{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,14]],"date-time":"2026-05-14T18:10:00Z","timestamp":1778782200918,"version":"3.51.4"},"reference-count":48,"publisher":"Elsevier BV","license":[{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/legal\/tdmrep-license"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-017"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-012"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-004"}],"funder":[{"DOI":"10.13039\/501100003489","name":"Henan University of Technology","doi-asserted-by":"publisher","award":["2022BS034"],"award-info":[{"award-number":["2022BS034"]}],"id":[{"id":"10.13039\/501100003489","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002338","name":"Ministry of Education of the People's Republic of China","doi-asserted-by":"publisher","award":["KFJJ2024010"],"award-info":[{"award-number":["KFJJ2024010"]}],"id":[{"id":"10.13039\/501100002338","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002338","name":"Ministry of Education of the People's Republic of China","doi-asserted-by":"publisher","award":["2024TXTD18"],"award-info":[{"award-number":["2024TXTD18"]}],"id":[{"id":"10.13039\/501100002338","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100010950","name":"Department of Science and Technology of Henan Province","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100010950","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100012165","name":"Key Technologies Research and Development Program","doi-asserted-by":"publisher","award":["242102211005"],"award-info":[{"award-number":["242102211005"]}],"id":[{"id":"10.13039\/501100012165","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["elsevier.com","sciencedirect.com"],"crossmark-restriction":true},"short-container-title":["Engineering Applications of Artificial Intelligence"],"published-print":{"date-parts":[[2026,7]]},"DOI":"10.1016\/j.engappai.2026.114677","type":"journal-article","created":{"date-parts":[[2026,3,31]],"date-time":"2026-03-31T17:59:16Z","timestamp":1774979956000},"page":"114677","update-policy":"https:\/\/doi.org\/10.1016\/elsevier_cm_policy","source":"Crossref","is-referenced-by-count":0,"special_numbering":"C","title":["Siamese network for insulated gate bipolar transistor welding layer localization in computed laminography images using sharpness guidance"],"prefix":"10.1016","volume":"175","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-3430-2165","authenticated-orcid":false,"given":"Yan","family":"Li","sequence":"first","affiliation":[]},{"given":"Shuangquan","family":"Liu","sequence":"additional","affiliation":[]},{"given":"Cunfeng","family":"Wei","sequence":"additional","affiliation":[]},{"given":"Baodong","family":"Liu","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6479-5477","authenticated-orcid":false,"given":"Chao","family":"Fan","sequence":"additional","affiliation":[]}],"member":"78","reference":[{"key":"10.1016\/j.engappai.2026.114677_b1","doi-asserted-by":"crossref","first-page":"145","DOI":"10.1016\/j.bspc.2016.02.006","article-title":"Review of medical image quality assessment","volume":"27","author":"Chow","year":"2016","journal-title":"Biomed. Signal Process. Control."},{"key":"10.1016\/j.engappai.2026.114677_b2","series-title":"2009 IEEE Conference on Computer Vision and Pattern Recognition","first-page":"248","article-title":"Imagenet: A large-scale hierarchical image database","author":"Deng","year":"2009"},{"key":"10.1016\/j.engappai.2026.114677_b3","doi-asserted-by":"crossref","DOI":"10.1016\/j.ndteint.2021.102597","article-title":"Approach to weld segmentation and defect classification in radiographic images of pipe welds","volume":"127","author":"Golodov","year":"2022","journal-title":"Ndt E Int."},{"issue":"6","key":"10.1016\/j.engappai.2026.114677_b4","first-page":"20","article-title":"Welding defect detection of x-ray images based on faster r-cnn model","volume":"42","author":"Guo","year":"2019","journal-title":"J. Beijing Univ. Posts Telecommun."},{"issue":"2","key":"10.1016\/j.engappai.2026.114677_b5","doi-asserted-by":"crossref","first-page":"2080","DOI":"10.1109\/TPEL.2020.3005940","article-title":"A review of SiC IGBT: models, fabrications, characteristics, and applications","volume":"36","author":"Han","year":"2020","journal-title":"IEEE Trans. Power Electron."