{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,13]],"date-time":"2026-01-13T06:10:40Z","timestamp":1768284640558,"version":"3.49.0"},"reference-count":47,"publisher":"Springer Science and Business Media LLC","issue":"10","license":[{"start":{"date-parts":[[2018,5,29]],"date-time":"2018-05-29T00:00:00Z","timestamp":1527552000000},"content-version":"tdm","delay-in-days":0,"URL":"http:\/\/www.springer.com\/tdm"}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":["J. of Materi Eng and Perform"],"published-print":{"date-parts":[[2018,10]]},"DOI":"10.1007\/s11665-018-3419-2","type":"journal-article","created":{"date-parts":[[2018,5,29]],"date-time":"2018-05-29T14:36:53Z","timestamp":1527604613000},"page":"5011-5017","update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":7,"title":["Effect of the Soldering Atmosphere on the Wettability Between Sn4.0Ag0.5Cu (in wt.%) Lead-Free Solder Paste and Various Substrates"],"prefix":"10.1007","volume":"27","author":[{"given":"D.","family":"Soares","sequence":"first","affiliation":[]},{"given":"H.","family":"Leit\u00e3o","sequence":"additional","affiliation":[]},{"given":"C. S.","family":"Lau","sequence":"additional","affiliation":[]},{"given":"J. C.","family":"Teixeira","sequence":"additional","affiliation":[]},{"given":"L.","family":"Ribas","sequence":"additional","affiliation":[]},{"given":"R.","family":"Alves","sequence":"additional","affiliation":[]},{"given":"S.","family":"Teixeira","sequence":"additional","affiliation":[]},{"given":"M. F.","family":"Cerqueira","sequence":"additional","affiliation":[]},{"given":"F.","family":"Macedo","sequence":"additional","affiliation":[]}],"member":"297","published-online":{"date-parts":[[2018,5,29]]},"reference":[{"issue":"12","key":"3419_CR1","doi-asserted-by":"publisher","first-page":"1452","DOI":"10.1007\/s11664-004-0086-x","volume":"33","author":"MF Arenas","year":"2004","unstructured":"M.F. Arenas and V.L. Acoff, Contact Angle Measurements of Sn-Ag and Sn-Cu Lead-Free Solders on Copper Substrates, J. Electron. Mater., 2004, 33(12), p 1452\u20131458","journal-title":"J. Electron. Mater."},{"issue":"1\u20132","key":"3419_CR2","doi-asserted-by":"publisher","first-page":"108","DOI":"10.1016\/j.msea.2007.10.110","volume":"495","author":"S Amore","year":"2008","unstructured":"S. Amore, E. Ricci, G. Borzone, and R. Novakovic, Wetting Behaviour of Lead-Free Sn-Based Alloys on Cu and Ni Substrates, Mater. Sci. Eng., A, 2008, 495(1\u20132), p 108\u2013112","journal-title":"Mater. Sci. Eng., A"},{"issue":"2","key":"3419_CR3","doi-asserted-by":"publisher","first-page":"023530","DOI":"10.1063\/1.2166647","volume":"99","author":"V Vuorinen","year":"2006","unstructured":"V. Vuorinen, T. Laurila, H. Yu, and J.K. Kivilahti, Phase Formation Between Lead-Free Sn-Ag-Cu Solder and Ni(P)\/Au Finishes, J. Appl. Phys., 2006, 99(2), p 023530","journal-title":"J. Appl. Phys."},{"issue":"7","key":"3419_CR4","doi-asserted-by":"publisher","first-page":"1533","DOI":"10.1007\/s11664-011-1639-4","volume":"40","author":"C Leinenbach","year":"2011","unstructured":"C. Leinenbach, F. Valenza, D. Giuranno, H.R. Elsener, S. Jin, and R. Novakovic, Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates, J. Electron. Mater., 2011, 40(7), p 1533\u20131541","journal-title":"J. Electron. Mater."