{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,24]],"date-time":"2026-02-24T07:53:45Z","timestamp":1771919625652,"version":"3.50.1"},"reference-count":36,"publisher":"Springer Science and Business Media LLC","issue":"4","license":[{"start":{"date-parts":[[2013,11,29]],"date-time":"2013-11-29T00:00:00Z","timestamp":1385683200000},"content-version":"tdm","delay-in-days":0,"URL":"http:\/\/www.springer.com\/tdm"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["J Appl Electrochem"],"published-print":{"date-parts":[[2014,4]]},"DOI":"10.1007\/s10800-013-0646-y","type":"journal-article","created":{"date-parts":[[2013,11,28]],"date-time":"2013-11-28T07:37:13Z","timestamp":1385624233000},"page":"455-465","source":"Crossref","is-referenced-by-count":91,"title":["Electrodeposition and characterization of nickel\u2013copper metallic foams for application as electrodes for supercapacitors"],"prefix":"10.1007","volume":"44","author":[{"given":"S.","family":"Eug\u00e9nio","sequence":"first","affiliation":[]},{"given":"T. M.","family":"Silva","sequence":"additional","affiliation":[]},{"given":"M. J.","family":"Carmezim","sequence":"additional","affiliation":[]},{"given":"R. G.","family":"Duarte","sequence":"additional","affiliation":[]},{"given":"M. F.","family":"Montemor","sequence":"additional","affiliation":[]}],"member":"297","published-online":{"date-parts":[[2013,11,29]]},"reference":[{"issue":"2","key":"646_CR1","doi-asserted-by":"crossref","first-page":"797","DOI":"10.1039\/C1CS15060J","volume":"41","author":"G Wang","year":"2012","unstructured":"Wang G, Zhang L, Zhang J (2012) A review of electrode materials for electrochemical supercapacitors. Chem Soc Rev 41(2):797\u2013828","journal-title":"Chem Soc Rev"},{"issue":"27","key":"646_CR2","doi-asserted-by":"crossref","first-page":"4544","DOI":"10.1002\/anie.200902994","volume":"49","author":"BC Tappan","year":"2010","unstructured":"Tappan BC, Steiner SA, Luther EP (2010) Nanoporous metal foams. Angew Chem Int Ed 49(27):4544\u20134565","journal-title":"Angew Chem Int Ed"},{"key":"646_CR3","doi-asserted-by":"crossref","first-page":"450","DOI":"10.1038\/35068529","volume":"410","author":"J Erlebacher","year":"2001","unstructured":"Erlebacher J et al (2001) Evolution of nanoporosity in dealloying. Nature 410:450\u2013453","journal-title":"Nature"},{"issue":"42","key":"646_CR4","doi-asserted-by":"crossref","first-page":"22425","DOI":"10.1021\/jp307612g","volume":"116","author":"RP Silva","year":"2012","unstructured":"Silva RP et al (2012) Fabrication of three-dimensional dendritic Ni\u2013Co films by electrodeposition on stainless steel substrates. J Phys Chem C 116(42):22425\u201322431","journal-title":"J Phys Chem C"},{"key":"646_CR5","doi-asserted-by":"crossref","first-page":"560","DOI":"10.1016\/j.surfcoat.2005.12.004","volume":"201","author":"ND Nikoli\u0107","year":"2006","unstructured":"Nikoli\u0107 ND et al (2006) Morphologies of copper deposits obtained by the electrodeposition at high overpotentials. Surf Coat Technol 201:560\u2013566","journal-title":"Surf Coat Technol"},{"key":"646_CR6","doi-asserted-by":"crossref","first-page":"5460","DOI":"10.1021\/cm048887b","volume":"16","author":"H-C Shin","year":"2004","unstructured":"Shin H-C, Liu M (2004) Copper foam structures with highly porous nanostructured walls. Chem Mater 16:5460\u20135464","journal-title":"Chem Mater"},{"key":"646_CR7","doi-asserted-by":"crossref","first-page":"1610","DOI":"10.1002\/adma.200305160","volume":"15","author":"HC Shin","year":"2003","unstructured":"Shin HC, Dong J, Liu M (2003) Nanoporous structures prepared by an electrochemical