},{"key":"10.1016\/j.engappai.2026.114677_b6","doi-asserted-by":"crossref","unstructured":"He, K., Zhang, X., Ren, S., Sun, J., 2016. Deep residual learning for image recognition. In: Proceedings of the IEEE Conference on Computer Vision and Pattern Recognition. pp. 770\u2013778.","DOI":"10.1109\/CVPR.2016.90"},{"key":"10.1016\/j.engappai.2026.114677_b7","series-title":"Mobilenets: Efficient convolutional neural networks for mobile vision applications","author":"Howard","year":"2017"},{"key":"10.1016\/j.engappai.2026.114677_b8","doi-asserted-by":"crossref","unstructured":"Huang, G., Liu, Z., Van Der Maaten, L., Weinberger, K.Q., 2017. Densely connected convolutional networks. In: Proceedings of the IEEE Conference on Computer Vision and Pattern Recognition. pp. 4700\u20134708.","DOI":"10.1109\/CVPR.2017.243"},{"key":"10.1016\/j.engappai.2026.114677_b9","series-title":"SqueezeNet: AlexNet-level accuracy with 50x fewer parameters and < 0.5 MB model size","author":"Iandola","year":"2016"},{"issue":"3","key":"10.1016\/j.engappai.2026.114677_b10","doi-asserted-by":"crossref","first-page":"741","DOI":"10.1109\/TED.2017.2654599","article-title":"IGBT history, state-of-the-art, and future prospects","volume":"64","author":"Iwamuro","year":"2017","journal-title":"IEEE Trans. Electron Devices"},{"key":"10.1016\/j.engappai.2026.114677_b11","series-title":"Focus optimisation criteria for computer image processing","author":"Jarvis","year":"1976"},{"key":"10.1016\/j.engappai.2026.114677_b12","series-title":"Insulated gate bipolar transistor IGBT theory and design","author":"Khanna","year":"2004"},{"key":"10.1016\/j.engappai.2026.114677_b13","article-title":"Imagenet classification with deep convolutional neural networks","volume":"25","author":"Krizhevsky","year":"2012","journal-title":"Adv. Neural Inf. Process. Syst."},{"key":"10.1016\/j.engappai.2026.114677_b14","series-title":"Active Computer Vision by Cooperative Focus and Stereo","author":"Krotkov","year":"2012"},{"issue":"11","key":"10.1016\/j.engappai.2026.114677_b15","doi-asserted-by":"crossref","first-page":"2278","DOI":"10.1109\/5.726791","article-title":"Gradient-based learning applied to document recognition","volume":"86","author":"LeCun","year":"2002","journal-title":"Proc. IEEE"},{"issue":"3","key":"10.1016\/j.engappai.2026.114677_b16","doi-asserted-by":"crossref","first-page":"449","DOI":"10.1109\/30.468047","article-title":"Implementation of a passive automatic focusing algorithm for digital still camera","volume":"41","author":"Lee","year":"1995","journal-title":"IEEE Trans. Consum. Electron."},{"key":"10.1016\/j.engappai.2026.114677_b17","doi-asserted-by":"crossref","DOI":"10.1016\/j.microrel.2020.113966","article-title":"Automated defect detection of insulated gate bipolar transistor based on computed laminography imaging","volume":"115","author":"Li","year":"2020","journal-title":"Microelectron. Reliab."},{"issue":"4","key":"10.1016\/j.engappai.2026.114677_b18","doi-asserted-by":"crossref","first-page":"145","DOI":"10.1007\/s42452-024-05807-3","article-title":"Online learning for DBC segmentation of new IGBT samples based on computed laminography imaging","volume":"6","author":"Li","year":"2024","journal-title":"Discov. Appl. Sci."},{"key":"10.1016\/j.engappai.2026.114677_b19","doi-asserted-by":"crossref","DOI":"10.1016\/j.measurement.2023.112497","article-title":"A pixel-level weak supervision segmentation method for typical defect images in X-ray inspection of solid rocket motors combustion chamber","volume":"211","author":"Li","year":"2023","journal-title":"Measurement"},{"issue":"5","key":"10.1016\/j.engappai.2026.114677_b20","doi-asserted-by":"crossref","first-page":"053001","DOI":"10.1117\/1.1901686","article-title":"Autofocus system for space cameras","volume":"44","author":"Li","year":"2005","journal-title":"Opt. Eng., Bellingham"},{"issue":"7","key":"10.1016\/j.engappai.2026.114677_b21","doi-asserted-by":"crossref","first-page":"7430","DOI":"10.1109\/JSEN.2023.3247006","article-title":"LF-YOLO: A lighter and faster YOLO for weld defect detection of X-ray image","volume":"23","author":"Liu","year":"2023","journal-title":"IEEE Sensors J."},{"key":"10.1016\/j.engappai.2026.114677_b22","doi-asserted-by":"crossref","DOI":"10.1016\/j.engappai.2024.109142","article-title":"Twin data multimode collaborative transfer learning for bearing failure diagnosis","volume":"137","author":"Liu","year":"2024","journal-title":"Eng. Appl. Artif. Intell."