},{"issue":"3","key":"3419_CR5","doi-asserted-by":"publisher","first-page":"1006","DOI":"10.1016\/j.matdes.2005.11.011","volume":"28","author":"T Chellaih","year":"2007","unstructured":"T. Chellaih, G. Kumar, and K.N. Prabhu, Effect of Thermal Contact Heat Transfer on Solidification of Pb-Sn and Pb-Free Solders, Mater. Des., 2007, 28(3), p 1006\u20131011","journal-title":"Mater. Des."},{"issue":"1-4","key":"3419_CR6","doi-asserted-by":"publisher","first-page":"243","DOI":"10.1016\/S0169-4332(03)00342-8","volume":"214","author":"C-T Lin","year":"2003","unstructured":"C.-T. Lin and K.-L. Lin, Contact Angle of 63Sn-37Pb and Pb-Free Solder on Cu Plating, Appl. Surf. Sci., 2003, 214(1-4), p 243\u2013258","journal-title":"Appl. Surf. Sci."},{"issue":"2","key":"3419_CR7","doi-asserted-by":"publisher","first-page":"60","DOI":"10.1016\/j.cis.2011.03.002","volume":"165","author":"L Boinovich","year":"2011","unstructured":"L. Boinovich and A. Emelyanenko, Wetting and Surface Forces, J. Colloid Interface Sci., 2011, 165(2), p 60\u201369","journal-title":"J. Colloid Interface Sci."},{"issue":"10","key":"3419_CR8","doi-asserted-by":"publisher","first-page":"1241","DOI":"10.1007\/s11664-000-0019-2","volume":"29","author":"F Guo","year":"2000","unstructured":"F. Guo, S. Choi, J.P. Lucas, and K.N. Subramanian, Effects of Reflow on Wettability, Microstructure and Mechanical Properties in Lead-Free Solders, J. Electron. Mater., 2000, 29(10), p 1241\u20131248","journal-title":"J. Electron. Mater."},{"issue":"3","key":"3419_CR9","doi-asserted-by":"publisher","first-page":"13","DOI":"10.1007\/s11664-003-0181-4","volume":"32","author":"J Lee","year":"2003","unstructured":"J. Lee, S. Chen, H. Chang, and C. Chen, Reactive Wetting Between Molten Sn-Bi and Ni Substrate, J. Electron. Mater., 2003, 32(3), p 13\u201317","journal-title":"J. Electron. Mater."},{"issue":"7","key":"3419_CR10","first-page":"5106","volume":"26","author":"C Gon\u00e7alves","year":"2015","unstructured":"C. Gon\u00e7alves, H. Leit\u00e3o, C.S. Lau, J.C. Teixeira, L. Ribas, S. Teixeira, M.F. Cerqueira, F. Macedo, and D. Soares, Wetting Behaviour of SAC305 Solder on Different Substrates in High Vacuum and Inert Atmosphere, J. Mater. Sci.: Mater. Electron., 2015, 26(7), p 5106\u20135112","journal-title":"J. Mater. Sci.: Mater. Electron."},{"issue":"1","key":"3419_CR11","doi-asserted-by":"publisher","first-page":"356","DOI":"10.1016\/j.jcis.2005.12.040","volume":"298","author":"VH L\u00f3pez","year":"2006","unstructured":"V.H. L\u00f3pez and A.R. Kennedy, Flux-Assisted Wetting and Spreading of Al on TiC, J. Colloid Interface Sci., 2006, 298(1), p 356\u2013362","journal-title":"J. Colloid Interface Sci."},{"issue":"1\u20132","key":"3419_CR12","first-page":"87","volume":"166","author":"KN Prabhu","year":"2011","unstructured":"K.N. Prabhu, Reactive Wetting, Evolution of Interfacial and Bulk IMCs and Their Effect on Mechanical Properties of Eutectic Sn-Cu Solder Alloy, Adv. Colloid Interface Sci., 2011, 166(1\u20132), p 87\u2013118","journal-title":"Adv. Colloid Interface Sci."},{"key":"3419_CR13","doi-asserted-by":"crossref","DOI":"10.31399\/asm.tb.ps.9781627083522","volume-title":"Principles of Soldering","author":"G Humpston","year":"2004","unstructured":"G. Humpston and D.M. Jacobson, Principles of Soldering, ASM International, Ohio, 2004"},{"key":"3419_CR14","volume-title":"Wettability at High Temperatures","author":"N Eustathopoulos","year":"1999","unstructured":"N. Eustathopoulos, M.G. Nicholas, and B. Drevet, Wettability at High Temperatures, Pergamon, Oxford, 1999"},{"issue":"9","key":"3419_CR15","doi-asserted-by":"publisher","first-page":"3247","DOI":"10.1016\/S1359-6454(97)00487-4","volume":"46","author":"JA Warren","year":"1998","unstructured":"J.A. Warren, W.J. Boettinger, and A.R. Roosen, Modelling Reative Wetting, Acta Mater., 1998, 46(9), p 3247\u20133264","journal-title":"Acta Mater."