{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,14]],"date-time":"2026-05-14T18:08:53Z","timestamp":1778782133864,"version":"3.51.4"},"reference-count":47,"publisher":"Elsevier BV","license":[{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/legal\/tdmrep-license"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-017"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-012"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-004"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["51775147"],"award-info":[{"award-number":["51775147"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["elsevier.com","sciencedirect.com"],"crossmark-restriction":true},"short-container-title":["Engineering Applications of Artificial Intelligence"],"published-print":{"date-parts":[[2026,7]]},"DOI":"10.1016\/j.engappai.2026.114590","type":"journal-article","created":{"date-parts":[[2026,3,27]],"date-time":"2026-03-27T10:06:48Z","timestamp":1774606008000},"page":"114590","update-policy":"https:\/\/doi.org\/10.1016\/elsevier_cm_policy","source":"Crossref","is-referenced-by-count":0,"special_numbering":"C","title":["Enhanced visual state space model for real-time wafer defect detection"],"prefix":"10.1016","volume":"175","author":[{"given":"Rui","family":"Sun","sequence":"first","affiliation":[]},{"given":"Dejin","family":"Zhao","sequence":"additional","affiliation":[]},{"given":"Jiajian","family":"Meng","sequence":"additional","affiliation":[]},{"given":"Jialin","family":"Li","sequence":"additional","affiliation":[]},{"given":"Jingzhe","family":"Zhang","sequence":"additional","affiliation":[]},{"given":"Bo","family":"Li","sequence":"additional","affiliation":[]},{"given":"Dexin","family":"Kong","sequence":"additional","affiliation":[]},{"given":"Xu","family":"Zhu","sequence":"additional","affiliation":[]},{"given":"Yi","family":"Xing","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0009-0009-8120-3427","authenticated-orcid":false,"given":"Jianhai","family":"Zhang","sequence":"additional","affiliation":[]}],"member":"78","reference":[{"key":"10.1016\/j.engappai.2026.114590_bib1","series-title":"2025 International Russian Smart Industry Conference (Smartindustrycon)","first-page":"115","article-title":"AI-Driven Micro defect detection for aerospace-grade metal surface quality control in Smart Manufacturing[C]","author":"Bakirci","year":"2025"},{"key":"10.1016\/j.engappai.2026.114590_bib2","doi-asserted-by":"crossref","DOI":"10.1016\/j.rineng.2024.103022","article-title":"Sky images based photovoltaic power forecasting: a novel approach with optimized VMD and Vision Mamba","volume":"24","author":"Cai","year":"2024","journal-title":"Results Eng."},{"key":"10.1016\/j.engappai.2026.114590_bib3","series-title":"European Conference on Computer Vision","article-title":"End-to-end object detection with transformers","author":"Carion","year":"2020"},{"key":"10.1016\/j.engappai.2026.114590_bib4","series-title":"European Conference on Computer Vision","article-title":"End-to-end object detection with transformers","author":"Carion","year":"2020"},{"key":"10.1016\/j.engappai.2026.114590_bib5","series-title":"2005 IEEE Computer Society Conference on Computer Vision and Pattern Recognition (CVPR'05)","first-page":"886","article-title":"Histograms of oriented gradients for human detection[C]","volume":"vol. 1","author":"Dalal","year":"2005"},{"key":"10.1016\/j.engappai.2026.114590_bib6","doi-asserted-by":"crossref","first-page":"753","DOI":"10.1016\/j.jmsy.2021.05.008","article-title":"A review on recent advances in vision-based defect recognition towards industrial intelligence","volume":"62","author":"Gao","year":"2022","journal-title":"J. Manuf. Syst."