},{"key":"10.1016\/j.engappai.2026.114677_b23","unstructured":"Liu, B., Wei, C., Wei, L., Hu, S., 2017. Computed laminography system for IGBT testing. In: 15th Asia Pacifc Conference for Non-Destructive Testing."},{"key":"10.1016\/j.engappai.2026.114677_b24","doi-asserted-by":"crossref","DOI":"10.1016\/j.engappai.2025.111163","article-title":"Semi-supervised dual-constraint centroid contrastive prototypical network for flip chip defect detection under limited labeled data","volume":"156","author":"Lou","year":"2025","journal-title":"Eng. Appl. Artif. Intell."},{"key":"10.1016\/j.engappai.2026.114677_b25","doi-asserted-by":"crossref","DOI":"10.1016\/j.compmedimag.2020.101847","article-title":"Ultrasound volume projection image quality selection by ranking from convolutional RankNet","volume":"89","author":"Lyu","year":"2021","journal-title":"Comput. Med. Imaging Graph."},{"issue":"4","key":"10.1016\/j.engappai.2026.114677_b26","doi-asserted-by":"crossref","first-page":"611","DOI":"10.1007\/s40194-021-01229-6","article-title":"In situ detection of welding defects: A review","volume":"66","author":"Madhvacharyula","year":"2022","journal-title":"Weld. the World"},{"issue":"12","key":"10.1016\/j.engappai.2026.114677_b27","doi-asserted-by":"crossref","first-page":"4695","DOI":"10.1109\/TIP.2012.2214050","article-title":"No-reference image quality assessment in the spatial domain","volume":"21","author":"Mittal","year":"2012","journal-title":"IEEE Trans. Image Process."},{"issue":"3","key":"10.1016\/j.engappai.2026.114677_b28","doi-asserted-by":"crossref","first-page":"209","DOI":"10.1109\/LSP.2012.2227726","article-title":"Making a \u201ccompletely blind\u201d image quality analyzer","volume":"20","author":"Mittal","year":"2012","journal-title":"IEEE Signal Process. Lett."},{"key":"10.1016\/j.engappai.2026.114677_b29","series-title":"2008 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)","first-page":"103","article-title":"Recent advancement in high voltage power devices and ics; challenges to achieve silicon limit characteristics","author":"Nakagawa","year":"2008"},{"key":"10.1016\/j.engappai.2026.114677_b30","series-title":"Machine perception of three-dimensional solids","author":"Roberts","year":"1961"},{"key":"10.1016\/j.engappai.2026.114677_b31","doi-asserted-by":"crossref","first-page":"106","DOI":"10.1016\/j.ndteint.2016.12.005","article-title":"Registration of a priori information for computed laminography","volume":"86","author":"Schorr","year":"2017","journal-title":"NDT & E Int."},{"key":"10.1016\/j.engappai.2026.114677_b32","doi-asserted-by":"crossref","unstructured":"Selvaraju, R.R., Cogswell, M., Das, A., Vedantam, R., Parikh, D., Batra, D., 2017. Grad-cam: Visual explanations from deep networks via gradient-based localization. In: Proceedings of the IEEE International Conference on Computer Vision. pp. 618\u2013626.","DOI":"10.1109\/ICCV.2017.74"},{"key":"10.1016\/j.engappai.2026.114677_b33","doi-asserted-by":"crossref","DOI":"10.1016\/j.engappai.2024.109159","article-title":"Piston aero-engine fault cross-domain diagnosis based on unpaired generative transfer learning","volume":"137","author":"Shen","year":"2024","journal-title":"Eng. Appl. Artif. Intell."},{"key":"10.1016\/j.engappai.2026.114677_b34","series-title":"Very deep convolutional networks for large-scale image recognition","author":"Simonyan","year":"2014"},{"issue":"8","key":"10.1016\/j.engappai.2026.114677_b35","doi-asserted-by":"crossref","first-page":"864","DOI":"10.1109\/34.709612","article-title":"Selecting the optimal focus measure for autofocusing and depth-from-focus","volume":"20","author":"Subbarao","year":"1998","journal-title":"IEEE Trans. Pattern Anal. Mach. Intell."},{"key":"10.1016\/j.engappai.2026.114677_b36","doi-asserted-by":"crossref","unstructured":"Szegedy, C., Liu, W., Jia, Y., Sermanet, P., Reed, S., Anguelov, D., Erhan, D., Vanhoucke, V., Rabinovich, A., 2015. Going deeper with convolutions. In: Proceedings of the IEEE Conference on Computer Vision and Pattern Recognition. pp. 1\u20139.","DOI":"10.1109\/CVPR.2015.7298594"},{"key":"10.1016\/j.engappai.2026.114677_b37","series-title":"International Conference on Machine Learning","first-page":"6105","article-title":"Efficientnet: Rethinking model scaling for convolutional neural networks","author":"Tan","year":"2019"},{"key":"10.1016\/j.engappai.2026.114677_b38","series-title":"Accommodation in computer vision","author":"Tenenbaum","year":"1971"},{"key":"10.1016\/j.engappai.2026.114677_b39","series-title":"2018 