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Recently, the latest advances in deep learning provide inspiration for image-based tasks and are competitive with human level. In this work, deep learning is introduced in the inspection for quality control. Four joint defect detection models based on artificial intelligence are proposed and compared. The noisy ROI and the change of image dimension problems are addressed. The effectiveness of the proposed models is verified by experiments on real-world 3D X-ray dataset, which saves the specialist inspection workload greatly.<\/jats:p>","DOI":"10.1007\/s40747-021-00600-w","type":"journal-article","created":{"date-parts":[[2022,1,4]],"date-time":"2022-01-04T07:03:04Z","timestamp":1641279784000},"page":"1525-1537","update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":49,"title":["Deep learning based solder joint defect detection on industrial printed circuit board X-ray images"],"prefix":"10.1007","volume":"8","author":[{"given":"Qianru","family":"Zhang","sequence":"first","affiliation":[]},{"given":"Meng","family":"Zhang","sequence":"additional","affiliation":[]},{"given":"Chinthaka","family":"Gamanayake","sequence":"additional","affiliation":[]},{"given":"Chau","family":"Yuen","sequence":"additional","affiliation":[]},{"given":"Zehao","family":"Geng","sequence":"additional","affiliation":[]},{"given":"Hirunima","family":"Jayasekara","sequence":"additional","affiliation":[]},{"given":"Chia-wei","family":"Woo","sequence":"additional","affiliation":[]},{"given":"Jenny","family":"Low","sequence":"additional","affiliation":[]},{"given":"Xiang","family":"Liu","sequence":"additional","affiliation":[]},{"given":"Yong Liang","family":"Guan","sequence":"additional","affiliation":[]}],"member":"297","published-online":{"date-parts":[[2022,1,4]]},"reference":[{"issue":"10","key":"600_CR1","doi-asserted-by":"publisher","first-page":"9928","DOI":"10.1016\/j.eswa.2012.02.100","volume":"39","author":"M Liukkonen","year":"2012","unstructured":"Liukkonen M, Havia E, Hiltunen Y (2012) Computational intelligence in mass soldering of electronics-a survey. 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