{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,7]],"date-time":"2026-07-07T11:14:06Z","timestamp":1783422846748,"version":"3.54.6"},"reference-count":42,"publisher":"Springer Science and Business Media LLC","issue":"6-7","license":[{"start":{"date-parts":[[2024,6,22]],"date-time":"2024-06-22T00:00:00Z","timestamp":1719014400000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"},{"start":{"date-parts":[[2024,6,22]],"date-time":"2024-06-22T00:00:00Z","timestamp":1719014400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":["SIViP"],"published-print":{"date-parts":[[2024,8]]},"DOI":"10.1007\/s11760-024-03139-8","type":"journal-article","created":{"date-parts":[[2024,6,22]],"date-time":"2024-06-22T03:02:27Z","timestamp":1719025347000},"page":"4945-4959","update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":16,"title":["A real-time PCB defect detection model based on enhanced semantic information fusion"],"prefix":"10.1007","volume":"18","author":[{"given":"Tangyu","family":"Ji","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Qian","family":"Zhao","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Kang","family":"An","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Dandan","family":"Liu","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Wentao","family":"Yu","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shuang","family":"Liang","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"297","published-online":{"date-parts":[[2024,6,22]]},"reference":[{"key":"3139_CR1","doi-asserted-by":"publisher","DOI":"10.3390\/s23187755","author":"B Feng","year":"2023","unstructured":"Feng, B., Cai, J.: Pcb defect detection via local detail and global dependency information. Sensors (2023). https:\/\/doi.org\/10.3390\/s23187755","journal-title":"Sensors"},{"issue":"17","key":"3139_CR2","doi-asserted-by":"publisher","first-page":"19153","DOI":"10.1109\/JSEN.2023.3294994","volume":"23","author":"H Dong","year":"2023","unstructured":"Dong, H., Qi, P., Han, J., Zhang, N., Long, C., Liao, S., Ye, C.: High-resolution magnetic imaging probe with staggered sensor arrays for small defects inspection. IEEE Sens J 23(17), 19153\u201319162 (2023). https:\/\/doi.org\/10.1109\/JSEN.2023.3294994","journal-title":"IEEE Sens J"},{"issue":"8","key":"3139_CR3","doi-asserted-by":"publisher","first-page":"1104","DOI":"10.1109\/TCPMT.2023.3299788","volume":"13","author":"N Jahn","year":"2023","unstructured":"Jahn, N., Pfost, M.: Thermal onboard detection of voids in the solder layer between power semiconductor and pcb. IEEE Transact. Components, Packag. Manuf. Technol. 13(8), 1104\u20131112 (2023). https:\/\/doi.org\/10.1109\/TCPMT.2023.3299788","journal-title":"IEEE Transact. Components, Packag. Manuf. Technol."},{"key":"3139_CR4","doi-asserted-by":"publisher","unstructured":"Chang, Y.-M., Lin, T.-L., Chi, H.-C., Lin, W.-K.: Deep learning-based aoi system for detecting component marks. In: 2023 IEEE International Conference on Big Data and Smart Computing (BigComp), pp. 243\u2013247 (2023). https:\/\/doi.org\/10.1109\/BigComp57234.2023.00046","DOI":"10.1109\/BigComp57234.2023.00046"},{"key":"3139_CR5","doi-asserted-by":"publisher","DOI":"10.1016\/j.measurement.2022.112307","volume":"206","author":"F Wang","year":"2023","unstructured":"Wang, F., Zhou, Y., Zhang, X., Li, Z., Weng, J., Qiang, G., Chen, M., Wang, Y., Yue, H., Liu, J.: Laser-induced thermography: an effective detection approach for multiple-type defects of printed circuit boards (pcbs) multilayer complex structure. Measurement 206, 112307 (2023). https:\/\/doi.org\/10.1016\/j.measurement.2022.112307","journal-title":"Measurement"},{"issue":"3","key":"3139_CR6","doi-asserted-by":"publisher","first-page":"770","DOI":"10.1109\/TEMC.2023.3245140","volume":"65","author":"C-Y Yao","year":"2023","unstructured":"Yao, C.