{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,14]],"date-time":"2026-04-14T11:41:39Z","timestamp":1776166899460,"version":"3.50.1"},"reference-count":73,"publisher":"Elsevier BV","license":[{"start":{"date-parts":[[2026,9,1]],"date-time":"2026-09-01T00:00:00Z","timestamp":1788220800000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"},{"start":{"date-parts":[[2026,9,1]],"date-time":"2026-09-01T00:00:00Z","timestamp":1788220800000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/legal\/tdmrep-license"},{"start":{"date-parts":[[2026,3,24]],"date-time":"2026-03-24T00:00:00Z","timestamp":1774310400000},"content-version":"vor","delay-in-days":0,"URL":"http:\/\/creativecommons.org\/licenses\/by-nc-nd\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100002701","name":"Korea Ministry of Education","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100002701","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100014188","name":"Ministry of Science and ICT, South Korea","doi-asserted-by":"publisher","award":["G2025-0465"],"award-info":[{"award-number":["G2025-0465"]}],"id":[{"id":"10.13039\/501100014188","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100014188","name":"Ministry of Science and ICT, South Korea","doi-asserted-by":"publisher","award":["RS-2024-00335260"],"award-info":[{"award-number":["RS-2024-00335260"]}],"id":[{"id":"10.13039\/501100014188","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001321","name":"National Research Foundation","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001321","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003052","name":"Korea Ministry of Trade Industry and Energy","doi-asserted-by":"publisher","award":["20017932"],"award-info":[{"award-number":["20017932"]}],"id":[{"id":"10.13039\/501100003052","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002642","name":"Korea University","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100002642","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["elsevier.com","sciencedirect.com"],"crossmark-restriction":true},"short-container-title":["Advanced Engineering Informatics"],"published-print":{"date-parts":[[2026,9]]},"DOI":"10.1016\/j.aei.2026.104621","type":"journal-article","created":{"date-parts":[[2026,3,24]],"date-time":"2026-03-24T21:41:39Z","timestamp":1774388499000},"page":"104621","update-policy":"https:\/\/doi.org\/10.1016\/elsevier_cm_policy","source":"Crossref","is-referenced-by-count":0,"special_numbering":"PA","title":["A deep active learning framework for defect classification of wafer bin maps under noisy labels"],"prefix":"10.1016","volume":"74","author":[{"given":"Chansung","family":"Lim","sequence":"first","affiliation":[]},{"given":"Gyeongho","family":"Kim","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9534-7397","authenticated-orcid":false,"given":"Sunghoon","family":"Lim","sequence":"additional","affiliation":[]}],"member":"78","reference":[{"key":"10.1016\/j.aei.2026.104621_b1","doi-asserted-by":"crossref","DOI":"10.1016\/j.aei.2025.103747","article-title":"An empirical study on enhancing wafer quality: Integrating big data and AI in virtual metrology for thin-film processing","volume":"68","author":"Liu","year":"2025","journal-title":"Adv. Eng. Inf."},{"key":"10.1016\/j.aei.2026.104621_b2","doi-asserted-by":"crossref","DOI":"10.1016\/j.aei.2021.101254","article-title":"Competitive substitution and technological diffusion for semiconductor foundry firms","volume":"48","author":"Wang","year":"2021","journal-title":"Adv. Eng. Inf."},{"key":"10.1016\/j.aei.2026.104621_b3","doi-asserted-by":"crossref","first-page":"566","DOI":"10.1109\/TSM.2019.2937793","article-title":"Wafer defect pattern recognition and analysis based on convolutional neural network","volume":"32","author":"Yu","year":"2019","journal-title":"IEEE Trans. Semicond. Manuf."},{"key":"10.1016\/j.aei.2026.104621_b4","doi-asserted-by":"crossref","first-page":"2163","DOI":"10.1007\/s10845-024-02351-0","article-title":"CowSSL: contrastive open-world semi-supervised learning for wafer bin map","volume":"36","author":"Baek","year":"2025","journal-title":"J. Intell. Manuf."