key":"1534_CR6","doi-asserted-by":"crossref","unstructured":"Cai, J.B., Chen, X.L., Wu, H.W., et al.: Typical failure mechanisms of plastic encapsulated devices\u2019 internal connection. In: 2016 17th International Conference on Electronic Packaging Technology (ICEPT), Wuhan, China, pp. 1323\u20131326. IEEE (2016)","DOI":"10.1109\/ICEPT.2016.7583367"},{"key":"1534_CR7","doi-asserted-by":"crossref","unstructured":"Liao, X.Y., Ye, L.Z., Zhang, Y.L.Z.: Study on chip defect detection algorithm based on ultrasonic scanning. In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), Dalian, China, pp. 1\u20136. IEEE (2022)","DOI":"10.1109\/ICEPT56209.2022.9873413"},{"issue":"4","key":"1534_CR8","doi-asserted-by":"publisher","first-page":"042064","DOI":"10.1088\/1742-6596\/1885\/4\/042064","volume":"1885","author":"HL Zhao","year":"2021","unstructured":"Zhao, H.L., Zhang, K., Zhou, Z.H., et al.: Effect of environmental factors on ultrasound detection of plastic encapsulated microcircuits. J. Phys. Conf. Ser. 1885(4), 042064 (2021)","journal-title":"J. Phys. Conf. Ser."},{"issue":"5","key":"1534_CR9","doi-asserted-by":"publisher","first-page":"052054","DOI":"10.1088\/1742-6596\/1885\/5\/052054","volume":"1885","author":"HL Zhao","year":"2021","unstructured":"Zhao, H.L., Zhang, K., Zhou, Z.H., et al.: Analysis of scanning acoustic microscopy problems for plastic encapsulated microcircuits with complex structure. J. Phys. Conf. Ser. 1885(5), 052054 (2021)","journal-title":"J. Phys. Conf. Ser."},{"key":"1534_CR10","doi-asserted-by":"crossref","unstructured":"Hullinger, A.K., Duffalo, J.M., Niederkorn, A.J., et al.: Evaluation of a plastic encapsulated package using a scalable thermal mechanical test chip. In: 33rd IEEE International Reliability Physics Symposium, pp. 112\u2012115. IEEE, Las Vegas, NV (1995)","DOI":"10.1109\/RELPHY.1995.513663"},{"key":"1534_CR11","doi-asserted-by":"crossref","unstructured":"Liang, Y.F., Zhang, S.J.: A case study of the delamination analysis of plastic encapsulated microcircuits based on scanning acoustic microscope inspection. In: 2014 Prognostics and System Health Management Conference (PHM-2014 Hunan), Zhangiiaijie City, China, pp. 190\u2012193. IEEE (2014)","DOI":"10.1109\/PHM.2014.6988161"},{"issue":"2","key":"1534_CR12","doi-asserted-by":"publisher","first-page":"257","DOI":"10.1109\/TIM.2017.2775345","volume":"67","author":"JW Chen","year":"2018","unstructured":"Chen, J.W., Liu, Z.G., Wang, H.R., et al.: Automatic defect detection of fasteners on the catenary support device using deep convolutional neural network. IEEE Trans. Instrum. Meas. 67(2), 257\u2013269 (2018)","journal-title":"IEEE Trans. Instrum. Meas."},{"key":"1534_CR13","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1016\/j.compind.2014.10.006","volume":"66","author":"SH Huang","year":"2015","unstructured":"Huang, S.H., Pan, Y.C.: Automated visual inspection in the semiconductor industry: a survey. Comput. Ind. 66, 1\u201310 (2015)","journal-title":"Comput. Ind."},{"key":"1534_CR14","doi-asserted-by":"publisher","first-page":"114587","DOI":"10.1016\/j.microrel.2022.114587","volume":"135","author":"SL Pang","year":"2022","unstructured":"Pang, S.L., Chen, M.Y., Ta, S.W., et al.: Void and solder joint detection for chip resistors based on X-ray images and deep neural networks. Microelectron. Reliab. 135, 114587 (2022)","journal-title":"Microelectron. Reliab."},{"key":"1534_CR15","doi-asserted-by":"publisher","first-page":"257","DOI":"10.1016\/j.microrel.2018.10.013","volume":"91","author":"TJ Su","year":"2018","unstructured":"Su, T.J., Chen, Y.F., Cheng, J.C., et al.: An artificial neural network approach for wafer dicing saw quality prediction. Microelectron. Reliab. 91, 257\u2013261 (2018)","journal-title":"Microelectron. Reliab."