-Y., Liao, W.-J.: An estimation method for emi radiated emissions using measured source voltages. IEEE Transact. Electromagn. Compat. 65(3), 770\u2013779 (2023). https:\/\/doi.org\/10.1109\/TEMC.2023.3245140","journal-title":"IEEE Transact. Electromagn. Compat."},{"key":"3139_CR7","doi-asserted-by":"publisher","unstructured":"Shekhar, H., Jagadish, M., Fahanus, S., Kumar, T.: Image Processing Techniques for PCB Board Fault Analysis with Object Extraction and Measurements, pp. 31\u201340 (2022). https:\/\/doi.org\/10.1007\/978-981-19-3590-9_3","DOI":"10.1007\/978-981-19-3590-9_3"},{"key":"3139_CR8","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1109\/TIM.2023.3298390","volume":"72","author":"G Dwivedi","year":"2023","unstructured":"Dwivedi, G., Pensia, L., Lohchab, V., Kumar, R.: Nondestructive inspection and quantification of soldering defects in pcb using an autofocusing digital holographic camera. IEEE Transact. Instrum. Meas 72, 1\u20138 (2023). https:\/\/doi.org\/10.1109\/TIM.2023.3298390","journal-title":"IEEE Transact. Instrum. Meas"},{"key":"3139_CR9","unstructured":"Reis, D., Kupec, J., Hong, J., Daoudi, A.: Real-Time Flying Object Detection with YOLOv8 (2023)"},{"key":"3139_CR10","doi-asserted-by":"publisher","unstructured":"Han, K., Wang, Y., Tian, Q., Guo, J., Xu, C., Xu, C.: Ghostnet: More features from cheap operations. In: 2020 IEEE\/CVF Conference on Computer Vision and Pattern Recognition (CVPR), pp. 1577\u20131586 (2020). https:\/\/doi.org\/10.1109\/CVPR42600.2020.00165","DOI":"10.1109\/CVPR42600.2020.00165"},{"key":"3139_CR11","unstructured":"Chen, Y., Kalantidis, Y., Li, J., Yan, S., Feng, J.: $$A^2$$-Nets: Double Attention Networks (2018)"},{"key":"3139_CR12","unstructured":"Tong, Z., Chen, Y., Xu, Z., Yu, R.: Wise-IoU: Bounding Box Regression Loss with Dynamic Focusing Mechanism (2023)"},{"key":"3139_CR13","doi-asserted-by":"publisher","DOI":"10.1049\/trit.2019.0019","author":"R Ding","year":"2019","unstructured":"Ding, R., Dai, L., Li, G., Liu, H.: Tdd-net: a tiny defect detection network for printed circuit boards. CAAI Transact. Intell. Technol. (2019). https:\/\/doi.org\/10.1049\/trit.2019.0019","journal-title":"CAAI Transact. Intell. Technol."},{"key":"3139_CR14","unstructured":"Tang, S., He, F., Huang, X., Yang, J.: Online pcb defect detector on a new pcb defect dataset. arXiv:1902.06197 (2019)"},{"issue":"6","key":"3139_CR15","doi-asserted-by":"publisher","first-page":"1137","DOI":"10.1109\/TPAMI.2016.2577031","volume":"39","author":"S Ren","year":"2017","unstructured":"Ren, S., He, K., Girshick, R., Sun, J.: Faster r-cnn: towards real-time object detection with region proposal networks. IEEE Transact. Pattern Anal. Mach. Intell. 39(6), 1137\u20131149 (2017). https:\/\/doi.org\/10.1109\/TPAMI.2016.2577031","journal-title":"IEEE Transact. Pattern Anal. Mach. Intell."},{"key":"3139_CR16","doi-asserted-by":"publisher","unstructured":"He, K., Gkioxari, G., Doll\u00dfr, P., Girshick, R.: Mask r-cnn. In: 2017 IEEE International Conference on Computer Vision (ICCV), pp. 2980\u20132988 (2017). https:\/\/doi.org\/10.1109\/ICCV.2017.322","DOI":"10.1109\/ICCV.2017.322"},{"key":"3139_CR17","unstructured":"Redmon, J., Farhadi, A.: YOLOv3: An Incremental Improvement (2018)"},{"key":"3139_CR18","unstructured":"Bochkovskiy, A., Wang, C.-Y., Liao, H.-Y.M.: Yolov4: Optimal speed and accuracy of object detection. arXiv:2004.10934 (2020)"},{"key":"3139_CR19","doi-asserted-by":"crossref","unstructured":"Wang, C.-Y., Bochkovskiy, A., Liao, H.-Y.M.: Yolov7: Trainable bag-of-freebies sets new state-of-the-art for real-time object detectors. 