},{"key":"10.1016\/j.engappai.2026.114590_bib7","series-title":"Proceedings of the IEEE Conference on Computer Vision and Pattern Recognition","article-title":"Rich feature hierarchies for accurate object detection and semantic segmentation","author":"Girshick","year":"2014"},{"key":"10.1016\/j.engappai.2026.114590_bib8","first-page":"16712","article-title":"Zamba: a compact 7b ssm hybrid model","author":"Glorioso","year":"2024","journal-title":"arXiv preprint arXiv:2405"},{"key":"10.1016\/j.engappai.2026.114590_bib10","series-title":"Arxiv Preprint arXiv:2111.00396","article-title":"Efficiently modeling long sequences with structured state spaces","author":"Gu","year":"2021"},{"key":"10.1016\/j.engappai.2026.114590_bib9","article-title":"Mamba: Linear-time sequence modeling with selective state spaces","author":"Gu","year":"2024","journal-title":"First conference on language modeling"},{"key":"10.1016\/j.engappai.2026.114590_bib11","first-page":"35971","article-title":"On the parameterization and initialization of diagonal state space models","volume":"35","author":"Gu","year":"2022","journal-title":"Adv. Neural Inf. Process. Syst."},{"key":"10.1016\/j.engappai.2026.114590_bib12","series-title":"Proceedings of the IEEE Conference on Computer Vision and Pattern Recognition","article-title":"Deep residual learning for image recognition","author":"He","year":"2016"},{"issue":"4","key":"10.1016\/j.engappai.2026.114590_bib13","doi-asserted-by":"crossref","first-page":"1493","DOI":"10.1109\/TIM.2019.2915404","article-title":"An end-to-end steel surface defect detection approach via fusing multiple hierarchical features","volume":"69","author":"He","year":"2019","journal-title":"IEEE Trans. Instrum. Meas."},{"key":"10.1016\/j.engappai.2026.114590_bib14","series-title":"Arxiv Preprint arXiv:1704.04861","article-title":"Mobilenets: efficient convolutional neural networks for mobile vision applications","author":"Howard","year":"2017"},{"issue":"3","key":"10.1016\/j.engappai.2026.114590_bib15","doi-asserted-by":"crossref","first-page":"431","DOI":"10.1109\/TSM.2015.2443864","article-title":"Using wafer map features to better predict die-level failures in final test","volume":"28","author":"Kang","year":"2015","journal-title":"IEEE Trans. Semicond. Manuf."},{"issue":"18","key":"10.1016\/j.engappai.2026.114590_bib16","doi-asserted-by":"crossref","DOI":"10.1126\/sciadv.adk3452","article-title":"REFORMS: Consensus-based recommendations for machine-learning-based science","volume":"10","author":"Kapoor","year":"2024","journal-title":"Sci. Adv."},{"key":"10.1016\/j.engappai.2026.114590_bib17","series-title":"2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","article-title":"Wafer map classifier using deep learning for detecting out-of-distribution failure patterns","author":"Kim","year":"2020"},{"issue":"8","key":"10.1016\/j.engappai.2026.114590_bib18","doi-asserted-by":"crossref","first-page":"3215","DOI":"10.1007\/s10845-022-01994-1","article-title":"Advances in machine learning and deep learning applications towards wafer map defect recognition and classification: a review","volume":"34","author":"Kim","year":"2023","journal-title":"J. Intell. Manuf."},{"issue":"6","key":"10.1016\/j.engappai.2026.114590_bib19","doi-asserted-by":"crossref","first-page":"443","DOI":"10.1038\/s41928-023-00971-7","article-title":"Wafer-scale transistor arrays fabricated using slot-die printing of molybdenum disulfide and sodium-embedded alumina","volume":"6","author":"Kwon","year":"2023","journal-title":"Nat. Electron."},{"key":"10.1016\/j.engappai.2026.114590_bib20","article-title":"Jamba: a hybrid transformer-mamba language model","author":"Lieber","year":"2024","journal-title":"arXiv preprint arXiv:2403.19887"},{"key":"10.1016\/j.engappai.2026.114590_bib21","series-title":"Proceedings of the IEEE Conference on Computer Vision and Pattern Recognition","article-title":"Feature pyramid networks for object detection","author":"Lin","year":"2017"},{"key":"10.1016\/j.engappai.2026.114590_bib22","series-title":"Proceedings of the IEEE International Conference on Computer Vision","article-title":"Focal loss for dense object detection","author":"Lin","year":"2017"},{"key":"10.1016\/j.engappai.2026.114590_bib23","article-title":"Detr for crowd pedestrian detection","author":"Lin","year":"2020","journal-title":"arXiv preprint arXiv:2012.06785"},{"key":"10.1016\/j.engappai.2026.114590_bib24","series-title":"Scale Invariant Feature Transform","author":"Lindeberg","year":"2012"},{"issue":"1","key":"10.1016\/j.engappai.2026.114590_bib25","article-title":"Adaptive receptive field based on multi-size convolution kernel for micro-defect detection of turbine blades","volume":"35","author":"Liu","year":"2023","journal-title":"Meas. Sci. Technol."