},{"issue":"2","key":"3419_CR16","doi-asserted-by":"publisher","first-page":"739","DOI":"10.1103\/RevModPhys.81.739","volume":"81","author":"D Bonn","year":"2009","unstructured":"D. Bonn, J. Eggers, J. Indekeu, J. Meunier, and E. Rolley, Wetting and Spreading, Rev. Mod. Phys., 2009, 81(2), p 739\u2013805","journal-title":"Rev. Mod. Phys."},{"issue":"1","key":"3419_CR17","doi-asserted-by":"publisher","first-page":"290","DOI":"10.1016\/j.jallcom.2010.07.182","volume":"507","author":"EEM Noor","year":"2010","unstructured":"E.E.M. Noor, N.M. Sharif, C.K. Yew, T. Ariga, A.B. Ismail, and Z. Hussain, Wettability and Strength of In-Bi-Sn Lead-Free Solder Alloy on Copper Substrate, J. Alloy. Compd., 2010, 507(1), p 290\u2013296","journal-title":"J. Alloy. Compd."},{"issue":"11","key":"3419_CR18","doi-asserted-by":"publisher","first-page":"4877","DOI":"10.1016\/j.apsusc.2010.12.131","volume":"257","author":"L Zang","year":"2011","unstructured":"L. Zang, Z. Yuan, H. Xu, and B. Xu, Wetting Process and Interfacial Characteristic of Sn-3.0Ag-0.5Cu on Different Substrates at Temperatures Ranging From 503\u00a0K to 673\u00a0K, Appl. Surf. Sci., 2011, 257(11), p 4877\u20134884","journal-title":"Appl. Surf. Sci."},{"issue":"5","key":"3419_CR19","doi-asserted-by":"publisher","first-page":"409","DOI":"10.1016\/j.ijadhadh.2006.09.008","volume":"27","author":"F Gnecco","year":"2007","unstructured":"F. Gnecco, E. Ricci, S. Amore, D. Giuranno, G. Borzone, G. Zanicchi, and R. Novakovic, Wetting Behaviour and Reactivity of Lead Free Au-In-Sn and Bi-In-Sn Alloys on Copper Substrates, Int. J. Adhes. Adhes., 2007, 27(5), p 409\u2013416","journal-title":"Int. J. Adhes. Adhes."},{"issue":"4","key":"3419_CR20","doi-asserted-by":"publisher","first-page":"1117","DOI":"10.1016\/S1359-6454(99)00008-7","volume":"47","author":"R Voitovitch","year":"1999","unstructured":"R. Voitovitch, A. Mortensen, F. Hodaj, and N. Eustathopoulos, Diffusion-Limited Reactive Wetting: Study of Spreading Kinetics of Cu-Cr Alloys on Carbon, Acta Mater., 1999, 47(4), p 1117\u20131128","journal-title":"Acta Mater."},{"issue":"22","key":"3419_CR21","doi-asserted-by":"publisher","first-page":"5990","DOI":"10.1007\/s10853-009-3858-0","volume":"44","author":"GW Liu","year":"2009","unstructured":"G.W. Liu, F. Valenza, M.L. Muolo, G.J. Qiao, and A. Passerone, Wetting and Interfacial Behavior of Ni-Si Alloy on Different Substrates, J. Mater. Sci., 2009, 44(22), p 5990\u20135997","journal-title":"J. Mater. Sci."},{"issue":"23","key":"3419_CR22","doi-asserted-by":"publisher","first-page":"2067","DOI":"10.1016\/j.matlet.2009.06.052","volume":"63","author":"L Zang","year":"2009","unstructured":"L. Zang, Z. Yuan, H. Zhao, and X. Zhang, Wettability of Molten Sn-Bi-Cu Solder on Cu Substrate, Mater. Lett., 2009, 63(23), p 2067\u20132069","journal-title":"Mater. Lett."},{"key":"3419_CR23","first-page":"3158","volume":"3","author":"J Drelich","year":"2002","unstructured":"J. Drelich, C. Fang, and C.L. White, Measurement of Interfacial Tension in Fluid\u2013Fluid Systems, Encycl. Surf. Colloid Sci., 2002, 3, p 3158\u20133163","journal-title":"Encycl. Surf. Colloid Sci."