2023 IEEE\/CVF Conference on Computer Vision and Pattern Recognition (CVPR), 7464\u20137475 (2022)","DOI":"10.1109\/CVPR52729.2023.00721"},{"key":"3139_CR20","doi-asserted-by":"crossref","unstructured":"Liu, W., Anguelov, D., Erhan, D., Szegedy, C., Reed, S.E., Fu, C.-Y., Berg, A.C.: Ssd: single shot multibox detector. In: European Conference on Computer Vision (2015). https:\/\/api.semanticscholar.org\/CorpusID:2141740","DOI":"10.1007\/978-3-319-46448-0_2"},{"key":"3139_CR21","doi-asserted-by":"publisher","first-page":"2269","DOI":"10.3390\/app12052269","volume":"12","author":"C-Y Huang","year":"2022","unstructured":"Huang, C.-Y., Lin, I.-C., Liu, Y.-L.: Applying deep learning to construct a defect detection system for ceramic substrates. Appl. Sci. 12, 2269 (2022). https:\/\/doi.org\/10.3390\/app12052269","journal-title":"Appl. Sci."},{"key":"3139_CR22","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1109\/TCPMT.2022.3147319","volume":"12","author":"M Jeon","year":"2022","unstructured":"Jeon, M., Yoo, S., Kim, S.-W.: A contactless pcba defect detection method: convolutional neural networks with thermographic images. IEEE Transact. Compon. Packag. Manuf. Technol. 12, 1\u20131 (2022). https:\/\/doi.org\/10.1109\/TCPMT.2022.3147319","journal-title":"IEEE Transact. Compon. Packag. Manuf. Technol."},{"key":"3139_CR23","doi-asserted-by":"publisher","unstructured":"Piliposyan, G., Khursheed, S.: Computer vision for hardware trojan detection on a pcb using siamese neural network, pp. 1\u20137 (2022). https:\/\/doi.org\/10.1109\/PAINE56030.2022.10014967","DOI":"10.1109\/PAINE56030.2022.10014967"},{"key":"3139_CR24","doi-asserted-by":"publisher","first-page":"4968","DOI":"10.3390\/s21154968","volume":"21","author":"J Kim","year":"2021","unstructured":"Kim, J., Ko, J., Choi, H., Kim, H.: Printed circuit board defect detection using deep learning via a skip-connected convolutional autoencoder. Sensors 21, 4968 (2021). https:\/\/doi.org\/10.3390\/s21154968","journal-title":"Sensors"},{"key":"3139_CR25","doi-asserted-by":"publisher","unstructured":"Yaohui, K., Yuhang, G., Cheng, L.: Visual alignment system for pcb production based on yolov5, pp. 445\u2013449 (2022). https:\/\/doi.org\/10.1109\/CCDC55256.2022.10034191","DOI":"10.1109\/CCDC55256.2022.10034191"},{"key":"3139_CR26","doi-asserted-by":"publisher","DOI":"10.1016\/j.measurement.2023.113611","volume":"222","author":"N Yao","year":"2023","unstructured":"Yao, N., Zhao, Y., Kong, S., Guo, Y.: Pcb defect detection with self-supervised learning of local image patches. Measurement 222, 113611 (2023). https:\/\/doi.org\/10.1016\/j.measurement.2023.113611","journal-title":"Measurement"},{"key":"3139_CR27","doi-asserted-by":"publisher","DOI":"10.1016\/j.rineng.2023.100968","volume":"17","author":"J Lim","year":"2023","unstructured":"Lim, J., Lim, J., Baskaran, V., Wang, X.: A deep context learning based pcb defect detection model with anomalous trend alarming system. Res. Eng. 17, 100968 (2023). https:\/\/doi.org\/10.1016\/j.rineng.2023.100968","journal-title":"Res. Eng."},{"key":"3139_CR28","doi-asserted-by":"publisher","DOI":"10.1016\/j.eswa.2021.115673","volume":"185","author":"H Zhang","year":"2021","unstructured":"Zhang, H., Jiang, L., Li, C.: Cs-resnet: cost-sensitive residual convolutional neural network for pcb cosmetic defect detection. Expert Syst. Appl. 185, 115673 (2021). https:\/\/doi.org\/10.1016\/j.eswa.2021.115673","journal-title":"Expert Syst. Appl."},{"key":"3139_CR29","doi-asserted-by":"publisher","DOI":"10.3389\/fphy.2021.708097","author":"Y Zhang","year":"2021","unstructured":"Zhang, Y., Xie, F., Huang, L., Shi, J., Yang, J., Li, Z.: A lightweight one-stage defect detection network for small object based on dual attention mechanism and pafpn. Front. Phys. (2021). https:\/\/doi.org\/10.3389\/fphy.2021.708097","journal-title":"Front. Phys."