deposition process. Adv Mater 15:1610\u20131614","journal-title":"Adv Mater"},{"key":"646_CR8","first-page":"197","volume":"51","author":"N Nikoli\u0107","year":"2010","unstructured":"Nikoli\u0107 N (2010) Fundamental aspects of copper electrodeposition in the hydrogen co-deposition range. Za\u0161tita materijala 51:197\u2013203","journal-title":"Za\u0161tita materijala"},{"key":"646_CR9","doi-asserted-by":"crossref","first-page":"667","DOI":"10.1007\/s10008-006-0222-z","volume":"11","author":"ND Nikoli\u0107","year":"2006","unstructured":"Nikoli\u0107 ND et al (2006) Phenomenology of a formation of a honeycomb-like structure during copper electrodeposition. J Solid State Electrochem 11:667\u2013675","journal-title":"J Solid State Electrochem"},{"key":"646_CR10","doi-asserted-by":"crossref","first-page":"5159","DOI":"10.1016\/j.tsf.2010.03.029","volume":"518","author":"K Tan","year":"2010","unstructured":"Tan K, Tian M-B, Cai Q (2010) Effect of bromide ions and polyethylene glycol on morphological control of electrodeposited copper foam. Thin Solid Films 518:5159\u20135163","journal-title":"Thin Solid Films"},{"key":"646_CR11","doi-asserted-by":"crossref","first-page":"9397","DOI":"10.1016\/j.electacta.2011.08.025","volume":"56","author":"D Nam","year":"2011","unstructured":"Nam D et al (2011) Effects of (NH4)2SO4 and BTA on the nanostructure of copper foam prepared by electrodeposition. Electrochim Acta 56:9397\u20139405","journal-title":"Electrochim Acta"},{"key":"646_CR12","doi-asserted-by":"crossref","first-page":"467","DOI":"10.1016\/j.elecom.2010.01.021","volume":"12","author":"S Cherevko","year":"2010","unstructured":"Cherevko S, Xing X, Chung C-H (2010) Electrodeposition of three-dimensional porous silver foams. Electrochem Commun 12:467\u2013470","journal-title":"Electrochem Commun"},{"key":"646_CR13","doi-asserted-by":"crossref","first-page":"6771","DOI":"10.1016\/j.electacta.2011.05.079","volume":"56","author":"G-M Yang","year":"2011","unstructured":"Yang G-M et al (2011) Bubble dynamic templated deposition of three-dimensional palladium nanostructure catalysts: approach to oxygen reduction using macro-, micro-, and nano-architectures on electrode surfaces. Electrochim Acta 56:6771\u20136778","journal-title":"Electrochim Acta"},{"issue":"1","key":"646_CR14","doi-asserted-by":"crossref","first-page":"16","DOI":"10.1016\/j.elecom.2010.11.001","volume":"13","author":"S Cherevko","year":"2011","unstructured":"Cherevko S, Chung C-H (2011) Direct electrodeposition of nanoporous gold with controlled multimodal pore size distribution. Electrochem Commun 13(1):16\u201319","journal-title":"Electrochem Commun"},{"key":"646_CR15","doi-asserted-by":"crossref","first-page":"1028","DOI":"10.1039\/C1JM13760C","volume":"22","author":"W-S Choi","year":"2012","unstructured":"Choi W-S et al (2012) Nanostructured metallic foam electrodeposits on a nonconductive substrate. J Mater Chem 22:1028\u20131032","journal-title":"J Mater Chem"},{"key":"646_CR16","volume-title":"Elements of X-ray diffraction","author":"BD Cullity","year":"1978","unstructured":"Cullity BD (1978) Elements of X-ray diffraction. Addison-Wesley Publishing Company, Boston"},{"key":"646_CR17","volume-title":"Atlas of electrochemical equilibria","author":"M Pourbaix","year":"1974","unstructured":"Pourbaix M (1974) Atlas of electrochemical equilibria, 2nd edn. National Association of Corrosion Engineers, Houston","edition":"2"},{"key":"646_CR18","volume-title":"Electrodeposition of alloys principles and practice","author":"A Brenner","year":"1963","unstructured":"Brenner A (1963) Electrodeposition of alloys principles