{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2022,4,20]],"date-time":"2022-04-20T17:10:47Z","timestamp":1650474647932},"reference-count":13,"publisher":"Springer Science and Business Media LLC","issue":"2","license":[{"start":{"date-parts":[[2014,9,27]],"date-time":"2014-09-27T00:00:00Z","timestamp":1411776000000},"content-version":"tdm","delay-in-days":0,"URL":"http:\/\/www.springer.com\/tdm"}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":["Appl. Phys. A"],"published-print":{"date-parts":[[2015,2]]},"DOI":"10.1007\/s00339-014-8781-9","type":"journal-article","created":{"date-parts":[[2014,10,25]],"date-time":"2014-10-25T00:57:02Z","timestamp":1414198622000},"page":"691-697","update-policy":"http:\/\/dx.doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["The failure analysis and lifetime prediction for the solder joint of the magnetic head"],"prefix":"10.1007","volume":"118","author":[{"given":"Xianghui","family":"Xiao","sequence":"first","affiliation":[]},{"given":"Minfang","family":"Peng","sequence":"additional","affiliation":[]},{"given":"Jaime S.","family":"Cardoso","sequence":"additional","affiliation":[]},{"given":"Rongjun","family":"Tang","sequence":"additional","affiliation":[]},{"given":"YingLiang","family":"Zhou","sequence":"additional","affiliation":[]}],"member":"297","published-online":{"date-parts":[[2014,9,27]]},"reference":[{"key":"8781_CR1","doi-asserted-by":"crossref","unstructured":"S. Wiese, M. Mueller et al. The creep behaviour and microstructure of ultra small solder joints. mechanical and multiphysics simulation and experiments in microelectronics and microsystems. 2011 12th. Int. Conf. on Thermal (2011)","DOI":"10.1109\/ESIME.2011.5765827"},{"key":"8781_CR2","doi-asserted-by":"crossref","unstructured":"A. Schubert, H. Walter, R. Dudek, B. Michel. Thermal-mechanical properties and creep deformation of lead-containing and lead-free solders. 2001 international Symposium on Advanced Packaging Materials (2001)","DOI":"10.1109\/ISAOM.2001.916562"},{"key":"8781_CR3","doi-asserted-by":"crossref","unstructured":"K. Zhang, J. Yang et al. Research on creep properties of SnAgCuRE lead-free solders joints. IEEE. 2006 7th international conference on electronics packaging technology (2006)","DOI":"10.1109\/ICEPT.2006.359657"},{"key":"8781_CR4","first-page":"258","volume":"15","author":"X Su","year":"2012","unstructured":"X. Su, C. Yu, C. Qiang, Synthesis of a-Fe2O3 nanobelts and nanoflakes by thermal oxidation and study to their magnetic properties. Appl. Surf. Sci. 15, 258 (2012)","journal-title":"Appl. Surf. Sci."},{"key":"8781_CR5","first-page":"7117","volume":"110","author":"H Li","year":"2013","unstructured":"H. Li, D. Wei, S.N. Piramanayagam, Micromagnetic study of effect of tip-coating microstructure on the resolution of magnetic force microscopy. Phys. A 110, 7117 (2013)","journal-title":"Phys. A"},{"key":"8781_CR6","doi-asserted-by":"crossref","first-page":"95","DOI":"10.1016\/S0927-796X(00)00010-3","volume":"27","author":"M Abtewa","year":"2000","unstructured":"M. Abtewa, G. Selvadurayb, Lead-free solders in microelectronics. Mater. Sci. Eng. 27, 95 (2000)","journal-title":"Mater. Sci. Eng."},{"key":"8781_CR7","first-page":"549","volume":"18","author":"Z Zhang","year":"2013","unstructured":"Z. Zhang, J. Li, H. Zhang et al., Thickness-dependent field emission from ZnTe films prepared by magnetron sputtering. J. Alloys. Compd. 18, 549 (2013)","journal-title":"J. Alloys. Compd."},{"key":"8781_CR8","first-page":"8343","volume":"116","author":"L Zhang","year":"2014","unstructured":"L. Zhang, S.-X. Xue, Z.-G. Li et al., FePt-C granular thin film for heat-assisted magnetic recording (HAMR) media. Appl. Phys. A 116, 8343 (2014)","journal-title":"Appl. Phys. A"},{"key":"8781_CR9","first-page":"8394","volume":"116","author":"M Kok","year":"2014","unstructured":"M. Kok, K. Yildiz, Oxidation parameters determination of Cu\u2013Al\u2013Ni\u2013Fe shape-memory alloy at high temperatures. Appl. Phys. A 116, 8394 (2014)","journal-title":"Appl. Phys. A"},{"key":"8781_CR10","first-page":"467","volume":"26","author":"ZX Zhang","year":"2009","unstructured":"Z.X. Zhang, X.J. Pan, T. Wang et al., Electrical properties of nanocrystalline GaN film prepared by magnetron sputtering. J. Alloys. Compd. 26, 467 (2009)","journal-title":"J. Alloys. Compd."},{"key":"8781_CR11","doi-asserted-by":"crossref","first-page":"256","DOI":"10.1016\/S0927-796X(02)00007-4","volume":"38","author":"K Zeng","year":"2002","unstructured":"K. Zeng, K.N. Tu, Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater. Sci. Eng., R 38, 256 (2002)","journal-title":"Mater. Sci. Eng., R"},{"key":"8781_CR12","first-page":"352","volume":"32","author":"KS Kim","year":"2003","unstructured":"K.S. Kim, S.H. Huh, K. Suganuma, Effects of intermetallic compounds on properties of Sn\u2013Ag\u2013Cu lead-free soldered joints. J. Alloy. Compd. 32, 352 (2003)","journal-title":"J. Alloy. Compd."},{"key":"8781_CR13","first-page":"352","volume":"18","author":"KS Kim","year":"2003","unstructured":"K.S. Kim, S.H. Huh, K. Suganuma, Effects of intermetallic compounds on properties of Sn\u2013Ag\u2013Cu lead-free soldered joints. J. Alloy. Compd. 18, 352 (2003)","journal-title":"J. Alloy. Compd."}],"container-title":["Applied Physics A"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/s00339-014-8781-9.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/link.springer.com\/article\/10.1007\/s00339-014-8781-9\/fulltext.html","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/s00339-014-8781-9","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,4,20]],"date-time":"2022-04-20T16:52:19Z","timestamp":1650473539000},"score":1,"resource":{"primary":{"URL":"http:\/\/link.springer.com\/10.1007\/s00339-014-8781-9"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,9,27]]},"references-count":13,"journal-issue":{"issue":"2","published-print":{"date-parts":[[2015,2]]}},"alternative-id":["8781"],"URL":"https:\/\/doi.org\/10.1007\/s00339-014-8781-9","relation":{},"ISSN":["0947-8396","1432-0630"],"issn-type":[{"value":"0947-8396","type":"print"},{"value":"1432-0630","type":"electronic"}],"subject":[],"published":{"date-parts":[[2014,9,27]]}}}