},{"key":"3139_CR30","doi-asserted-by":"publisher","DOI":"10.1016\/j.engappai.2023.106359","volume":"123","author":"W Jiang","year":"2023","unstructured":"Jiang, W., Li, T., Zhang, S., Chen, W., Yang, J.: Pcb defects target detection combining multi-scale and attention mechanism. Eng. Appl. Artif. Intell. 123, 106359 (2023). https:\/\/doi.org\/10.1016\/j.engappai.2023.106359","journal-title":"Eng. Appl. Artif. Intell."},{"key":"3139_CR31","doi-asserted-by":"publisher","DOI":"10.1007\/s11042-023-15495-7","author":"Q Zhao","year":"2023","unstructured":"Zhao, Q., Ji, T., Liang, S., Yu, W.: Pcb surface defect fast detection method based on attention and multi-source fusion. Multimed. Tools Appl. (2023). https:\/\/doi.org\/10.1007\/s11042-023-15495-7","journal-title":"Multimed. Tools Appl."},{"key":"3139_CR32","doi-asserted-by":"publisher","DOI":"10.3390\/electronics12132821","author":"B Du","year":"2023","unstructured":"Du, B., Wan, F., Lei, G., Xu, L., Xu, C., Xiong, Y.: Yolo-mbbi: Pcb surface defect detection method based on enhanced yolov5. Electronics (2023). https:\/\/doi.org\/10.3390\/electronics12132821","journal-title":"Electronics"},{"key":"3139_CR33","doi-asserted-by":"crossref","unstructured":"Yang, Y., Kang. H.: An enhanced detection method of PCB defect based on improved YOLOv7. Electronics. 12(9):2120, (2023)","DOI":"10.3390\/electronics12092120"},{"key":"3139_CR34","doi-asserted-by":"publisher","first-page":"1662","DOI":"10.3390\/electronics12071662","volume":"12","author":"Y Chen","year":"2023","unstructured":"Chen, Y., Tang, Y., Hao, H., Zhou, J., Yuan, H., Zhang, Y., Zhao, Y.: Amff-yolox: towards an attention mechanism and multiple feature fusion based on yolox for industrial defect detection. Electronics 12, 1662 (2023). https:\/\/doi.org\/10.3390\/electronics12071662","journal-title":"Electronics"},{"key":"3139_CR35","doi-asserted-by":"publisher","unstructured":"Qin, R., Chen, N., Huang, Y.: Eddnet: An efficient and accurate defect detection network for the industrial edge environment, pp. 854\u2013863 (2022). https:\/\/doi.org\/10.1109\/QRS57517.2022.00090","DOI":"10.1109\/QRS57517.2022.00090"},{"key":"3139_CR36","doi-asserted-by":"publisher","unstructured":"Li, C.-J., Qu, Z., Wang, S.-Y., Bao, K.-H., Wang, S.-Y.: A method of defect detection for focal hard samples pcb based on extended fpn model. IEEE Transactions on Components, Packaging and Manufacturing Technology PP, 1\u20131 (2021) https:\/\/doi.org\/10.1109\/TCPMT.2021.3136823","DOI":"10.1109\/TCPMT.2021.3136823"},{"key":"3139_CR37","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2023.3311260","author":"B Chen","year":"2023","unstructured":"Chen, B., Dang, Z.: Fast pcb defect detection method based on fasternet backbone network and cbam attention mechanism integrated with feature fusion module in improved yolov7. IEEE Access (2023). https:\/\/doi.org\/10.1109\/ACCESS.2023.3311260","journal-title":"IEEE Access"},{"key":"3139_CR38","doi-asserted-by":"publisher","unstructured":"Liu, J., Li, H., Zuo, F., Zhao, Z., Lu, S.: Kd-lightnet: a lightweight network based on knowledge distillation for industrial defect detection. IEEE Transactions on Instrumentation and Measurement PP, 1\u20131 (2023) https:\/\/doi.org\/10.1109\/TIM.2023.3300421","DOI":"10.1109\/TIM.2023.3300421"},{"key":"3139_CR39","doi-asserted-by":"publisher","first-page":"4211","DOI":"10.3390\/electronics11244211","volume":"11","author":"G Li","year":"2022","unstructured":"Li, G., Zhao, S., Zhou, M., Li, M., Shao, R., Zhang, Z., Han, D.: Yolo-rff: an industrial defect detection method based on expanded field of feeling and feature fusion. Electronics 11, 4211 (2022). https:\/\/doi.org\/10.3390\/electronics11244211","journal-title":"Electronics"},{"key":"3139_CR40","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2022.3208580","author":"W Xuan","year":"2022","unstructured":"Xuan, W., Jian-She, G., Bo-Jie, H., Zong-shan, W., Hong-wei, D., Jie, W.: A lightweight modified yolox network using coordinate attention mechanism for pcb surface defect detection. IEEE Sens. J. (2022). https:\/\/doi.org\/10.1109\/JSEN.2022.3208580","journal-title":"IEEE Sens. J."