{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,4]],"date-time":"2026-07-04T01:19:33Z","timestamp":1783127973135,"version":"3.54.6"},"reference-count":23,"publisher":"Elsevier BV","license":[{"start":{"date-parts":[[2026,9,1]],"date-time":"2026-09-01T00:00:00Z","timestamp":1788220800000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"},{"start":{"date-parts":[[2026,9,1]],"date-time":"2026-09-01T00:00:00Z","timestamp":1788220800000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/legal\/tdmrep-license"},{"start":{"date-parts":[[2026,9,1]],"date-time":"2026-09-01T00:00:00Z","timestamp":1788220800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-017"},{"start":{"date-parts":[[2026,9,1]],"date-time":"2026-09-01T00:00:00Z","timestamp":1788220800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"},{"start":{"date-parts":[[2026,9,1]],"date-time":"2026-09-01T00:00:00Z","timestamp":1788220800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-012"},{"start":{"date-parts":[[2026,9,1]],"date-time":"2026-09-01T00:00:00Z","timestamp":1788220800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,9,1]],"date-time":"2026-09-01T00:00:00Z","timestamp":1788220800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-004"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2024YFB4610700"],"award-info":[{"award-number":["2024YFB4610700"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["JJ-ZDHYLY-01-23-0004"],"award-info":[{"award-number":["JJ-ZDHYLY-01-23-0004"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["elsevier.com","sciencedirect.com"],"crossmark-restriction":true},"short-container-title":["Displays"],"published-print":{"date-parts":[[2026,9]]},"DOI":"10.1016\/j.displa.2026.103536","type":"journal-article","created":{"date-parts":[[2026,5,14]],"date-time":"2026-05-14T15:17:25Z","timestamp":1778771845000},"page":"103536","update-policy":"https:\/\/doi.org\/10.1016\/elsevier_cm_policy","source":"Crossref","is-referenced-by-count":0,"special_numbering":"C","title":["A receiving tape etching scheme for high-yield bonding after direct laser mass transfer process of micro-LEDs"],"prefix":"10.1016","volume":"94","author":[{"given":"Zhu","family":"Yang","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Wenya","family":"Tian","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jianxin","family":"Wang","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yang","family":"Shi","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hao","family":"Fu","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Haojie","family":"Zhou","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xinyi","family":"Wang","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xiaoxiao","family":"Ji","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yanlei","family":"Hu","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ming","family":"Chen","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xiuzhen","family":"Lu","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Luqiao","family":"Yin","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jianhua","family":"Zhang","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"78","reference":[{"key":"10.1016\/j.displa.2026.103536_b0005","doi-asserted-by":"crossref","first-page":"105","DOI":"10.1038\/s41377-020-0341-9","article-title":"Mini-LED, micro-LED and OLED displays: present status and future perspectives","volume":"9","author":"Huang","year":"2020","journal-title":"Light Sci. Appl."},{"key":"10.1016\/j.displa.2026.103536_b0010","article-title":"MicroLED technologies and applications: characteristics, fabrication, progress, and challenges","volume":"54","author":"Chen","year":"2021","journal-title":"J. Phys. D Appl. Phys."