},{"key":"10.1016\/j.aei.2026.104621_b5","doi-asserted-by":"crossref","DOI":"10.1016\/j.aei.2025.103200","article-title":"SR-FABNet: Super-resolution branch guided Fourier attention detection network for efficient optical inspection of nanoscale wafer defects","volume":"65","author":"Chen","year":"2025","journal-title":"Adv. Eng. Inf."},{"key":"10.1016\/j.aei.2026.104621_b6","doi-asserted-by":"crossref","DOI":"10.1016\/j.aei.2023.102272","article-title":"A copula network deconvolution-based direct correlation disentangling framework for explainable fault detection in semiconductor wafer fabrication","volume":"59","author":"Xu","year":"2024","journal-title":"Adv. Eng. Inf."},{"key":"10.1016\/j.aei.2026.104621_b7","doi-asserted-by":"crossref","first-page":"3215","DOI":"10.1007\/s10845-022-01994-1","article-title":"Advances in machine learning and deep learning applications towards wafer map defect recognition and classification: a review","volume":"34","author":"Kim","year":"2023","journal-title":"J. Intell. Manuf."},{"key":"10.1016\/j.aei.2026.104621_b8","doi-asserted-by":"crossref","DOI":"10.1016\/j.aei.2025.104117","article-title":"A review of multi-modal deep learning towards agentic smart manufacturing","volume":"70","author":"Leng","year":"2026","journal-title":"Adv. Eng. Inf."},{"key":"10.1016\/j.aei.2026.104621_b9","doi-asserted-by":"crossref","DOI":"10.1016\/j.ress.2024.110549","article-title":"Fisher-informed continual learning for remaining useful life prediction of machining tools under varying operating conditions","volume":"253","author":"Kim","year":"2025","journal-title":"Reliab. Eng. Syst. Saf."},{"key":"10.1016\/j.aei.2026.104621_b10","doi-asserted-by":"crossref","DOI":"10.1016\/j.aei.2024.102902","article-title":"Graph-based active semi-supervised learning: Case study in water quality monitoring","volume":"62","author":"Wang","year":"2024","journal-title":"Adv. Eng. Inf."},{"key":"10.1016\/j.aei.2026.104621_b11","doi-asserted-by":"crossref","DOI":"10.1016\/j.cie.2023.109286","article-title":"Developing a semi-supervised learning and ordinal classification framework for quality level prediction in manufacturing","volume":"181","author":"Kim","year":"2023","journal-title":"Comput. Ind. Eng."},{"key":"10.1016\/j.aei.2026.104621_b12","doi-asserted-by":"crossref","DOI":"10.1016\/j.aei.2026.104366","article-title":"Encoder\u2013decoder based active learning approach for corrosion segmentation in industrial and lab environments","volume":"71","author":"Chee","year":"2026","journal-title":"Adv. Eng. Inf."},{"key":"10.1016\/j.aei.2026.104621_b13","doi-asserted-by":"crossref","DOI":"10.1016\/j.apm.2024.115764","article-title":"Fault diagnosis based on incomplete sensor variables with a hierarchical semi-supervised Gaussian mixture classifier","volume":"138","author":"Liu","year":"2025","journal-title":"Appl. Math. Model."},{"key":"10.1016\/j.aei.2026.104621_b14","doi-asserted-by":"crossref","DOI":"10.1016\/j.aei.2023.102121","article-title":"Towards new-generation human-centric smart manufacturing in industry 5.0: A systematic review","volume":"57","author":"Zhang","year":"2023","journal-title":"Adv. Eng. Inf."},{"key":"10.1016\/j.aei.2026.104621_b15","doi-asserted-by":"crossref","DOI":"10.1016\/j.aei.2024.102425","article-title":"Like draws to like: A multi-granularity ball-intra fusion approach for fault diagnosis models to resists misleading by noisy labels","volume":"60","author":"Dunkin","year":"2024","journal-title":"Adv. Eng. Inf."},{"key":"10.1016\/j.aei.2026.104621_b16","doi-asserted-by":"crossref","first-page":"395","DOI":"10.1109\/TSM.2018.2841416","article-title":"Classification of mixed-type defect patterns in wafer bin maps using convolutional neural networks","volume":"31","author":"Kyeong","year":"2018","journal-title":"IEEE Trans. Semicond. Manuf."},{"key":"10.1016\/j.aei.2026.104621_b17","doi-asserted-by":"crossref","first-page":"1479","DOI":"10.1016\/j.engappai.2012.11.009","article-title":"An intelligent system for wafer bin map defect diagnosis: An empirical study for semiconductor manufacturing","volume":"26","author":"Liu","year":"2013","journal-title":"Eng. Appl. Artif. Intell."