},{"key":"3419_CR24","doi-asserted-by":"publisher","first-page":"4877","DOI":"10.1016\/j.apsusc.2010.12.131","volume":"257","author":"L Zang","year":"2011","unstructured":"L. Zang, Z. Yuan, H. Xu, and B. Xu, Wetting Process and Interfacial Characteristics of Sn\u20133.0Ag\u20130.5Cu on Different Substrates at Temperatures Ranging From 503 K to 673 K, Appl. Surf. Sci., 2011, 257, p 4877\u20134884","journal-title":"Appl. Surf. Sci."},{"issue":"10","key":"3419_CR25","doi-asserted-by":"publisher","first-page":"1755","DOI":"10.1351\/pac200779101755","volume":"79","author":"N Sobczak","year":"2007","unstructured":"N. Sobczak, A. Kudyba, R. Nowak, W. Radziwill, and K. Pietrzak, Factors Affecting Wettability and Bond Strength of Solder Joint Couples, Pure Appl. Chem., 2007, 79(10), p 1755\u20131769","journal-title":"Pure Appl. Chem."},{"key":"3419_CR26","first-page":"151","volume":"58","author":"JD Malcolm","year":"1980","unstructured":"J.D. Malcolm and D.D. Elliot, Interfacial Tension from Height and Diameter of a Single Sessile Drop or Captive Bubble, J. Chem. Eng., 1980, 58, p 151","journal-title":"J. Chem. Eng."},{"key":"3419_CR27","volume-title":"An Attempt to Test the Theory of Capillary Action","author":"JC Bashforth","year":"1892","unstructured":"J.C. Bashforth and F. Adams, An Attempt to Test the Theory of Capillary Action, Cambridge University Press, Cambridge, 1892"},{"issue":"2","key":"3419_CR28","doi-asserted-by":"publisher","first-page":"136","DOI":"10.1006\/jcis.1997.5214","volume":"196","author":"O R\u00edo","year":"1997","unstructured":"O. R\u00edo and A. Neumann, Axisymmetric Drop Shape Analysis: Computational Methods for the Measurement of Interfacial Properties from the Shape and Dimensions of Pendant and Sessile Drops, J. Colloid Interface Sci., 1997, 196(2), p 136\u2013147","journal-title":"J. Colloid Interface Sci."},{"issue":"1\u20132","key":"3419_CR29","doi-asserted-by":"publisher","first-page":"55","DOI":"10.1016\/j.msea.2006.01.065","volume":"420","author":"JJ Sundelin","year":"2006","unstructured":"J.J. Sundelin, S.T. Nurmi, T.K. Lepist\u00f6, and E.O. Ristolainen, Mechanical and Microstructural Properties of SnAgCu Solder Joints, Mater. Sci. Eng., A, 2006, 420(1\u20132), p 55\u201362","journal-title":"Mater. Sci. Eng., A"},{"key":"3419_CR30","doi-asserted-by":"publisher","first-page":"336","DOI":"10.1016\/j.jallcom.2009.10.005","volume":"490","author":"J G\u00f6rlich","year":"2010","unstructured":"J. G\u00f6rlich, C. Oberdorfer, D. Baither, G. Schmitza, C. Reinke, and U. Wilke, The Role of Oxide Layers in Solder Joints, J. Alloy. Compd., 2010, 490, p 336\u2013341","journal-title":"J. Alloy. Compd."},{"key":"3419_CR31","doi-asserted-by":"publisher","first-page":"6481","DOI":"10.1016\/j.apsusc.2011.02.048","volume":"257","author":"M Ramireza","year":"2011","unstructured":"M. Ramireza, L. Henneken, and S. Virtanen, Oxidation Kinetics of Thin Copper Films and Wetting Behaviour of Copper and Organic Solderability Preservatives (OSP) with Lead-Free Solder, Appl. Surf. Sci., 2011, 257, p 6481\u20136488","journal-title":"Appl. Surf. Sci."},{"issue":"2","key":"3419_CR32","doi-asserted-by":"publisher","first-page":"302","DOI":"10.1109\/TCAPT.2009.2012518","volume":"32","author":"J Li","year":"2009","unstructured":"J. Li, J. Karppinen, T. Laurila, and J.K. Kivilahti, Reliability of Lead-Free Solder Interconnections in Thermal and Power Cycling Tests, IEEE Trans. Compon. Pack Technol., 2009, 32(2), p 302\u2013308","journal-title":"IEEE Trans. Compon. Pack Technol."