},{"key":"10.1016\/j.displa.2026.103536_b0015","doi-asserted-by":"crossref","DOI":"10.1002\/adma.202204947","article-title":"Technological breakthroughs in chip fabrication, transfer, and color conversion for high-performance micro-LED displays","volume":"35","author":"Ryu","year":"2023","journal-title":"Adv. Mater."},{"key":"10.1016\/j.displa.2026.103536_b0020","doi-asserted-by":"crossref","DOI":"10.1002\/adom.202300112","article-title":"Microdisplays: mini-LED, micro-OLED, and micro-LED","volume":"12","author":"Miao","year":"2024","journal-title":"Adv. Opt. Mater."},{"key":"10.1016\/j.displa.2026.103536_b0025","doi-asserted-by":"crossref","first-page":"0047","DOI":"10.34133\/research.0047","article-title":"Integration technology of micro-LED for next-generation display","volume":"6","author":"Chen","year":"2023","journal-title":"Research"},{"key":"10.1016\/j.displa.2026.103536_b0030","article-title":"Monolithic InGaN multicolor light-emitting devices","volume":"16","author":"Fu","year":"2022","journal-title":"Phys. Status Solidi"},{"key":"10.1016\/j.displa.2026.103536_b0035","doi-asserted-by":"crossref","first-page":"4689","DOI":"10.1109\/TED.2023.3295764","article-title":"3400 PPI active-matrix monolithic blue and green micro-LED display","volume":"70","author":"Ji","year":"2023","journal-title":"IEEE Trans. Electron Devices"},{"key":"10.1016\/j.displa.2026.103536_b0040","doi-asserted-by":"crossref","first-page":"359","DOI":"10.1080\/19475411.2025.2500026","article-title":"Mass transfer strategies for micro LED chip assembly: pick-and-place techniques and fluidic self-assembly methods","volume":"16","author":"Zhao","year":"2025","journal-title":"Int. J. Smart Nano Mater."},{"key":"10.1016\/j.displa.2026.103536_b0045","doi-asserted-by":"crossref","DOI":"10.1088\/2631-7990\/ac92ee","article-title":"Mass transfer techniques for large-scale and high-density microLED arrays","volume":"4","author":"Chen","year":"2022","journal-title":"Int. J. Extrem. Manuf."},{"key":"10.1016\/j.displa.2026.103536_b0050","doi-asserted-by":"crossref","DOI":"10.1016\/j.optlastec.2024.111710","article-title":"Recent progress of laser processing technology in micro-LED display manufacturing: a review","volume":"181","author":"Song","year":"2025","journal-title":"Opt. Laser Technol."},{"key":"10.1016\/j.displa.2026.103536_b0055","doi-asserted-by":"crossref","DOI":"10.1016\/j.mssp.2024.109018","article-title":"Improved indium bumps bonding process using flexible composite structure temporary substrate for micro-LED display applications","volume":"186","author":"Huang","year":"2025","journal-title":"Mater. Sci. Semicond. Process."},{"key":"10.1016\/j.displa.2026.103536_b0060","doi-asserted-by":"crossref","DOI":"10.1007\/s11432-024-4111-9","article-title":"Super retina TFT based full color microLED display via laser mass transfer","volume":"67","author":"Yang","year":"2024","journal-title":"Sci. China Inf. Sci."},{"key":"10.1016\/j.displa.2026.103536_b0065","doi-asserted-by":"crossref","DOI":"10.1063\/5.0232745","article-title":"High-yield Micro-LED laser transfer accomplished using an ablation-type release material","volume":"12","author":"Xie","year":"2024","journal-title":"APL Mater."},{"key":"10.1016\/j.displa.2026.103536_b0070","doi-asserted-by":"crossref","first-page":"2213","DOI":"10.3390\/nano13152213","article-title":"Comparative analysis of optoelectrical performance in laser lift-off process for GaN-based green micro-LED arrays","volume":"13","author":"Liu","year":"2023","journal-title":"Nanomaterials"},{"key":"10.1016\/j.displa.2026.103536_b0075","doi-asserted-by":"crossref","first-page":"212","DOI":"10.1109\/LED.2023.3338174","article-title":"Study of thin film blue-light microLEDs by laser lift-off and texture process","volume":"45","author":"Hsu","year":"2024","journal-title":"IEEE Electron Device Lett."