},{"key":"10.1016\/j.aei.2026.104621_b18","doi-asserted-by":"crossref","DOI":"10.1016\/j.aei.2024.102478","article-title":"Contrastive regularization guided label refurbishment for fault diagnosis under label noise","volume":"61","author":"Zhong","year":"2024","journal-title":"Adv. Eng. Inf."},{"key":"10.1016\/j.aei.2026.104621_b19","doi-asserted-by":"crossref","DOI":"10.1016\/j.aei.2024.102712","article-title":"Multi-scale adaptive-routing capsule contrastive network-based intelligent fault diagnosis method for rotating machinery under noisy environment and labels","volume":"62","author":"Xiong","year":"2024","journal-title":"Adv. Eng. Inf."},{"key":"10.1016\/j.aei.2026.104621_b20","series-title":"Proceedings of AAAI Conf Artif Intell.","article-title":"Asking the right questions to the right users: active learning with imperfect oracles","author":"Chakraborty","year":"2020"},{"key":"10.1016\/j.aei.2026.104621_b21","doi-asserted-by":"crossref","DOI":"10.1016\/j.eswa.2021.115429","article-title":"Active cluster annotation for wafer map pattern classification in semiconductor manufacturing","volume":"183","author":"Shim","year":"2021","journal-title":"Expert Syst. Appl."},{"key":"10.1016\/j.aei.2026.104621_b22","doi-asserted-by":"crossref","DOI":"10.1016\/j.aei.2024.102540","article-title":"Development of a spatial dimension-based taxonomy for classifying the defect patterns in a wafer bin map","volume":"60","author":"Choi","year":"2024","journal-title":"Adv. Eng. Inf."},{"key":"10.1016\/j.aei.2026.104621_b23","article-title":"Defective wafer detection using a denoising autoencoder for semiconductor manufacturing processes","volume":"46","author":"Fan","year":"2020","journal-title":"Adv. Eng. Inf."},{"key":"10.1016\/j.aei.2026.104621_b24","doi-asserted-by":"crossref","first-page":"1029","DOI":"10.1016\/j.engappai.2012.03.016","article-title":"Defect cluster recognition system for fabricated semiconductor wafers","volume":"26","author":"Ooi","year":"2013","journal-title":"Eng. Appl. Artif. Intell."},{"key":"10.1016\/j.aei.2026.104621_b25","doi-asserted-by":"crossref","first-page":"99","DOI":"10.1080\/24725854.2017.1386337","article-title":"Detection and clustering of mixed-type defect patterns in wafer bin maps","volume":"50","author":"Kim","year":"2018","journal-title":"IISE Trans."},{"key":"10.1016\/j.aei.2026.104621_b26","doi-asserted-by":"crossref","DOI":"10.1016\/j.aei.2024.103078","article-title":"Input-guidance diffusion model for unknown defect patterns detection in wafer bin map","volume":"64","author":"Moon","year":"2025","journal-title":"Adv. Eng. Inf."},{"key":"10.1016\/j.aei.2026.104621_b27","doi-asserted-by":"crossref","DOI":"10.1016\/j.engappai.2023.107154","article-title":"Supervised contrastive learning for wafer map pattern classification","volume":"126","author":"Bae","year":"2023","journal-title":"Eng. Appl. Artif. Intell."},{"key":"10.1016\/j.aei.2026.104621_b28","doi-asserted-by":"crossref","first-page":"23","DOI":"10.1109\/TSM.2016.2628865","article-title":"A deep learning model for robust wafer fault monitoring with sensor measurement noise","volume":"30","author":"Lee","year":"2017","journal-title":"IEEE Trans. Semicond. Manuf."},{"key":"10.1016\/j.aei.2026.104621_b29","doi-asserted-by":"crossref","DOI":"10.1016\/j.aei.2024.103080","article-title":"A multi-stage active learning framework with an instance-based sample selection algorithm for steel surface defect","volume":"64","author":"Gao","year":"2025","journal-title":"Adv. Eng. Inf."},{"key":"10.1016\/j.aei.2026.104621_b30","doi-asserted-by":"crossref","DOI":"10.1016\/j.eswa.2024.125378","article-title":"A framework for detecting unknown defect patterns on wafer bin maps using active learning","volume":"260","author":"Shin","year":"2025","journal-title":"Expert Syst. Appl."