},{"issue":"3","key":"3419_CR33","first-page":"214","volume":"25","author":"J Han","year":"2012","unstructured":"J. Han, H. Chen, and M. Li, Role of Grain Orientation in the Failure of Sn-Based Solder Joints Under Thermomechanical Fatigue, Acta Met. Sin., 2012, 25(3), p 214\u2013224","journal-title":"Acta Met. Sin."},{"issue":"1\/2","key":"3419_CR34","doi-asserted-by":"publisher","first-page":"225","DOI":"10.1016\/j.jallcom.2009.06.020","volume":"485","author":"K Kanlayasiri","year":"2009","unstructured":"K. Kanlayasiri, M. Mongkolwongrojn, and T. Ariga, Influence of Indium Addition on Characteristics on Sn-03-Ag-0.7Cu Solder Alloy, J. Alloys Compd., 2009, 485(1\/2), p 225\u2013230","journal-title":"J. Alloys Compd."},{"issue":"1\/2","key":"3419_CR35","doi-asserted-by":"publisher","first-page":"142","DOI":"10.1016\/j.jallcom.2009.06.159","volume":"486","author":"J-W Yoon","year":"2009","unstructured":"J.-W. Yoon, B.-I. Noh, B.-K. Kim, C.-C. Shur, and S.-B. Jung, Wettability and Interfacial Reaction of Sn-Ag-Cu\/Cu and Sn-Ag-Ni\/Cu Solder Joints, J. Alloys Compd., 2009, 486(1\/2), p 142\u2013147","journal-title":"J. Alloys Compd."},{"issue":"1","key":"3419_CR36","doi-asserted-by":"publisher","first-page":"38","DOI":"10.1016\/j.jallcom.2011.08.044","volume":"510","author":"L Zhang","year":"2012","unstructured":"L. Zhang, S.B. Xue, G. Zeng, L.L. Gao, and H. Ye, Interface Reaction Between SnAgCu\/SnAgCuCe Solders and Cu Substrate Subjected to Thermal Cycling and Isothermal Aging, J. Alloy. Compd., 2012, 510(1), p 38\u201345","journal-title":"J. Alloy. Compd."},{"key":"3419_CR37","doi-asserted-by":"publisher","first-page":"231","DOI":"10.1016\/j.molliq.2017.06.002","volume":"241","author":"T Gancarz","year":"2017","unstructured":"T. Gancarz, Density, Surface Tension and Viscosity of Ga-Sn Alloys, J. Mol. Liq., 2017, 241, p 231\u2013236","journal-title":"J. Mol. Liq."},{"key":"3419_CR38","doi-asserted-by":"publisher","first-page":"88","DOI":"10.1016\/j.apsusc.2017.01.068","volume":"405","author":"A Zdziennicka","year":"2017","unstructured":"A. Zdziennicka, K. Szymczyk, J. Krawczyk, and B. Janczuk, Some Remarks on the Solid Surface Tension Determination From Contact Angle Measurements, Appl. Surf. Sci., 2017, 405, p 88\u2013101","journal-title":"Appl. Surf. Sci."},{"key":"3419_CR39","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1016\/j.cis.2006.11.024","volume":"132","author":"H Tavana","year":"2007","unstructured":"H. Tavana and A.W. Neumann, Recent Progress in the Determination of Solid Surface Tensions from Contact Angles, Adv. Coll. Interface. Sci., 2007, 132, p 1\u201332","journal-title":"Adv. Coll. Interface. Sci."},{"issue":"3","key":"3419_CR40","doi-asserted-by":"publisher","first-page":"443","DOI":"10.2298\/JMMB120719055S","volume":"48","author":"V Sklyarchuka","year":"2012","unstructured":"V. Sklyarchuka, Y. Plevachuka, I. Kabanb, and R. Novakovi\u0107c, Surface Properties and Wetting Behaviour of Liquid Ag-Sb-Sn Alloys, J. Min. Metall. Sect. B Metall., 2012, 48(3), p 443\u2013448","journal-title":"J. Min. Metall. Sect. B Metall."},{"issue":"2","key":"3419_CR41","doi-asserted-by":"publisher","first-page":"125","DOI":"10.2298\/JMMB0702125M","volume":"43","author":"Z Moser","year":"2007","unstructured":"Z. Moser, W. Gasior, A. Debski, and J. Pstrus, SURDAT\u2014Database of Physical Properties of Lead-Free Solders, J. Min. Metall. Sect. B Metall., 2007, 43(2), p 125\u2013130","journal-title":"J. Min. Metall. Sect. B Metall."