and practice. Academic Press, San Diego"},{"key":"646_CR19","doi-asserted-by":"crossref","first-page":"1586","DOI":"10.1039\/tf9595501586","volume":"55","author":"E Mattsson","year":"1959","unstructured":"Mattsson E, Bockris JM (1959) Galvanostatic studies of the kinetics of deposition and dissolution in the copper\u00a0+\u00a0copper sulphate system. Trans Faraday Soc 55:1586\u20131601","journal-title":"Trans Faraday Soc"},{"key":"646_CR20","doi-asserted-by":"crossref","first-page":"367","DOI":"10.1016\/j.jelechem.2004.01.025","volume":"572","author":"C Gabrielli","year":"2004","unstructured":"Gabrielli C et al (2004) Mechanism of copper deposition in a sulphate bath containing chlorides. J Electroanal Chem 572:367\u2013375","journal-title":"J Electroanal Chem"},{"key":"646_CR21","doi-asserted-by":"crossref","first-page":"353","DOI":"10.1016\/S0022-0728(02)01050-1","volume":"532","author":"DM Soares","year":"2002","unstructured":"Soares DM et al (2002) Copper ion reduction catalyzed by chloride ions. J Electroanal Chem 532:353\u2013358","journal-title":"J Electroanal Chem"},{"key":"646_CR22","doi-asserted-by":"crossref","first-page":"D201","DOI":"10.1149\/1.2434682","volume":"154","author":"W Shao","year":"2007","unstructured":"Shao W, Pattanaik G, Zangari G (2007) Influence of chloride anions on the mechanism of copper electrodeposition from acidic sulfate electrolytes. J Electrochem Soc 154:D201\u2013D207","journal-title":"J Electrochem Soc"},{"key":"646_CR23","doi-asserted-by":"crossref","first-page":"61","DOI":"10.1016\/S0022-0728(81)80124-6","volume":"119","author":"I Epelboin","year":"1981","unstructured":"Epelboin I, Joussellin M, Wiart R (1981) Impedance measurements for nickel deposition in sulfate and chloride electrolytes. J Electroanal Chem 119:61\u201371","journal-title":"J Electroanal Chem"},{"key":"646_CR24","doi-asserted-by":"crossref","first-page":"957","DOI":"10.1007\/s10800-006-9162-7","volume":"36","author":"R Ori\u0148\u00e1kov\u00e1","year":"2006","unstructured":"Ori\u0148\u00e1kov\u00e1 R et al (2006) Recent developments in the electrodeposition of nickel and some nickel-based alloys. J Appl Electrochem 36:957\u2013972","journal-title":"J Appl Electrochem"},{"issue":"4","key":"646_CR25","doi-asserted-by":"crossref","first-page":"557","DOI":"10.1016\/0013-4686(84)87109-1","volume":"29","author":"A Saraby-Reintjes","year":"1984","unstructured":"Saraby-Reintjes A, Fleischmann M (1984) Kinetics of electrodeposition of nickel from watts baths. Electrochim Acta 29(4):557\u2013566","journal-title":"Electrochim Acta"},{"key":"646_CR26","doi-asserted-by":"crossref","first-page":"D326","DOI":"10.1149\/1.3147263","volume":"156","author":"AIC Santana","year":"2009","unstructured":"Santana AIC et al (2009) A kinetic study on nickel electrodeposition from sulfate acid solutions. J Electrochem Soc 156:D326\u2013D330","journal-title":"J Electrochem Soc"},{"key":"646_CR27","unstructured":"Chakrabarti DJ et al (1992) Cu\u2013Ni (copper\u2013nickel) phase diagram. In: Metals handbook, vol. 3: alloy phase diagrams. ASM International, Russel"},{"key":"646_CR28","doi-asserted-by":"crossref","DOI":"10.1007\/978-1-4757-3058-6","volume-title":"Electrochemical supercapacitors: scientific fundamentals and technological applications","author":"BE Conway","year":"1999","unstructured":"Conway BE (1999) Electrochemical supercapacitors: scientific fundamentals and technological applications. Kluwer Academic, New York"},{"issue":"21","key":"646_CR29","doi-asserted-by":"crossref","first-page":"5493","DOI":"10.1021\/j100072a016","volume":"98","author":"S-L Yau","year":"1994","unstructured":"Yau