},{"key":"10.1016\/j.aei.2026.104621_b31","series-title":"Bayesian active learning for classification and preference learning","author":"Houlsby","year":"2011"},{"key":"10.1016\/j.aei.2026.104621_b32","doi-asserted-by":"crossref","DOI":"10.1016\/j.aei.2025.103280","article-title":"Towards trustworthy civil aviation hazards identification: An uncertainty-aware deep learning framework","volume":"65","author":"Hou","year":"2025","journal-title":"Adv. Eng. Inf."},{"key":"10.1016\/j.aei.2026.104621_b33","doi-asserted-by":"crossref","unstructured":"X. Li, P. Yang, Y. Gu, X. Zhan, T. Wang, M. Xu, C. Xu, Deep active learning with noise stability, in: Proceedings of AAAI Conf Artif Intell, Vancouver, BC, CAN, 2024.","DOI":"10.1609\/aaai.v38i12.29270"},{"key":"10.1016\/j.aei.2026.104621_b34","series-title":"Proceedings of Int Conf Learn Represent","article-title":"Active learning for convolutional neural networks: A core-set approach","author":"Sener","year":"2018"},{"key":"10.1016\/j.aei.2026.104621_b35","series-title":"Proceedings of Int Conf Learn Represent","article-title":"Deep batch active learning by diverse, uncertain gradient lower bounds","author":"Ash","year":"2020"},{"key":"10.1016\/j.aei.2026.104621_b36","series-title":"Proceedings of Int Conf Mach Learn","article-title":"GALAXY: Graph-based active learning at the extreme","author":"Zhang","year":"2022"},{"key":"10.1016\/j.aei.2026.104621_b37","doi-asserted-by":"crossref","DOI":"10.1016\/j.ress.2025.111637","article-title":"Towards efficient data-driven fault diagnosis under low-budget scenarios via hybrid deep active learning","volume":"266","author":"Kim","year":"2026","journal-title":"Reliab. Eng. Syst. Saf."},{"key":"10.1016\/j.aei.2026.104621_b38","doi-asserted-by":"crossref","DOI":"10.1016\/j.aei.2023.101933","article-title":"Selecting informative data for defect segmentation from imbalanced datasets via active learning","volume":"56","author":"Li","year":"2023","journal-title":"Adv. Eng. Inf."},{"key":"10.1016\/j.aei.2026.104621_b39","doi-asserted-by":"crossref","DOI":"10.1016\/j.aei.2025.103695","article-title":"Wavelet-embedded heterogeneous collaborative learning framework for label noise-tolerant fault diagnosis under varying operating conditions","volume":"68","author":"Xu","year":"2025","journal-title":"Adv. Eng. Inf."},{"key":"10.1016\/j.aei.2026.104621_b40","series-title":"Proceedings of Conf Neural Inf Process Syst.","article-title":"Co-teaching: robust training of deep neural networks with extremely noisy labels","author":"Han","year":"2018"},{"key":"10.1016\/j.aei.2026.104621_b41","series-title":"Proceedings of IEEE\/CVF Int Conf Comput Vis.","article-title":"Symmetric cross entropy for robust learning with noisy labels","author":"Wang","year":"2019"},{"key":"10.1016\/j.aei.2026.104621_b42","series-title":"Proceedings of IEEE Conf Comput Vis Pattern Recognit.","article-title":"Joint optimization framework for learning with noisy labels","author":"Tanaka","year":"2018"},{"key":"10.1016\/j.aei.2026.104621_b43","series-title":"Proceedings of IEEE\/CVF Conf Comput Vis Pattern Recognit","article-title":"Jo-SRC: A contrastive approach for combating noisy labels","author":"Yao","year":"2021"},{"key":"10.1016\/j.aei.2026.104621_b44","series-title":"Proceedings of Int Conf Learn Represent","article-title":"DivideMix: Learning with noisy labels as semi-supervised learning","author":"Li","year":"2020"},{"key":"10.1016\/j.aei.2026.104621_b45","doi-asserted-by":"crossref","DOI":"10.1016\/j.neunet.2024.106122","article-title":"Bayesian DivideMix++ for enhanced learning with noisy labels","volume":"172","author":"Nagarajan","year":"2024","journal-title":"Neural Netw."},{"key":"10.1016\/j.aei.2026.104621_b46","doi-asserted-by":"crossref","DOI":"10.1016\/j.patcog.2024.111132","article-title":"ANNE: Adaptive nearest neighbours and eigenvector-based sample selection for robust learning with noisy labels","volume":"159","author":"Cordeiro","year":"2025","journal-title":"Pattern Recognit."},{"key":"10.1016\/j.aei.2026.104621_b47","doi-asserted-by":"crossref","first-page":"191","DOI":"10.1016\/j.patrec.2024.09.012","article-title":"Label-noise learning via uncertainty-aware neighborhood sample selection","volume":"186","author":"Zhang","year":"2024","journal-title":"Pattern Recognit."