{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,29]],"date-time":"2025-12-29T11:25:02Z","timestamp":1767007502511,"version":"3.37.3"},"reference-count":27,"publisher":"Springer Science and Business Media LLC","issue":"3","license":[{"start":{"date-parts":[[2023,4,6]],"date-time":"2023-04-06T00:00:00Z","timestamp":1680739200000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"},{"start":{"date-parts":[[2023,4,6]],"date-time":"2023-04-06T00:00:00Z","timestamp":1680739200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":["SN COMPUT. SCI."],"DOI":"10.1007\/s42979-023-01765-6","type":"journal-article","created":{"date-parts":[[2023,4,6]],"date-time":"2023-04-06T13:04:38Z","timestamp":1680786278000},"update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":8,"title":["Detecting Anomalous Solder Joints in Multi-sliced PCB X-ray Images: A Deep Learning Based Approach"],"prefix":"10.1007","volume":"4","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-8235-5486","authenticated-orcid":false,"given":"Hirunima","family":"Jayasekara","sequence":"first","affiliation":[]},{"given":"Qianru","family":"Zhang","sequence":"additional","affiliation":[]},{"given":"Chau","family":"Yuen","sequence":"additional","affiliation":[]},{"given":"Meng","family":"Zhang","sequence":"additional","affiliation":[]},{"given":"Chia-Wei","family":"Woo","sequence":"additional","affiliation":[]},{"given":"Jenny","family":"Low","sequence":"additional","affiliation":[]}],"member":"297","published-online":{"date-parts":[[2023,4,6]]},"reference":[{"key":"1765_CR1","doi-asserted-by":"publisher","first-page":"36","DOI":"10.1007\/978-3-319-71249-9_3","volume-title":"Joint European Conference on Machine Learning and Knowledge Discovery in Databases","author":"R Chalapathy","year":"2017","unstructured":"Chalapathy R, Menon AK, Chawla S. Robust, deep and inductive anomaly detection. In: Joint European Conference on Machine Learning and Knowledge Discovery in Databases. Berlin: Springer; 2017. p. 36\u201351."},{"key":"1765_CR2","doi-asserted-by":"publisher","first-page":"121","DOI":"10.1016\/j.patcog.2016.03.028","volume":"58","author":"SM Erfani","year":"2016","unstructured":"Erfani SM, Rajasegarar S, Karunasekera S, Leckie C. High-dimensional and large-scale anomaly detection using a linear one-class svm with deep learning. Pattern Recogn. 2016;58:121\u201334.","journal-title":"Pattern Recogn"},{"key":"1765_CR3","unstructured":"Fort S, Ren J, Lakshminarayanan B. Exploring the limits of out-of-distribution detection. In: Advances in Neural Information Processing Systems 2021"},{"issue":"4","key":"1765_CR4","doi-asserted-by":"publisher","first-page":"3030","DOI":"10.1109\/TIE.2016.2643600","volume":"64","author":"H Gao","year":"2016","unstructured":"Gao H, Jin W, Yang X, Kaynak O. A line-based-clustering approach for ball grid array component inspection in surface-mount technology. IEEE Trans Industr Electron. 2016;64(4):3030\u20138.","journal-title":"IEEE Trans Industr Electron"},{"key":"1765_CR5","unstructured":"Hendrycks D, Gimpel K. A baseline for detecting misclassified and out-of-distribution examples in neural networks. In: International Conference on Learning Representations 2017."},{"key":"1765_CR6","unstructured":"Hendrycks D, Mazeika M, Dietterich T. Deep anomaly detection with outlier exposure. In: International Conference on Learning Representations 2019."},{"issue":"12","key":"1765_CR7","doi-asserted-by":"publisher","first-page":"3507","DOI":"10.1016\/j.patcog.2013.06.005","volume":"46","author":"M Kemmler","year":"2013","unstructured":"Kemmler M, Rodner E, Wacker ES, Denzler J. One-class classification with gaussian processes. Pattern Recogn. 