{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,19]],"date-time":"2025-11-19T11:19:25Z","timestamp":1763551165902,"version":"3.28.0"},"reference-count":26,"publisher":"Springer Science and Business Media LLC","issue":"3","license":[{"start":{"date-parts":[[2024,1,4]],"date-time":"2024-01-04T00:00:00Z","timestamp":1704326400000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"},{"start":{"date-parts":[[2024,1,4]],"date-time":"2024-01-04T00:00:00Z","timestamp":1704326400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":["SIViP"],"published-print":{"date-parts":[[2024,4]]},"DOI":"10.1007\/s11760-023-02930-3","type":"journal-article","created":{"date-parts":[[2024,1,4]],"date-time":"2024-01-04T20:02:18Z","timestamp":1704398538000},"page":"2559-2569","update-policy":"http:\/\/dx.doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":2,"title":["A robust algorithm for rapid pre-alignment of multiple types and sizes of wafers"],"prefix":"10.1007","volume":"18","author":[{"given":"Qingshan","family":"Tang","sequence":"first","affiliation":[]},{"given":"Xinwei","family":"Huang","sequence":"additional","affiliation":[]},{"given":"Yongqi","family":"Miao","sequence":"additional","affiliation":[]},{"given":"Jiang","family":"Huang","sequence":"additional","affiliation":[]}],"member":"297","published-online":{"date-parts":[[2024,1,4]]},"reference":[{"key":"2930_CR1","doi-asserted-by":"publisher","first-page":"261","DOI":"10.3321\/j.issn:1002-0446.2007.03.013","volume":"29","author":"M Cong","year":"2007","unstructured":"Cong, M., Du, Y., Shen, B., Jin, L., Baek, S.Y.: Robotics for integrated circuit fabrication: a review. Robotics 29, 261\u2013266 (2007). https:\/\/doi.org\/10.3321\/j.issn:1002-0446.2007.03.013","journal-title":"Robotics"},{"key":"2930_CR2","doi-asserted-by":"publisher","first-page":"5340","DOI":"10.3390\/app10155340","volume":"10","author":"J Chien","year":"2020","unstructured":"Chien, J., Wu, M., Lee, J.: Inspection and classification of semiconductor wafer surface defects using cnn deep learning networks. Appl. Sci. 10, 5340 (2020). https:\/\/doi.org\/10.3390\/app10155340","journal-title":"Appl. Sci."},{"key":"2930_CR3","doi-asserted-by":"crossref","unstructured":"Wan, F., Luo, H., Liu, J.: Online high-precision vision measurement method for large-size gear parameters. In: Proceedings of the 2019 2nd International Conference on Robot Systems and Applications, Moscow, Russia, pp. 20\u201324 (2019)","DOI":"10.1145\/3378891.3378895"},{"key":"2930_CR4","doi-asserted-by":"publisher","first-page":"12002","DOI":"10.1088\/1742-6596\/806\/1\/012002","volume":"806","author":"JH Shim","year":"2017","unstructured":"Shim, J.H., Nam, T.H.: Machine vision based automatic measurement algorithm of concentricity for large size mechanical parts. J. Phys: Confer. Ser. 806, 12002 (2017). https:\/\/doi.org\/10.1088\/1742-6596\/806\/1\/012002","journal-title":"J. Phys: Confer. Ser."},{"key":"2930_CR5","doi-asserted-by":"crossref","unstructured":"Huang, C., Cao, Q., Fu,Z.: A novel wafer pre-aligner based on multi-sensor integration. In: Proceedings of the 7th World Congress on Intelligent Control and Automation, Chongqing, China, pp. 3455\u20133458 (2008)","DOI":"10.1109\/WCICA.2008.4593473"},{"key":"2930_CR6","doi-asserted-by":"publisher","unstructured":"Rong, W., Song, Y., Qiao, S., Sun, L., Zhao, Y., Li, C.: Research on wafer pre-alignment system. Robotics (2007). https:\/\/doi.org\/10.13973\/j.cnki.robot.2007.04.001","DOI":"10.13973\/j.cnki.robot.2007.04.001"},{"key":"2930_CR7","doi-asserted-by":"publisher","first-page":"77","DOI":"10.1108\/01445150810849046","volume":"28","author":"C Huang","year":"2008","unstructured":"Huang, C., Cao, Q., Fu, Z., Leng, C.: Development of a wafer pre-aligner based on multi-sensor integration. Assem. Autom. 