S-L et al (1994) In situ scanning tunneling microscopy of Ni (100) in 1\u00a0M NaOH. J Phys Chem 98(21):5493\u20135499","journal-title":"J Phys Chem"},{"issue":"8","key":"646_CR30","doi-asserted-by":"crossref","first-page":"F196","DOI":"10.1149\/1.2945911","volume":"155","author":"C\u2013C Hu","year":"2008","unstructured":"Hu C\u2013C, Chang K-H, Hsu T-Y (2008) The synergistic influences of OH\u2212 concentration and electrolyte conductivity on the redox behavior of Ni(OH)2\/NiOOH. J Electrochem Soc 155(8):F196\u2013F200","journal-title":"J Electrochem Soc"},{"key":"646_CR31","doi-asserted-by":"crossref","first-page":"121","DOI":"10.1007\/BF00617670","volume":"8","author":"AMCLd Medina","year":"1978","unstructured":"Medina AMCLd, Marciano SL, Arvia AJ (1978) The potentiodynamic behaviour of copper in NaOH solutions. J Appl Electrochem 8:121\u2013134","journal-title":"J Appl Electrochem"},{"issue":"8","key":"646_CR32","doi-asserted-by":"crossref","first-page":"823","DOI":"10.1023\/B:JACH.0000035612.66363.a3","volume":"34","author":"K Ismail","year":"2004","unstructured":"Ismail K, Fathi A, Badawy W (2004) The influence of Ni content on the stability of copper\u2013nickel alloys in alkaline sulphate solutions. J Appl Electrochem 34(8):823\u2013831","journal-title":"J Appl Electrochem"},{"key":"646_CR33","volume-title":"Electrochemical methods fundamentals and applications","author":"AJ Bard","year":"2001","unstructured":"Bard AJ, Faulkner LR (2001) Electrochemical methods fundamentals and applications. Wiley, New York"},{"issue":"2","key":"646_CR34","doi-asserted-by":"crossref","first-page":"683","DOI":"10.1039\/C0NR00555J","volume":"3","author":"SK Meher","year":"2011","unstructured":"Meher SK, Justin P, Ranga Rao G (2011) Nanoscale morphology dependent pseudocapacitance of NiO. Influence of intercalating anions during synthesis. Nanoscale 3(2):683\u2013692","journal-title":"Nanoscale"},{"issue":"22","key":"646_CR35","doi-asserted-by":"crossref","first-page":"2387","DOI":"10.1002\/elan.200804334","volume":"20","author":"D Menshykau","year":"2008","unstructured":"Menshykau D, Compton RG (2008) The influence of electrode porosity on diffusional cyclic voltammetry. Electroanalysis 20(22):2387\u20132394","journal-title":"Electroanalysis"},{"issue":"17","key":"646_CR36","doi-asserted-by":"crossref","first-page":"4153","DOI":"10.1016\/j.ijhydene.2007.06.001","volume":"32","author":"M-S Wu","year":"2007","unstructured":"Wu M-S et al (2007) Electrodeposition of nanoporous nickel oxide film for electrochemical capacitors. Int J Hydrogen Energy 32(17):4153\u20134159","journal-title":"Int J Hydrogen Energy"}],"container-title":["Journal of Applied Electrochemistry"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/s10800-013-0646-y.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/link.springer.com\/article\/10.1007\/s10800-013-0646-y\/fulltext.html","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/s10800-013-0646-y","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,5,30]],"date-time":"2019-05-30T20:38:03Z","timestamp":1559248683000},"score":1,"resource":{"primary":{"URL":"http:\/\/link.springer.com\/10.1007\/s10800-013-0646-y"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,11,29]]},"references-count":36,"journal-issue":{"issue":"4","published-print":{"date-parts":[[2014,4]]}},"alternative-id":["646"],"URL":"https:\/\/doi.org\/10.1007\/s10800-013-0646-y","relation":{},"ISSN":["0021-891X","1572-8838"],"issn-type":[{"value":"0021-891X","type":"print"},{"value":"1572-8838","type":"electronic"}],"subject":[],"published":{"date-parts":[[2013,11,29]]}}}