IEEE International Conference on Systems, Man, and Cybernetics","first-page":"2509","article-title":"Relative aesthetic quality ranking","author":"Tian","year":"2018"},{"issue":"4","key":"10.1016\/j.engappai.2026.114677_b40","doi-asserted-by":"crossref","first-page":"643","DOI":"10.1007\/s40194-022-01257-w","article-title":"Automated defect detection in digital radiography of aerospace welds using deep learning","volume":"66","author":"Tyystj\u00e4rvi","year":"2022","journal-title":"Weld. the World"},{"key":"10.1016\/j.engappai.2026.114677_b41","series-title":"Modern Image Quality Assessment","author":"Wang","year":"2006"},{"issue":"4","key":"10.1016\/j.engappai.2026.114677_b42","doi-asserted-by":"crossref","first-page":"600","DOI":"10.1109\/TIP.2003.819861","article-title":"Image quality assessment: from error visibility to structural similarity","volume":"13","author":"Wang","year":"2004","journal-title":"IEEE Trans. Image Process."},{"key":"10.1016\/j.engappai.2026.114677_b43","doi-asserted-by":"crossref","DOI":"10.1016\/j.engappai.2025.111131","article-title":"The end-to-end chip surface defect segmentation method based on the diffusion model and attention mechanism","volume":"155","author":"Xia","year":"2025","journal-title":"Eng. Appl. Artif. Intell."},{"issue":"02","key":"10.1016\/j.engappai.2026.114677_b44","first-page":"125","article-title":"Influence of solder void to thermal distribution of IGBT module","volume":"9","author":"Xu","year":"2014","journal-title":"J. China Acad. Electron. Inf. Technol."},{"issue":"5","key":"10.1016\/j.engappai.2026.114677_b45","doi-asserted-by":"crossref","first-page":"2200","DOI":"10.1109\/TIP.2018.2883741","article-title":"Two-stream convolutional networks for blind image quality assessment","volume":"28","author":"Yan","year":"2018","journal-title":"IEEE Trans. Image Process."},{"issue":"15","key":"10.1016\/j.engappai.2026.114677_b46","doi-asserted-by":"crossref","first-page":"1237","DOI":"10.1080\/08839514.2021.1975391","article-title":"Deep learning based steel pipe weld defect detection","volume":"35","author":"Yang","year":"2021","journal-title":"Appl. Artif. Intell."},{"issue":"7","key":"10.1016\/j.engappai.2026.114677_b47","doi-asserted-by":"crossref","first-page":"725","DOI":"10.1016\/j.image.2014.05.004","article-title":"C-DIIVINE: No-reference image quality assessment based on local magnitude and phase statistics of natural scenes","volume":"29","author":"Zhang","year":"2014","journal-title":"Signal Process., Image Commun."},{"key":"10.1016\/j.engappai.2026.114677_b48","doi-asserted-by":"crossref","unstructured":"Zhang, X., Zhou, X., Lin, M., Sun, J., 2018. Shufflenet: An extremely efficient convolutional neural network for mobile devices. In: Proceedings of the IEEE Conference on Computer Vision and Pattern Recognition. pp. 6848\u20136856.","DOI":"10.1109\/CVPR.2018.00716"}],"container-title":["Engineering Applications of Artificial Intelligence"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0952197626009590?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0952197626009590?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2026,5,14]],"date-time":"2026-05-14T17:18:32Z","timestamp":1778779112000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0952197626009590"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,7]]},"references-count":48,"alternative-id":["S0952197626009590"],"URL":"https:\/\/doi.org\/10.1016\/j.engappai.2026.114677","relation":{},"ISSN":["0952-1976"],"issn-type":[{"value":"0952-1976","type":"print"}],"subject":[],"published":{"date-parts":[[2026,7]]},"assertion":[{"value":"Elsevier","name":"publisher","label":"This article is maintained by"},{"value":"Siamese network for insulated gate bipolar transistor welding layer localization in computed laminography images using sharpness guidance","name":"articletitle","label":"Article Title"},{"value":"Engineering Applications of Artificial Intelligence","name":"journaltitle","label":"Journal Title"},{"value":"https:\/\/doi.org\/10.1016\/j.engappai.2026.114677","name":"articlelink","label":"CrossRef DOI link to publisher maintained version"},{"value":"article","name":"content_type","label":"Content Type"},{"value":"\u00a9 2026 Elsevier Ltd. All rights are reserved, including those for text and data mining, AI training, and similar technologies.","name":"copyright","label":"Copyright"}],"article-number":"114677"}}