},{"issue":"10","key":"1534_CR16","doi-asserted-by":"publisher","first-page":"6111","DOI":"10.1007\/s00521-019-04097-w","volume":"32","author":"L Wen","year":"2019","unstructured":"Wen, L., Li, X.Y., Gao, L.: A transfer convolutional neural network for fault diagnosis based on ResNet-50. Neural Comput. Appl. 32(10), 6111\u20136124 (2019)","journal-title":"Neural Comput. Appl."},{"key":"1534_CR17","doi-asserted-by":"crossref","unstructured":"Xie, X.X., Cheng, G., Wang, J.B., et al.: Oriented R-CNN for object detection. In: Proceedings of the IEEE\/CVF International Conference on Computer Vision, pp. 3520\u20133529 (2021)","DOI":"10.1109\/ICCV48922.2021.00350"},{"issue":"3","key":"1534_CR18","doi-asserted-by":"publisher","first-page":"189","DOI":"10.3390\/ijgi11030189","volume":"11","author":"LL Zhou","year":"2022","unstructured":"Zhou, L.L., Rao, X.H., Li, Y.H., et al.: A lightweight object detection method in aerial images based on dense feature fusion path aggregation network. ISPRS Int. J. Geo-Inf. 11(3), 189 (2022)","journal-title":"ISPRS Int. J. Geo-Inf."},{"issue":"4","key":"1534_CR19","doi-asserted-by":"publisher","first-page":"2073","DOI":"10.3390\/app13042073","volume":"13","author":"HP Zhou","year":"2023","unstructured":"Zhou, H.P., Guo, W., Zhao, Q.: An anchor-free network for increasing attention to small objects in high resolution remote sensing images. Appl. Sci. 13(4), 2073 (2023)","journal-title":"Appl. Sci."},{"issue":"9\u201312","key":"1534_CR20","doi-asserted-by":"publisher","first-page":"3465","DOI":"10.1007\/s00170-017-0882-0","volume":"94","author":"T Wang","year":"2018","unstructured":"Wang, T., Chen, Y., Qiao, M.N., et al.: A fast and robust convolutional neural network-based defect detection model in product quality control. Int. J. Adv. Manuf. Technol. 94(9\u201312), 3465\u20133471 (2018)","journal-title":"Int. J. Adv. Manuf. Technol."},{"issue":"4","key":"1534_CR21","doi-asserted-by":"publisher","first-page":"040801","DOI":"10.1115\/1.4049535","volume":"21","author":"PM Bhatt","year":"2021","unstructured":"Bhatt, P.M., Malhan, R., Rajendran, P., et al.: Image-based surface defect detection using deep learning: a review. J. Comput. Inf. Sci. Eng. 21(4), 040801 (2021)","journal-title":"J. Comput. Inf. Sci. Eng."},{"key":"1534_CR22","doi-asserted-by":"crossref","unstructured":"Sandler, M., Howard, A., Zhu, M.L., et al.: MobileNetV2: inverted residuals and linear bottlenecks. In: 2018 IEEE\/CVF Conference on Computer Vision and Pattern Recognition, pp. 4510\u20124520. IEEE, Salt Lake City, UT (2018)","DOI":"10.1109\/CVPR.2018.00474"},{"key":"1534_CR23","doi-asserted-by":"crossref","unstructured":"Liu S.W., Kong W.M., Chen X.F., et al.: Multi-scale ship detection algorithm based on a lightweight neural network for spaceborne SAR images. Remote Sens. 14, 5, p.1149 (2022)","DOI":"10.3390\/rs14051149"},{"issue":"1","key":"1534_CR24","first-page":"11","volume":"13","author":"R Ma","year":"2022","unstructured":"Ma, R., Wang, J., Zhao, W., et al.: Identification of maize seed varieties using mobileNetV2 with improved attention mechanism CBAM. Agric. BASEL 13(1), 11 (2022)","journal-title":"Agric. BASEL"},{"issue":"3","key":"1534_CR25","doi-asserted-by":"publisher","first-page":"353","DOI":"10.3390\/e24030353","volume":"24","author":"A Vecvanags","year":"2022","unstructured":"Vecvanags, A., Aktas, K., Pavlovs, I., et al.: Ungulate detection and species classification from camera trap images using RetinaNet and faster R-CNN. Entropy 24(3), 353 (2022)","journal-title":"Entropy"},{"issue":"2","key":"1534_CR26","doi-asserted-by":"publisher","first-page":"1489","DOI":"10.1109\/TPAMI.2022.3164083","volume":"45","author":"YH Li","year":"2022","unstructured":"Li, Y.H., Yao, T., Pan, Y.W., et al.: Contextual transformer networks for visual recognition. IEEE Trans. Pattern Anal. Mach. Intell. 45(2), 1489\u20131500 (2022)","journal-title":"IEEE Trans. Pattern Anal. Mach. Intell."