28, 77\u201382 (2008). https:\/\/doi.org\/10.1108\/01445150810849046","journal-title":"Assem. Autom."},{"key":"2930_CR8","unstructured":"Wu, Q., Miao, X., Ou, J. et al.: High precision wafer alignment system based on machine vision. In: Proceedings of the 9th National Conference on Information Acquisition and Processing II, vol. 4 (2011)"},{"key":"2930_CR9","doi-asserted-by":"publisher","first-page":"1771","DOI":"10.1109\/TASE.2016.2645234","volume":"14","author":"J Xu","year":"2017","unstructured":"Xu, J., Hu, H., Lei, Y., Liu, H.: A wafer pre-alignment algorithm based on fourier transform and least squares regression. IEEE Trans. Autom. Sci. Eng. 14, 1771\u20131777 (2017). https:\/\/doi.org\/10.1109\/TASE.2016.2645234","journal-title":"IEEE Trans. Autom. Sci. Eng."},{"issue":"5","key":"2930_CR10","doi-asserted-by":"publisher","first-page":"956","DOI":"10.3390\/mi14050956","volume":"14","author":"J Chen","year":"2023","unstructured":"Chen, J., Zhou, L., Cheng, X., Lan, J., Liu, Z., Yang, Y.: A wafer pre-alignment algorithm based on weighted Fourier series fitting of circles and least squares fitting of circles. Micromachines 14(5), 956 (2023). https:\/\/doi.org\/10.3390\/mi14050956","journal-title":"Micromachines"},{"issue":"09","key":"2930_CR11","doi-asserted-by":"publisher","first-page":"13","DOI":"10.19652\/j.cnki.femt.2102724","volume":"40","author":"K Wei","year":"2021","unstructured":"Wei, K., Zhang, W., Jiang, F.: Improvement of dark area image based on Retinex algorithm. Foreign Electron. Meas. Technol. 40(09), 13\u201317 (2021). https:\/\/doi.org\/10.19652\/j.cnki.femt.2102724","journal-title":"Foreign Electron. Meas. Technol."},{"issue":"18","key":"2930_CR12","doi-asserted-by":"publisher","first-page":"98","DOI":"10.16080\/j.issn1671-833x.2022.18.098","volume":"65","author":"H Zhang","year":"2022","unstructured":"Zhang, H., Li, H., Yu, G.: Sub-pixel detection method of riveting hole diameter based on improved zernike moments. Aviat. Manuf. Technol. 65(18), 98\u2013104 (2022). https:\/\/doi.org\/10.16080\/j.issn1671-833x.2022.18.098","journal-title":"Aviat. Manuf. Technol."},{"issue":"08","key":"2930_CR13","first-page":"259","volume":"39","author":"M Liu","year":"2018","unstructured":"Liu, M., Zhu, W., Ye, S.: Sub-pixel edge detection of small modulus gears based on improved Zernike moments. J. Instrum. 39(08), 259\u2013267 (2018)","journal-title":"J. Instrum."},{"key":"2930_CR14","doi-asserted-by":"crossref","unstructured":"Zhang, Z., Hao, X., Cheng, C.: Camera pose estimation based on coplanar straight line iterative weighted least squares. Opt. Precis. Eng. 24(05), 1168\u20131175 (2016)","DOI":"10.3788\/OPE.20162405.1168"},{"key":"2930_CR15","doi-asserted-by":"crossref","unstructured":"Liu, X., Sun, G.: Research on non-contact pre-alignment system and control technology. Electron. Ind. Spec. Equip. 43(02), 18\u201322+32 (2014)","DOI":"10.59238\/j.pt.2014.02.002"},{"key":"2930_CR16","doi-asserted-by":"crossref","unstructured":"Li, H., Qiu, T., Song, H.: Traffic sign separation algorithm based on curvature scale space corner detection. Acta Opt. Sin. 35(01), 247\u2013255 (2015)","DOI":"10.3788\/AOS201535.0115002"},{"issue":"11","key":"2930_CR17","first-page":"2315","volume":"43","author":"W Zhang","year":"2015","unstructured":"Zhang, W., Kong, X., Song, W.: A survey on corner detection of images. Chin. J. Electron. 43(11), 2315\u20132321 (2015)","journal-title":"Chin. J. Electron."