2013;46(12):3507\u201318.","journal-title":"Pattern Recogn"},{"issue":"3","key":"1765_CR8","doi-asserted-by":"publisher","first-page":"345","DOI":"10.1017\/S026988891300043X","volume":"29","author":"SS Khan","year":"2014","unstructured":"Khan SS, Madden MG. One-class classification: taxonomy of study and review of techniques. Knowl Eng Rev. 2014;29(3):345\u201374.","journal-title":"Knowl Eng Rev"},{"key":"1765_CR9","unstructured":"Kolesnikov A, Dosovitskiy A, Weissenborn D, Heigold G, Uszkoreit J, Beyer L, Minderer M, Dehghani M, Houlsby N, Gelly S, Unterthiner T, Zhai X. An image is worth 16x16 words: Transformers for image recognition at scale 2021."},{"key":"1765_CR10","unstructured":"Koner R, Sinhamahapatra P, Roscher K, G\u00fcnnemann S, Tresp V. Oodformer: Out-of-distribution detection transformer. arXiv preprint arXiv:2107.08976 2021."},{"key":"1765_CR11","unstructured":"Krizhevsky A, Hinton G, et\u00a0al. Learning multiple layers of features from tiny images 2009."},{"key":"1765_CR12","unstructured":"Lee K, Lee H, Lee K, Shin J. Training confidence-calibrated classifiers for detecting out-of-distribution samples. In: International Conference on Learning Representations 2018."},{"key":"1765_CR13","unstructured":"Liang S, Li Y, Srikant R. Enhancing the reliability of out-of-distribution image detection in neural networks. In: International Conference on Learning Representations 2017."},{"key":"1765_CR14","doi-asserted-by":"publisher","first-page":"263","DOI":"10.1007\/978-3-030-04167-0_24","volume-title":"Neural information processing","author":"BJ Lin","year":"2018","unstructured":"Lin BJ, Tsan TC, Tung TC, Lee YH, Fuh CS. Use 3d convolutional neural network to inspect solder ball defects. In: Cheng L, Leung ACS, Ozawa S, editors. Neural information processing. Cham: Springer International Publishing; 2018. p. 263\u201374."},{"issue":"11","key":"1765_CR15","doi-asserted-by":"publisher","first-page":"4022","DOI":"10.1007\/s10489-019-01486-5","volume":"49","author":"CH Lin","year":"2019","unstructured":"Lin CH, Wang SH, Lin CJ. Using convolutional neural networks for character verification on integrated circuit components of printed circuit boards. Appl Intell. 2019;49(11):4022\u201332.","journal-title":"Appl Intell"},{"issue":"12","key":"1765_CR16","doi-asserted-by":"publisher","first-page":"5620","DOI":"10.1109\/TII.2018.2839614","volume":"14","author":"X Lu","year":"2018","unstructured":"Lu X, He Z, Su L, Fan M, Liu F, Liao G, Shi T. Detection of micro solder balls using active thermography technology and k-means algorithm. IEEE Trans Industr Inf. 2018;14(12):5620\u20138.","journal-title":"IEEE Trans Industr Inf"},{"key":"1765_CR17","doi-asserted-by":"publisher","first-page":"2","DOI":"10.1145\/3439950","volume":"54","author":"G Pang","year":"2021","unstructured":"Pang G, Shen C, Cao L, Hengel AVD. Deep learning for anomaly detection: a review. ACM Comput Surv. 2021;54:2. https:\/\/doi.org\/10.1145\/3439950.","journal-title":"ACM Comput Surv"},{"issue":"11","key":"1765_CR18","doi-asserted-by":"publisher","first-page":"5450","DOI":"10.1109\/TIP.2019.2917862","volume":"28","author":"P Perera","year":"2019","unstructured":"Perera P, Patel VM. Learning deep features for one-class classification. IEEE Trans Image Process. 2019;28(11):5450\u201363.","journal-title":"IEEE Trans Image Process"},{"issue":"1, 2","key":"1765_CR19","first-page":"187","volume":"41","author":"JB Roerdink","year":"2000","unstructured":"Roerdink JB, Meijster A. The watershed transform: Definitions, algorithms and parallelization strategies. Fund Inform. 2000;41(1, 2):187\u2013228.","journal-title":"Fund Inform"},{"key":"1765_CR20","unstructured":"Ruff L, Vandermeulen R, Goernitz N, Deecke L, Siddiqui SA, Binder A, M\u00fcller E, Kloft M. Deep one-class classification. In: International conference on machine learning 2018; 4393\u20134402."