},{"key":"3419_CR42","first-page":"380","volume":"875","author":"T Tanaka","year":"1996","unstructured":"T. Tanaka, K. Hack, T. Lida, and S. Hara, Application of Thermodynamic Databases to the Evaluation of Surface Tensions of Molten Alloys, Salt Mixtures and Oxide Mixtures, Z. Metall., 1996, 875, p 380\u2013389","journal-title":"Z. Metall."},{"issue":"9","key":"3419_CR43","doi-asserted-by":"publisher","first-page":"2864","DOI":"10.2320\/matertrans.45.2864","volume":"45","author":"J Lee","year":"2004","unstructured":"J. Lee, W. Shimoda, and T. Tanaka, Surface Tension and its Temperature Coefficient of Liquid Sn_X (X\u2009=\u2009Ag, Cu) Alloys, Mater. Trans., 2004, 45(9), p 2864\u20132870","journal-title":"Mater. Trans."},{"key":"3419_CR44","doi-asserted-by":"crossref","unstructured":"T. Hetschel, K. Wolter, F. Phillipp, R.B. Gmbh, Wettability Effects of Immersion Tin Final Finishes with Lead Free Solder, in Electronics System-Integration Technology Conference, 2008. ESTC 2008, 2nd (2008)","DOI":"10.1109\/ESTC.2008.4684411"},{"key":"3419_CR45","doi-asserted-by":"publisher","first-page":"1439","DOI":"10.1016\/S1359-6462(01)01181-2","volume":"45","author":"P Protsenko","year":"2001","unstructured":"P. Protsenko, A. Terlain, V. Traskine, and N. Eustathopoulos, The Role of Intermetallics in Wetting in Metallic Systems, Scr. Mater., 2001, 45, p 1439\u20131445","journal-title":"Scr. Mater."},{"issue":"16","key":"3419_CR46","doi-asserted-by":"publisher","first-page":"4256","DOI":"10.1007\/s10853-009-4128-x","volume":"45","author":"O Dezellus","year":"2010","unstructured":"O. Dezellus and N. Eustathopoulos, Fundamental Issues of Reactive Wetting by Liquid Metals, J. Mater. Sci., 2010, 45(16), p 4256\u20134264","journal-title":"J. Mater. Sci."},{"key":"3419_CR47","doi-asserted-by":"publisher","first-page":"55","DOI":"10.1016\/S1359-0286(00)00036-X","volume":"5","author":"K Suganuma","year":"2001","unstructured":"K. Suganuma, Advances in Lead-Free Electronics Soldering, Curr. Opin. Solid State Mater. Sci., 2001, 5, p 55\u201364","journal-title":"Curr. Opin. Solid State Mater. Sci."}],"container-title":["Journal of Materials Engineering and Performance"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/link.springer.com\/article\/10.1007\/s11665-018-3419-2\/fulltext.html","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/s11665-018-3419-2.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/s11665-018-3419-2.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,8,24]],"date-time":"2022-08-24T15:05:32Z","timestamp":1661353532000},"score":1,"resource":{"primary":{"URL":"http:\/\/link.springer.com\/10.1007\/s11665-018-3419-2"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,5,29]]},"references-count":47,"journal-issue":{"issue":"10","published-print":{"date-parts":[[2018,10]]}},"alternative-id":["3419"],"URL":"https:\/\/doi.org\/10.1007\/s11665-018-3419-2","relation":{},"ISSN":["1059-9495","1544-1024"],"issn-type":[{"value":"1059-9495","type":"print"},{"value":"1544-1024","type":"electronic"}],"subject":[],"published":{"date-parts":[[2018,5,29]]},"assertion":[{"value":"24 October 2017","order":1,"name":"received","label":"Received","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"27 March 2018","order":2,"name":"revised","label":"Revised","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"29 May 2018","order":3,"name":"first_online","label":"First Online","group":{"name":"ArticleHistory","label":"Article History"}}]}}