},{"key":"2930_CR18","unstructured":"Lu, M., He, H.: A vision-based wafer pre-alignment platform and alignment method. Jiangsu Province: CN116072583A (2023)"},{"key":"2930_CR19","unstructured":"Wang, Z.: A wafer deflection angle detection device based on machine vision. Shanghai: CN211977845U (2020)"},{"key":"2930_CR20","unstructured":"Teng, F., Peng, T., Xu, K.: A Transparent wafer locating detection device. Jiangsu: CN216246094U (2022)"},{"issue":"1","key":"2930_CR21","doi-asserted-by":"publisher","first-page":"100","DOI":"10.1016\/j.microrel.2005.06.005","volume":"46","author":"HT Kim","year":"2006","unstructured":"Kim, H.T., Song, C.S., Yang, H.J.: Algorithm for automatic alignment in 2D space by object transformation. Microelectron. Rel. 46(1), 100\u2013108 (2006)","journal-title":"Microelectron. Rel."},{"key":"2930_CR22","doi-asserted-by":"crossref","unstructured":"Kim, H., Yang, H., Kim, S.: The wafer alignment algorithm regardless of rotational center. In: Proc. IEEE Int. Conf. Mechatronics, pp. 44\u201348 (2006)","DOI":"10.1109\/ICMECH.2006.252494"},{"issue":"2","key":"2930_CR23","first-page":"377","volume":"7","author":"H Kim","year":"2009","unstructured":"Kim, H., Lee, K., Jeon, B., Song, C.: Quick wafer alignment using feedforward neural networks. IEEE Trans. Autom. Sci. Eng. 7(2), 377\u2013382 (2009)","journal-title":"IEEE Trans. Autom. Sci. Eng."},{"key":"2930_CR24","unstructured":"Li, C. J.: Research on the pre-alignment system of wafer processing. Harbin Institute of Technology (2006)"},{"key":"2930_CR25","unstructured":"Zhang, P.: Research on wafer pre-alignment technology. Northeastern University (2015)"},{"key":"2930_CR26","doi-asserted-by":"crossref","unstructured":"Chen, M.-F., Ho, Y.-S., Wang, S.-M.: A fast positioning method with pattern tracking for automatic wafer alignment. In: Proc. IEEE Conf. Image Signal Process., pp. 1594\u20131598 (2010)","DOI":"10.1109\/CISP.2010.5647710"}],"container-title":["Signal, Image and Video Processing"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/s11760-023-02930-3.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/link.springer.com\/article\/10.1007\/s11760-023-02930-3\/fulltext.html","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/s11760-023-02930-3.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,11,7]],"date-time":"2024-11-07T13:00:33Z","timestamp":1730984433000},"score":1,"resource":{"primary":{"URL":"https:\/\/link.springer.com\/10.1007\/s11760-023-02930-3"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,1,4]]},"references-count":26,"journal-issue":{"issue":"3","published-print":{"date-parts":[[2024,4]]}},"alternative-id":["2930"],"URL":"https:\/\/doi.org\/10.1007\/s11760-023-02930-3","relation":{},"ISSN":["1863-1703","1863-1711"],"issn-type":[{"type":"print","value":"1863-1703"},{"type":"electronic","value":"1863-1711"}],"subject":[],"published":{"date-parts":[[2024,1,4]]},"assertion":[{"value":"10 November 2023","order":1,"name":"received","label":"Received","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"23 November 2023","order":2,"name":"revised","label":"Revised","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"30 November 2023","order":3,"name":"accepted","label":"Accepted","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"4 January 2024","order":4,"name":"first_online","label":"First Online","group":{"name":"ArticleHistory","label":"Article History"}},{"order":1,"name":"Ethics","group":{"name":"EthicsHeading","label":"Declarations"}},{"value":"The authors have no competing interests.","order":2,"name":"Ethics","group":{"name":"EthicsHeading","label":"Conflict of interest"}},{"value":"Not applicable.","order":3,"name":"Ethics","group":{"name":"EthicsHeading","label":"Ethical approval"}}]}}