},{"key":"1765_CR21","doi-asserted-by":"crossref","unstructured":"Sabokrou M, Khalooei M, Fathy M, Adeli E. Adversarially learned one-class classifier for novelty detection. In: Proceedings of the IEEE Conference on Computer Vision and Pattern Recognition 2018; 3379\u20133388.","DOI":"10.1109\/CVPR.2018.00356"},{"key":"1765_CR22","doi-asserted-by":"publisher","first-page":"30","DOI":"10.1016\/j.media.2019.01.010","volume":"54","author":"T Schlegl","year":"2019","unstructured":"Schlegl T, Seeb\u00f6ck P, Waldstein SM, Langs G, Schmidt-Erfurth U. f-anogan: Fast unsupervised anomaly detection with generative adversarial networks. Med Image Anal. 2019;54:30\u201344.","journal-title":"Med Image Anal"},{"key":"1765_CR23","doi-asserted-by":"publisher","first-page":"15","DOI":"10.1016\/j.chemolab.2015.11.010","volume":"151","author":"Y Xiao","year":"2016","unstructured":"Xiao Y, Wang H, Xu W, Zhou J. Robust one-class svm for fault detection. Chemom Intell Lab Syst. 2016;151:15\u201325.","journal-title":"Chemom Intell Lab Syst"},{"key":"1765_CR24","doi-asserted-by":"crossref","unstructured":"Yung LC. Investigation of the solder void defect in ic semiconductor packaging by 3d computed tomography analysis. In: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), IEEE 2018; 886\u2013889","DOI":"10.1109\/EPTC.2018.8654370"},{"key":"1765_CR25","unstructured":"Zenati H, Foo CS, Lecouat B, Manek G, Chandrasekhar VR. Efficient gan-based anomaly detection. arXiv 2018."},{"issue":"2","key":"1765_CR26","doi-asserted-by":"publisher","first-page":"1525","DOI":"10.1007\/s40747-021-00600-w","volume":"8","author":"Q Zhang","year":"2022","unstructured":"Zhang Q, Zhang M, Gamanayake C, Yuen C, Geng Z, Jayasekara H, Cw Woo, Low J, Liu X, Guan YL. Deep learning based solder joint defect detection on industrial printed circuit board x-ray images. Complex Intell Syst. 2022;8(2):1525\u201337.","journal-title":"Complex Intell Syst"},{"issue":"4","key":"1765_CR27","doi-asserted-by":"publisher","first-page":"600","DOI":"10.1109\/TIP.2003.819861","volume":"13","author":"Zhou Wang","year":"2004","unstructured":"Wang Zhou, Bovik AC, Sheikh HR, Simoncelli EP. Image quality assessment: from error visibility to structural similarity. IEEE Trans Image Process. 2004;13(4):600\u201312.","journal-title":"IEEE Trans Image Process"}],"container-title":["SN Computer Science"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/s42979-023-01765-6.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/link.springer.com\/article\/10.1007\/s42979-023-01765-6\/fulltext.html","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/s42979-023-01765-6.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,4,30]],"date-time":"2023-04-30T10:24:02Z","timestamp":1682850242000},"score":1,"resource":{"primary":{"URL":"https:\/\/link.springer.com\/10.1007\/s42979-023-01765-6"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,4,6]]},"references-count":27,"journal-issue":{"issue":"3","published-online":{"date-parts":[[2023,5]]}},"alternative-id":["1765"],"URL":"https:\/\/doi.org\/10.1007\/s42979-023-01765-6","relation":{},"ISSN":["2661-8907"],"issn-type":[{"type":"electronic","value":"2661-8907"}],"subject":[],"published":{"date-parts":[[2023,4,6]]},"assertion":[{"value":"18 June 2022","order":1,"name":"received","label":"Received","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"5 March 2023","order":2,"name":"accepted","label":"Accepted","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"6 April 2023","order":3,"name":"first_online","label":"First Online","group":{"name":"ArticleHistory","label":"Article History"}},{"order":1,"name":"Ethics","group":{"name":"EthicsHeading","label":"Declarations"}},{"value":"On behalf of all authors, the corresponding author states that there is no conflict of interest.","order":2,"name":"Ethics","group":{"name":"EthicsHeading","label":"Conflict of interest"}},{"value":"Not applicable.","order":3,"name":"Ethics","group":{"name":"EthicsHeading","label":"Ethics approval"}},{"value":"Not applicable.","order":4,"name":"Ethics","group":{"name":"EthicsHeading","label":"Consent to participate"}},{"value":"Not applicable.","order":5,"name":"Ethics","group":{"name":"EthicsHeading","label":"Consent for publication"}}],"article-number":"307"}}