{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,1]],"date-time":"2026-04-01T18:01:58Z","timestamp":1775066518705,"version":"3.50.1"},"reference-count":16,"publisher":"Springer Science and Business Media LLC","issue":"8","license":[{"start":{"date-parts":[[2022,8,3]],"date-time":"2022-08-03T00:00:00Z","timestamp":1659484800000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"},{"start":{"date-parts":[[2022,8,3]],"date-time":"2022-08-03T00:00:00Z","timestamp":1659484800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":["J Ambient Intell Human Comput"],"published-print":{"date-parts":[[2023,8]]},"DOI":"10.1007\/s12652-022-04345-3","type":"journal-article","created":{"date-parts":[[2022,8,3]],"date-time":"2022-08-03T04:02:27Z","timestamp":1659499347000},"page":"10731-10744","update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":9,"title":["Thermal-aware routing algorithm in partially connected 3D NoC with dynamic availability for elevators"],"prefix":"10.1007","volume":"14","author":[{"given":"Majid","family":"Nezarat","sequence":"first","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6042-0993","authenticated-orcid":false,"given":"Hadi Shahriar","family":"Shahhoseini","sequence":"additional","affiliation":[]},{"given":"Masoomeh","family":"Momeni","sequence":"additional","affiliation":[]}],"member":"297","published-online":{"date-parts":[[2022,8,3]]},"reference":[{"key":"4345_CR1","doi-asserted-by":"crossref","unstructured":"Catania V, Mineo A, Monteleone S, Palesi M, Patti D (2015) Noxim: an open, extensible and cycle-accurate network on chip simulator. In: 2015 IEEE 26th international conference on application-specific systems, architectures and processors (ASAP), pp 162\u2013163\u200f","DOI":"10.1109\/ASAP.2015.7245728"},{"key":"4345_CR2","doi-asserted-by":"crossref","unstructured":"Cui Y, Prabhakar S, Zhao H, Mohanty S, Fang J (2020) A low-cost conflict-free NoC architecture for heterogeneous multicore systems. In: 2020 IEEE computer society annual symposium on VLSI (ISVLSI), pp 300\u2013305","DOI":"10.1109\/ISVLSI49217.2020.00062"},{"issue":"12","key":"4345_CR3","doi-asserted-by":"publisher","first-page":"2122","DOI":"10.1109\/TCPMT.2018.2842102","volume":"8","author":"R Dash","year":"2018","unstructured":"Dash R, Majumdar A, Pangracious V, Turuk AK, Risco-Martin JL (2018) ATAR: an adaptive thermal-aware routing algorithm for 3-D network-on-chip systems. IEEE Trans Compon Packag Manuf Technol 8(12):2122\u20132129","journal-title":"IEEE Trans Compon Packag Manuf Technol"},{"issue":"3","key":"4345_CR4","doi-asserted-by":"publisher","first-page":"609","DOI":"10.1109\/TC.2011.239","volume":"62","author":"F Dubois","year":"2011","unstructured":"Dubois F, Sheibanyrad A, Petrot F, Bahmani M (2011) Elevator-first: a deadlock-free distributed routing algorithm for vertically partially connected 3d-nocs. IEEE Trans Comput 62(3):609\u2013615","journal-title":"IEEE Trans Comput"},{"key":"4345_CR5","doi-asserted-by":"publisher","first-page":"389","DOI":"10.1007\/978-981-15-5400-1_40","volume-title":"Intelligent system design","author":"K Indragandhi","year":"2021","unstructured":"Indragandhi K, Jawahar PK (2021) Core performance based packet priority router for NoC-based heterogeneous multicore processor. In: Satapathy SC et al (eds) Intelligent system design. Springer, Singapore, pp 389\u2013397"},{"key":"4345_CR6","doi-asserted-by":"crossref","unstructured":"Jheng KY, Chao CH, Wang HY, Wu AY (2010) Traffic-thermal mutual-coupling co-simulation platform for three-dimensional network-on-chip. In: Proceedings of 2010 international symposium on VLSI design, automation and test, pp 135\u2013138","DOI":"10.1109\/VDAT.2010.5496709"},{"issue":"5","key":"4345_CR7","doi-asserted-by":"publisher","first-page":"308","DOI":"10.1049\/iet-cds.2011.0349","volume":"6","author":"AM Rahmani","year":"2012","unstructured":"Rahmani AM, Vaddina KR, Latif K, Liljeberg P, Plosila J, Tenhunen H (2012) Design and management of high-performance, reliable and thermal-aware 3D networks-on-chip. IET Circuits Dev Syst 6(5):308\u2013321","journal-title":"IET Circuits Dev Syst"},{"issue":"11","key":"4345_CR8","doi-asserted-by":"publisher","first-page":"3265","DOI":"10.1109\/TC.2016.2532871","volume":"65","author":"R Salamat","year":"2016","unstructured":"Salamat R, Khayambashi M, Ebrahimi M, Bagherzadeh N (2016) A resilient routing algorithm