},{"key":"10.1016\/j.engappai.2026.114590_bib26","first-page":"103031","article-title":"Vmamba: visual state space model","volume":"37","author":"Liu","year":"2024","journal-title":"Adv. Neural Inf. Process. Syst."},{"key":"10.1016\/j.engappai.2026.114590_bib27","first-page":"5","article-title":"Fixing weight decay regularization in adam","author":"Loshchilov","year":"2017","journal-title":"arXiv preprint arXiv:1711.05101"},{"key":"10.1016\/j.engappai.2026.114590_bib28","first-page":"1","article-title":"Surface defects of rolled metal products recognised by a deep neural network under different illuminance levels and low-amplitude vibration","author":"Maruschak","year":"2025","journal-title":"Int. J. Adv. Manuf. Technol."},{"key":"10.1016\/j.engappai.2026.114590_bib29","article-title":"Efficient non-maximum suppression","volume":"vol. 3","author":"Neubeck","year":"2006"},{"key":"10.1016\/j.engappai.2026.114590_bib30","article-title":"Can mamba learn how to learn? A comparative study on in-context learning tasks","author":"Park","year":"2024","journal-title":"arXiv preprint arXiv:2402.04248"},{"key":"10.1016\/j.engappai.2026.114590_bib31","series-title":"Proceedings of the IEEE\/CVF International Conference on Computer Vision","article-title":"Conformer: local features coupling global representations for visual recognition","author":"Peng","year":"2021"},{"issue":"2","key":"10.1016\/j.engappai.2026.114590_bib32","doi-asserted-by":"crossref","first-page":"661","DOI":"10.1007\/s40684-021-00343-6","article-title":"State of the art in defect detection based on machine vision","volume":"9","author":"Ren","year":"2022","journal-title":"International Journal of Precision Engineering and Manufacturing-Green Technology"},{"key":"10.1016\/j.engappai.2026.114590_bib33","series-title":"Proceedings of the IEEE\/CVF Conference on Computer Vision and Pattern Recognition","article-title":"Generalized intersection over union: a metric and a loss for bounding box regression","author":"Rezatofighi","year":"2019"},{"key":"10.1016\/j.engappai.2026.114590_bib34","article-title":"Vm-unet: vision mamba unet for medical image segmentation","author":"Ruan","year":"2024","journal-title":"arXiv preprint arXiv:2402.02491"},{"issue":"2","key":"10.1016\/j.engappai.2026.114590_bib35","doi-asserted-by":"crossref","first-page":"171","DOI":"10.1109\/TSM.2019.2904306","article-title":"A voting ensemble classifier for wafer map defect patterns identification in semiconductor manufacturing","volume":"32","author":"Saqlain","year":"2019","journal-title":"IEEE Trans. Semicond. Manuf."},{"issue":"2","key":"10.1016\/j.engappai.2026.114590_bib36","doi-asserted-by":"crossref","first-page":"258","DOI":"10.1109\/TSM.2020.2974867","article-title":"Active learning of convolutional neural network for cost-effective wafer map pattern classification","volume":"33","author":"Shim","year":"2020","journal-title":"IEEE Trans. Semicond. Manuf."},{"issue":"1","key":"10.1016\/j.engappai.2026.114590_bib37","doi-asserted-by":"crossref","first-page":"8317","DOI":"10.1038\/s41467-025-63913-1","article-title":"Risks of AI scientists: prioritizing safeguarding over autonomy","volume":"16","author":"Tang","year":"2025","journal-title":"Nat. Commun."