},{"key":"1534_CR27","doi-asserted-by":"publisher","first-page":"107024","DOI":"10.1109\/ACCESS.2021.3100369","volume":"9","author":"CY Wang","year":"2021","unstructured":"Wang, C.Y., Zhong, C.M.: Adaptive feature pyramid networks for object detection. IEEE Access. 9, 107024\u2013107032 (2021)","journal-title":"IEEE Access."},{"key":"1534_CR28","doi-asserted-by":"crossref","unstructured":"Chen, Q., Wang, Y.M., Yang, T., et al.: You only look one-level feature. In: Proceedings of the IEEE\/CVF Conference on Computer Vision and Pattern Recognition, pp. 13039\u201313048 (2021)","DOI":"10.1109\/CVPR46437.2021.01284"},{"key":"1534_CR29","doi-asserted-by":"crossref","unstructured":"Lin, T.Y., Dollar, P., Girshick, R., et al.: Feature pyramid networks for object detection. In: Proceedings of the IEEE Conference on Computer Vision and Pattern Recognition, pp. 2117\u20132125 (2017)","DOI":"10.1109\/CVPR.2017.106"},{"issue":"3","key":"1534_CR30","doi-asserted-by":"publisher","first-page":"1207","DOI":"10.3390\/app12031207","volume":"12","author":"Z Qiu","year":"2022","unstructured":"Qiu, Z., Zhu, X., Liao, C., Shi, D., Qu, W.: Detection of transmission line insulator defects based on an improved lightweight YOLOv4 model. Appl. Sci. BASEL 12(3), 1207 (2022)","journal-title":"Appl. Sci. BASEL"},{"issue":"1","key":"1534_CR31","doi-asserted-by":"publisher","first-page":"83","DOI":"10.1186\/s13007-020-00624-2","volume":"16","author":"J Liu","year":"2020","unstructured":"Liu, J., Wang, X.W.: Early recognition of tomato gray leaf spot disease based on MobileNetv2-YOLOv3 model. Plant Methods 16(1), 83 (2020)","journal-title":"Plant Methods"},{"key":"1534_CR32","doi-asserted-by":"publisher","first-page":"110425","DOI":"10.1016\/j.measurement.2021.110425","volume":"188","author":"M Koklu","year":"2022","unstructured":"Koklu, M., Unlersen, M.F., Ozkan, I.A., et al.: A CNN-SVM study based on selected deep features for grapevine leaves classification. Measurement 188, 110425 (2022)","journal-title":"Measurement"},{"issue":"4","key":"1534_CR33","doi-asserted-by":"publisher","first-page":"957","DOI":"10.1007\/s10596-022-10135-9","volume":"26","author":"Y Arouri","year":"2022","unstructured":"Arouri, Y., Sayyafzadeh, M.: An adaptive moment estimation framework for well placement optimization. Comput. Geosci. 26(4), 957\u2013973 (2022)","journal-title":"Comput. Geosci."}],"container-title":["Journal of Real-Time Image Processing"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/s11554-024-01534-5.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/link.springer.com\/article\/10.1007\/s11554-024-01534-5\/fulltext.html","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/s11554-024-01534-5.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,11,26]],"date-time":"2024-11-26T16:28:14Z","timestamp":1732638494000},"score":1,"resource":{"primary":{"URL":"https:\/\/link.springer.com\/10.1007\/s11554-024-01534-5"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,8]]},"references-count":33,"journal-issue":{"issue":"4","published-print":{"date-parts":[[2024,8]]}},"alternative-id":["1534"],"URL":"https:\/\/doi.org\/10.1007\/s11554-024-01534-5","relation":{},"ISSN":["1861-8200","1861-8219"],"issn-type":[{"value":"1861-8200","type":"print"},{"value":"1861-8219","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,8]]},"assertion":[{"value":"16 November 2023","order":1,"name":"received","label":"Received","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"1 August 2024","order":2,"name":"accepted","label":"Accepted","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"12 August 2024","order":3,"name":"first_online","label":"First Online","group":{"name":"ArticleHistory","label":"Article History"}},{"order":1,"name":"Ethics","group":{"name":"EthicsHeading","label":"Declarations"}},{"value":"The authors declare no competing interests.","order":2,"name":"Ethics","group":{"name":"EthicsHeading","label":"Conflict of interest"}}],"article-number":"152"}}