},{"key":"10.1016\/j.displa.2026.103536_b0080","doi-asserted-by":"crossref","first-page":"6705","DOI":"10.1021\/acsphotonics.5c01743","article-title":"Fabrication of high-resolution active matrix micro-LED display based on direct laser mass transfer","volume":"12","author":"Yang","year":"2025","journal-title":"ACS Photonics"},{"key":"10.1016\/j.displa.2026.103536_b0085","doi-asserted-by":"crossref","first-page":"2253","DOI":"10.1007\/s10854-023-11549-6","article-title":"Application of metal interconnection process with micro-LED display by laser-assisted bonding technology","volume":"34","author":"Tian","year":"2023","journal-title":"J. Mater. Sci. Mater. Electron."},{"key":"10.1016\/j.displa.2026.103536_b0090","doi-asserted-by":"crossref","first-page":"1795","DOI":"10.1109\/TCPMT.2025.3584053","article-title":"Advanced polymer dry etching processes for enhanced Cu\/polymer hybrid bonding","volume":"15","author":"Kim","year":"2025","journal-title":"IEEE Trans. Compon. Packag. Technol."},{"key":"10.1016\/j.displa.2026.103536_b0095","doi-asserted-by":"crossref","DOI":"10.1002\/ppap.202200068","article-title":"Surface modification of recycled polymers in comparison to virgin polymers using Ar\/O2 plasma etching","volume":"19","author":"Amberg","year":"2022","journal-title":"Plasma Processes Polym."},{"key":"10.1016\/j.displa.2026.103536_b0100","doi-asserted-by":"crossref","DOI":"10.1063\/1.3276156","article-title":"Size-dependent light output, spectral shift, and self-heating of 400 nm InGaN light-emitting diodes","volume":"107","author":"Gong","year":"2010","journal-title":"J. Appl. Phys."},{"key":"10.1016\/j.displa.2026.103536_b0105","doi-asserted-by":"crossref","DOI":"10.1149\/2162-8777\/ac63e5","article-title":"Mechanisms and performance analysis of GaN-based micro-LED grown on pattern sapphire substrate by laser lift-off Process","volume":"11","author":"Tian","year":"2022","journal-title":"ECS J. Solid State Sci. Technol."},{"key":"10.1016\/j.displa.2026.103536_b0110","doi-asserted-by":"crossref","first-page":"64","DOI":"10.1038\/s41377-025-01751-y","article-title":"Advanced technologies in InGaN micro-LED fabrication to mitigate the sidewall effect","volume":"14","author":"Liu","year":"2025","journal-title":"Light Sci. Appl."},{"key":"10.1016\/j.displa.2026.103536_b0115","doi-asserted-by":"crossref","first-page":"2014","DOI":"10.3390\/nano13132014","article-title":"Power-dependent optical characterization of the InGaN\/GaN-based micro-light-emitting-diode (LED) in high spatial resolution","volume":"13","author":"Yang","year":"2023","journal-title":"Nanomaterials"}],"container-title":["Displays"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S014193822600199X?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S014193822600199X?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2026,7,4]],"date-time":"2026-07-04T00:50:49Z","timestamp":1783126249000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S014193822600199X"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,9]]},"references-count":23,"alternative-id":["S014193822600199X"],"URL":"https:\/\/doi.org\/10.1016\/j.displa.2026.103536","relation":{},"ISSN":["0141-9382"],"issn-type":[{"value":"0141-9382","type":"print"}],"subject":[],"published":{"date-parts":[[2026,9]]},"assertion":[{"value":"Elsevier","name":"publisher","label":"This article is maintained by"},{"value":"A receiving tape etching scheme for high-yield bonding after direct laser mass transfer process of micro-LEDs","name":"articletitle","label":"Article Title"},{"value":"Displays","name":"journaltitle","label":"Journal Title"},{"value":"https:\/\/doi.org\/10.1016\/j.displa.2026.103536","name":"articlelink","label":"CrossRef DOI link to publisher maintained version"},{"value":"article","name":"content_type","label":"Content Type"},{"value":"\u00a9 2026 Elsevier B.V. All rights are reserved, including those for text and data mining, AI training, and similar technologies.","name":"copyright","label":"Copyright"}],"article-number":"103536"}}