},{"key":"10.1016\/j.aei.2026.104621_b48","series-title":"Deep active learning in the presence of label noise: a survey","author":"Mots\u2019oehli","year":"2023"},{"key":"10.1016\/j.aei.2026.104621_b49","series-title":"Proceedings of the AAAI Conf Artif Intell.","article-title":"Re-active learning: active learning with relabeling","author":"Lin","year":"2016"},{"key":"10.1016\/j.aei.2026.104621_b50","series-title":"Noisy batch active learning with deterministic annealing","author":"Gupta","year":"2020"},{"key":"10.1016\/j.aei.2026.104621_b51","doi-asserted-by":"crossref","first-page":"1103","DOI":"10.1007\/s10994-021-06081-9","article-title":"Improving deep label noise learning with dual active label correction","volume":"111","author":"Li","year":"2022","journal-title":"Mach. Learn."},{"key":"10.1016\/j.aei.2026.104621_b52","doi-asserted-by":"crossref","first-page":"1307","DOI":"10.1007\/s13042-017-0645-0","article-title":"Agreeing to disagree: active learning with noisy labels without crowdsourcing","volume":"9","author":"Bouguelia","year":"2018","journal-title":"Int. J. Mach. Learn. Cybern."},{"key":"10.1016\/j.aei.2026.104621_b53","series-title":"Proceedings of AAAI Conf Artif Intell.","article-title":"STARS: spatial\u2013temporal active re-sampling for label-efficient learning from noisy annotations","author":"Yu","year":"2023"},{"key":"10.1016\/j.aei.2026.104621_b54","doi-asserted-by":"crossref","unstructured":"S. Khosla, C.K. Whye, J. Ash, C. Zhang, K. Kawaguchi, A. Lamb, Understanding and improving neural active learning on heteroskedastic distributions, in: Proceedings of Eur Conf Artif Intell., Krak\u00f3w, PL, 2023.","DOI":"10.3233\/FAIA230402"},{"key":"10.1016\/j.aei.2026.104621_b55","series-title":"GCI-VITAL: Gradual confidence improvement with vision transformers for active learning on label noise","author":"Mots\u2019oehli","year":"2024"},{"key":"10.1016\/j.aei.2026.104621_b56","series-title":"Balancing accuracy, calibration, and efficiency in active learning with vision transformers under label noise","author":"Mots\u2019oehli","year":"2025"},{"key":"10.1016\/j.aei.2026.104621_b57","series-title":"Active learning with a noisy annotator","author":"Shafir","year":"2025"},{"key":"10.1016\/j.aei.2026.104621_b58","series-title":"Proceedings of Int Conf Neural Inf Process Syst.","article-title":"Active learning through a covering lens","author":"Yehuda","year":"2022"},{"key":"10.1016\/j.aei.2026.104621_b59","doi-asserted-by":"crossref","DOI":"10.1016\/j.aei.2025.104207","article-title":"Bayesian contrastive learning: An augmentation-free fault diagnosis method with limited labels and uncertainty quantification","volume":"70","author":"Ahmad","year":"2026","journal-title":"Adv. Eng. Inf."},{"key":"10.1016\/j.aei.2026.104621_b60","doi-asserted-by":"crossref","first-page":"133","DOI":"10.1016\/j.jmsy.2024.07.010","article-title":"Developing a deep learning-based uncertainty-aware tool wear prediction method using smartphone sensors for the turning process of Ti-6Al-4V","volume":"76","author":"Kim","year":"2024","journal-title":"J. Manuf. Syst."},{"key":"10.1016\/j.aei.2026.104621_b61","series-title":"Proceedings of Int Conf Mach Learn","article-title":"Deep Bayesian active learning with image data","author":"Gal","year":"2017"},{"key":"10.1016\/j.aei.2026.104621_b62","series-title":"Proceedings of Int Conf Mach Learn","article-title":"Dropout as a Bayesian approximation: Representing model uncertainty in deep learning","author":"Gal","year":"2016"},{"key":"10.1016\/j.aei.2026.104621_b63","doi-asserted-by":"crossref","DOI":"10.1016\/j.aei.2025.103561","article-title":"A new adaptive representation dual classifier residual network for continuous fault diagnosis of rotating machinery with domain increments","volume":"67","author":"Zhang","year":"2025","journal-title":"Adv. Eng. Inf."