{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,19]],"date-time":"2025-05-19T11:07:15Z","timestamp":1747652835190,"version":"3.37.3"},"reference-count":17,"publisher":"Springer Science and Business Media LLC","issue":"8","license":[{"start":{"date-parts":[[2023,3,1]],"date-time":"2023-03-01T00:00:00Z","timestamp":1677628800000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0"},{"start":{"date-parts":[[2023,3,7]],"date-time":"2023-03-07T00:00:00Z","timestamp":1678147200000},"content-version":"vor","delay-in-days":6,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0"}],"funder":[{"DOI":"10.13039\/501100011929","name":"Programa Operacional Tem\u00e1tico Factores de Competitividade","doi-asserted-by":"publisher","award":["POCI-01-0247-FEDER-39479","UIDB\/05256\/2020","UIDP\/05256\/2020","UIDB\/04436\/2020","UIDP\/04436\/2020"],"award-info":[{"award-number":["POCI-01-0247-FEDER-39479","UIDB\/05256\/2020","UIDP\/05256\/2020","UIDB\/04436\/2020","UIDP\/04436\/2020"]}],"id":[{"id":"10.13039\/501100011929","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100008814","name":"Universidade do Minho","doi-asserted-by":"crossref","id":[{"id":"10.13039\/501100008814","id-type":"DOI","asserted-by":"crossref"}]}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":["J Mater Sci: Mater Electron"],"published-print":{"date-parts":[[2023,3]]},"abstract":"<jats:title>Abstract<\/jats:title><jats:p>The use of optical fiber sensing for strain measurements on printed circuit boards is a recent approach, and there is a lack of f reliable methods to obtain valid strain measurements. This work investigates the influence of different adhesives and their application for strain measurements using optical fiber sensors on PCB, considering room and high temperature tests. Strain developed in PCB during production and quality testing are measured by a single distributed optical fiber sensor, interrogated by Optical Frequency Domain Reflectometry. Different adhesives are evaluated for room and high temperatures strain measurements. Different thicknesses of the adhesive layer are studied under tensile and bending loadings. The mechanical properties of the adhesives and their effectiveness in optical fiber measurements were evaluated. A suitable adhesive selection is required for reliable strain measurements under different testing requirements: cyanoacrylate based for room temperature testing; epoxy or polyimide-based for high temperature measurements. The adhesive thickness should be the lowest and uniformly applied. A linear relationship between adhesive thickness and strain error was found, being necessary the application of a correction factor for valid strain measurements. Optical distributed sensing is highlighted as an alternative approach to conventional strain gauges for PCB strain measurements, reducing the installation complexity, significantly enlarging the number of measured points, without reducing the quality of the strain measurements. Selection of the best adhesive is crucial, as well as its thickness for reliable strain measurements.<\/jats:p>","DOI":"10.1007\/s10854-023-10017-5","type":"journal-article","created":{"date-parts":[[2023,3,29]],"date-time":"2023-03-29T08:02:56Z","timestamp":1680076976000},"update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":5,"title":["Influence of adhesive on optical fiber-based strain measurements on printed circuit boards"],"prefix":"10.1007","volume":"34","author":[{"given":"C.","family":"Freitas","sequence":"first","affiliation":[]},{"given":"T. M.","family":"Leite","sequence":"additional","affiliation":[]},{"given":"H.","family":"Lopes","sequence":"additional","affiliation":[]},{"given":"M.","family":"Gomes","sequence":"additional","affiliation":[]},{"given":"S.","family":"Cruz","sequence":"additional","affiliation":[]},{"given":"R.","family":"Magalh\u00e3es","sequence":"additional","affiliation":[]},{"given":"A. 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Liao, Measurements of thermally-induced curvatures and warpages of printed circuit board during a solder reflow process using strain gauges. Appl. Sci. 7(7), 739 (2017)","journal-title":"Appl. Sci."},{"issue":"1","key":"10017_CR3","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1109\/JPHOT.2017.2783956","volume":"10","author":"D Ba","year":"2018","unstructured":"D. Ba et al., A high-performance and temperature-insensitive shape sensor based on DPP-BOTDA. IEEE Photonic 10(1), 1\u201310 (2018)","journal-title":"IEEE Photonic"},{"issue":"7","key":"10017_CR4","doi-asserted-by":"publisher","first-page":"1651","DOI":"10.1109\/TNS.2019.2903922","volume":"66","author":"C Sabatier","year":"2019","unstructured":"C. Sabatier et al., Distributed optical fiber sensor allowing temperature and strain discrimination in radiation environments. IEEE Trans. Nucl. Sci. 66(7), 1651\u20131656 (2019)","journal-title":"IEEE Trans. Nucl. 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The authors have no relevant financial or non-financial interests to disclose.","order":2,"name":"Ethics","group":{"name":"EthicsHeading","label":"Conflict of interest"}},{"value":"The authors declare that the content of this paper has no ethical implications.","order":3,"name":"Ethics","group":{"name":"EthicsHeading","label":"Ethical approval"}}],"article-number":"699"}}