with formal reliability analysis for partially connected 3D-NoCs. IEEE Trans Comput 65(11):3265\u20133279","journal-title":"IEEE Trans Comput"},{"key":"4345_CR9","doi-asserted-by":"crossref","unstructured":"Sheibanyrad A, P\u00e9trot F, Jantsch A (2011) 3D integration for NoC-based SoC architectures. Springer. ISBN: 978-1-4419-7618-5","DOI":"10.1007\/978-1-4419-7618-5"},{"issue":"3","key":"4345_CR10","doi-asserted-by":"publisher","first-page":"819","DOI":"10.1109\/TC.2015.2435748","volume":"65","author":"V Soteriou","year":"2015","unstructured":"Soteriou V, Theocharides T, Kakoulli E (2015) A holistic approach towards intelligent hotspot prevention in network-on-chip-based multicores. IEEE Trans Comput 65(3):819\u2013833","journal-title":"IEEE Trans Comput"},{"issue":"1","key":"4345_CR11","doi-asserted-by":"publisher","first-page":"11","DOI":"10.1049\/iet-cdt.2017.0139","volume":"13","author":"E Taheri","year":"2019","unstructured":"Taheri E, Mohammadi K, Patooghy A (2019a) ON\u2013OFF: a reactive routing algorithm for dynamic thermal management in 3D NoCs. IET Comput Digital Tech 13(1):11\u201319","journal-title":"IET Comput Digital Tech"},{"issue":"7","key":"4345_CR12","doi-asserted-by":"publisher","first-page":"1358","DOI":"10.1109\/TCAD.2019.2917846","volume":"39","author":"E Taheri","year":"2019","unstructured":"Taheri E, Isakov M, Patooghy A, Kinsy MA (2019b) Addressing a new class of reliability threats in 3-D network-on-chips. IEEE Trans Comput Aided Des Integr Circuits Syst 39(7):1358\u20131371","journal-title":"IEEE Trans Comput Aided Des Integr Circuits Syst"},{"issue":"10","key":"4345_CR13","doi-asserted-by":"publisher","first-page":"1676","DOI":"10.1109\/TC.2017.2698456","volume":"66","author":"X Wang","year":"2017","unstructured":"Wang X, Jiang Y, Yang M, Li H, Mak T (2017) HRC: A 3D NoC architecture with genuine support for runtime thermal-aware task management. IEEE Trans Comput 66(10):1676\u20131688","journal-title":"IEEE Trans Comput"},{"issue":"7","key":"4345_CR14","doi-asserted-by":"publisher","first-page":"1373","DOI":"10.1109\/TCAD.2018.2855149","volume":"38","author":"L Wang","year":"2018","unstructured":"Wang L, Wang X, Leung HF, Mak T (2018) A non-minimal routing algorithm for aging mitigation in 2D-mesh NoCs. IEEE Trans Comput Aided Des Integr Circuits Syst 38(7):1373\u20131377","journal-title":"IEEE Trans Comput Aided Des Integr Circuits Syst"},{"key":"4345_CR15","doi-asserted-by":"crossref","unstructured":"Zhao H, Cheng X, Mohanty SP, Fang J (2018) Designing scalable hybrid wireless NoC for GPGPUs. In: 2018 IEEE computer society annual symposium on VLSI (ISVLSI), pp 703\u2013708","DOI":"10.1109\/ISVLSI.2018.00132"},{"key":"4345_CR16","doi-asserted-by":"crossref","unstructured":"Zheng H, Wang K, Louri A (2021) Adapt-NoC: a flexible network-on-chip design for heterogeneous many core architectures. In: 2021 IEEE international symposium on high-performance computer architecture (HPCA), pp 723\u2013735","DOI":"10.1109\/HPCA51647.2021.00066"}],"container-title":["Journal of Ambient Intelligence and Humanized Computing"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/s12652-022-04345-3.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/link.springer.com\/article\/10.1007\/s12652-022-04345-3\/fulltext.html","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/s12652-022-04345-3.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,6,21]],"date-time":"2023-06-21T14:09:05Z","timestamp":1687356545000},"score":1,"resource":{"primary":{"URL":"https:\/\/link.springer.com\/10.1007\/s12652-022-04345-3"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,8,3]]},"references-count":16,"journal-issue":{"issue":"8","published-print":{"date-parts":[[2023,8]]}},"alternative-id":["4345"],"URL":"https:\/\/doi.org\/10.1007\/s12652-022-04345-3","relation":{},"ISSN":["1868-5137","1868-5145"],"issn-type":[{"value":"1868-5137","type":"print"},{"value":"1868-5145","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,8,3]]},"assertion":[{"value":"21 November 2021","order":1,"name":"received","label":"Received","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"11 July 2022","order":2,"name":"accepted","label":"Accepted","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"3 August 2022","order":3,"name":"first_online","label":"First Online","group":{"name":"ArticleHistory","label":"Article History"}}]}}