},{"key":"3139_CR41","doi-asserted-by":"publisher","DOI":"10.1016\/j.eswa.2023.121726","volume":"238","author":"J Tang","year":"2023","unstructured":"Tang, J., Wang, Z., Zhang, H., Li, H., Wu, P., Zeng, N.: A lightweight surface defect detection framework combined with dual-domain attention mechanism. Expert Syst. Appl. 238, 121726 (2023). https:\/\/doi.org\/10.1016\/j.eswa.2023.121726","journal-title":"Expert Syst. Appl."},{"key":"3139_CR42","doi-asserted-by":"publisher","unstructured":"Lim, J., Lim, J., Baskaran, V., Wang, X.: A deep context learning based pcb defect detection model with anomalous trend alarming system. Res. Eng. 17, 100968 (2023). https:\/\/doi.org\/10.1016\/j.rineng.2023.100968","DOI":"10.1016\/j.rineng.2023.100968"}],"container-title":["Signal, Image and Video Processing"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/s11760-024-03139-8.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/link.springer.com\/article\/10.1007\/s11760-024-03139-8\/fulltext.html","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/s11760-024-03139-8.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,7,15]],"date-time":"2024-07-15T04:30:49Z","timestamp":1721017849000},"score":1,"resource":{"primary":{"URL":"https:\/\/link.springer.com\/10.1007\/s11760-024-03139-8"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,6,22]]},"references-count":42,"journal-issue":{"issue":"6-7","published-print":{"date-parts":[[2024,8]]}},"alternative-id":["3139"],"URL":"https:\/\/doi.org\/10.1007\/s11760-024-03139-8","relation":{"has-preprint":[{"id-type":"doi","id":"10.21203\/rs.3.rs-3784279\/v1","asserted-by":"object"}]},"ISSN":["1863-1703","1863-1711"],"issn-type":[{"value":"1863-1703","type":"print"},{"value":"1863-1711","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,6,22]]},"assertion":[{"value":"21 December 2023","order":1,"name":"received","label":"Received","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"7 January 2024","order":2,"name":"revised","label":"Revised","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"16 January 2024","order":3,"name":"accepted","label":"Accepted","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"22 June 2024","order":4,"name":"first_online","label":"First Online","group":{"name":"ArticleHistory","label":"Article History"}},{"order":1,"name":"Ethics","group":{"name":"EthicsHeading","label":"Declarations"}},{"value":"The authors declare that the research was conducted in the absence of any commercial or financial relationships that could be construed as a potential conflict of interest.","order":2,"name":"Ethics","group":{"name":"EthicsHeading","label":"Conflict of interest"}},{"value":"Ethical review and approval was not required for the study on human participants in accordance with the local legislation and institutional requirements. The patients\/participants provided their written informed consent to participate in this study.","order":3,"name":"Ethics","group":{"name":"EthicsHeading","label":"Ethics approval"}},{"value":"All authors have read and agreed to the published version of the manuscript.","order":4,"name":"Ethics","group":{"name":"EthicsHeading","label":"Consent for publication"}}]}}