},{"key":"10.1016\/j.aei.2026.104621_b64","doi-asserted-by":"crossref","unstructured":"J. Wang, C. Xu, Z. Yang, J. Zhang, X. Li, Deformable convolutional networks for efficient mixed-type wafer defect pattern recognition, IEEE Trans. Semicond. Manuf. http:\/\/dx.doi.org\/10.1109\/TSM.2020.3020985.","DOI":"10.1109\/TSM.2020.3020985"},{"key":"10.1016\/j.aei.2026.104621_b65","doi-asserted-by":"crossref","DOI":"10.1016\/j.aei.2025.104024","article-title":"A dual model joint learning framework for intelligent fault diagnosis of rotating machinery under noisy labels","volume":"69","author":"Wang","year":"2026","journal-title":"Adv. Eng. Inf."},{"key":"10.1016\/j.aei.2026.104621_b66","doi-asserted-by":"crossref","unstructured":"K. He, X. Zhang, S. Ren, J. Sun, Deep residual learning for image recognition, in: Proceedings of IEEE Conf Comput Vis Pattern Recognit, Las Vegas, NV, USA, 2016.","DOI":"10.1109\/CVPR.2016.90"},{"key":"10.1016\/j.aei.2026.104621_b67","series-title":"Proceedings of Int Conf Mach Learn","article-title":"Improved algorithm for deep active learning under imbalance via optimal separation","author":"Nuggehalli","year":"2025"},{"key":"10.1016\/j.aei.2026.104621_b68","unstructured":"K. Simonyan, A. Zisserman, Very deep convolutional networks for large-scale image recognition, in: Proceedings of Int Conf Learn Represent, San Diego, CA, USA, 2015."},{"key":"10.1016\/j.aei.2026.104621_b69","unstructured":"M. Tan, Q.V. Le, EfficientNet: Rethinking model scaling for convolutional neural networks, in: Proceedings of Int Conf Mach Learn, Long Beach, CA, USA, 2019."},{"key":"10.1016\/j.aei.2026.104621_b70","doi-asserted-by":"crossref","first-page":"20","DOI":"10.1016\/j.cirpj.2024.04.001","article-title":"Developing a data-driven system for grinding process parameter optimization using machine learning and metaheuristic algorithms","volume":"51","author":"Kim","year":"2024","journal-title":"CIRP J. Manuf. Sci. Technol."},{"key":"10.1016\/j.aei.2026.104621_b71","doi-asserted-by":"crossref","DOI":"10.1016\/j.aei.2025.103779","article-title":"Open-set classification method via latent representation prompt and time\u2013frequency fusion toward unknown fault recognition","volume":"68","author":"Sun","year":"2025","journal-title":"Adv. Eng. Inf."},{"key":"10.1016\/j.aei.2026.104621_b72","doi-asserted-by":"crossref","DOI":"10.1016\/j.aei.2025.103907","article-title":"Bayesian physics-informed neural networks with iterative ensemble Kalman inversion for RUL prediction and uncertainty quantification","volume":"69","author":"Xie","year":"2026","journal-title":"Adv. Eng. Inf."},{"key":"10.1016\/j.aei.2026.104621_b73","doi-asserted-by":"crossref","DOI":"10.1016\/j.aei.2025.103883","article-title":"Robust tool wear prediction under novel operating conditions via physics-guided unsupervised domain adaptation","volume":"69","author":"Kim","year":"2026","journal-title":"Adv. Eng. Inf."}],"container-title":["Advanced Engineering Informatics"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S1474034626003137?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S1474034626003137?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2026,4,14]],"date-time":"2026-04-14T10:36:46Z","timestamp":1776163006000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S1474034626003137"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,9]]},"references-count":73,"alternative-id":["S1474034626003137"],"URL":"https:\/\/doi.org\/10.1016\/j.aei.2026.104621","relation":{},"ISSN":["1474-0346"],"issn-type":[{"value":"1474-0346","type":"print"}],"subject":[],"published":{"date-parts":[[2026,9]]},"assertion":[{"value":"Elsevier","name":"publisher","label":"This article is maintained by"},{"value":"A deep active learning framework for defect classification of wafer bin maps under noisy labels","name":"articletitle","label":"Article Title"},{"value":"Advanced Engineering Informatics","name":"journaltitle","label":"Journal Title"},{"value":"https:\/\/doi.org\/10.1016\/j.aei.2026.104621","name":"articlelink","label":"CrossRef DOI link to publisher maintained version"},{"value":"article","name":"content_type","label":"Content Type"},{"value":"\u00a9 2026 The Authors. Published by Elsevier Ltd.","name":"copyright","label":"Copyright"}],"article-number":"104621"}}