},{"issue":"2","key":"10.1016\/j.engappai.2026.114590_bib38","doi-asserted-by":"crossref","first-page":"41","DOI":"10.1109\/MCSE.2017.29","article-title":"The end of moore's law: a new beginning for information technology","volume":"19","author":"Theis","year":"2017","journal-title":"Comput. Sci. Eng."},{"key":"10.1016\/j.engappai.2026.114590_bib39","series-title":"Proceedings of the IEEE\/CVF Conference on Computer Vision and Pattern Recognition","article-title":"Internimage: exploring large-scale vision foundation models with deformable convolutions","author":"Wang","year":"2023"},{"issue":"1","key":"10.1016\/j.engappai.2026.114590_bib40","first-page":"1","article-title":"Wafer map failure pattern recognition and similarity ranking for large-scale data sets","volume":"28","author":"Wu","year":"2014","journal-title":"IEEE Trans. Semicond. Manuf."},{"issue":"8","key":"10.1016\/j.engappai.2026.114590_bib41","doi-asserted-by":"crossref","first-page":"10317","DOI":"10.1109\/TPAMI.2023.3261659","article-title":"Progressive instance-aware feature learning for compositional action recognition","volume":"45","author":"Yan","year":"2023","journal-title":"IEEE Trans. Pattern Anal. Mach. Intell."},{"issue":"6","key":"10.1016\/j.engappai.2026.114590_bib42","first-page":"871","article-title":"Research progress and prospect of machine vision technology","volume":"41","author":"Yun","year":"2020","journal-title":"Journal of graphics"},{"key":"10.1016\/j.engappai.2026.114590_bib43","series-title":"Computer Vision\u2013ECCV 2020: 16Th European Conference, Glasgow, UK, August 23\u201328, 2020, Proceedings, Part XXVIII 16","article-title":"Feature pyramid transformer","author":"Zhang","year":"2020"},{"issue":"1","key":"10.1016\/j.engappai.2026.114590_bib44","article-title":"DC-Mamba for surface micro defect classification on large aperture optics with multi axis attention","volume":"15","author":"Zhao","year":"2025","journal-title":"Sci. Rep."},{"key":"10.1016\/j.engappai.2026.114590_bib45","article-title":"Deformable detr: deformable transformers for end-to-end object detection","author":"Zhu","year":"2020","journal-title":"arXiv preprint arXiv:2010.04159"},{"key":"10.1016\/j.engappai.2026.114590_bib46","article-title":"Deformable detr: deformable transformers for end-to-end object detection","author":"Zhu","year":"2020","journal-title":"arxiv preprint arxiv:2010.04159"},{"key":"10.1016\/j.engappai.2026.114590_bib47","article-title":"Vision mamba: efficient visual representation learning with bidirectional State space model","author":"Zhu","year":"2024","journal-title":"ArXiv abs\/2401.09417"}],"container-title":["Engineering Applications of Artificial Intelligence"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0952197626008717?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0952197626008717?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2026,5,14]],"date-time":"2026-05-14T17:13:35Z","timestamp":1778778815000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0952197626008717"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,7]]},"references-count":47,"alternative-id":["S0952197626008717"],"URL":"https:\/\/doi.org\/10.1016\/j.engappai.2026.114590","relation":{},"ISSN":["0952-1976"],"issn-type":[{"value":"0952-1976","type":"print"}],"subject":[],"published":{"date-parts":[[2026,7]]},"assertion":[{"value":"Elsevier","name":"publisher","label":"This article is maintained by"},{"value":"Enhanced visual state space model for real-time wafer defect detection","name":"articletitle","label":"Article Title"},{"value":"Engineering Applications of Artificial Intelligence","name":"journaltitle","label":"Journal Title"},{"value":"https:\/\/doi.org\/10.1016\/j.engappai.2026.114590","name":"articlelink","label":"CrossRef DOI link to publisher maintained version"},{"value":"article","name":"content_type","label":"Content Type"},{"value":"\u00a9 2026 Elsevier Ltd. All rights are reserved, including those for text and data mining, AI training, and similar technologies.","name":"copyright","label":"Copyright"}],"article-number":"114590"}}