{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,4]],"date-time":"2026-05-04T11:56:18Z","timestamp":1777895778627,"version":"3.51.4"},"reference-count":15,"publisher":"Elsevier BV","license":[{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/legal\/tdmrep-license"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-017"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-012"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-004"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["elsevier.com","sciencedirect.com"],"crossmark-restriction":true},"short-container-title":["Microelectronics Journal"],"published-print":{"date-parts":[[2026,7]]},"DOI":"10.1016\/j.mejo.2026.107124","type":"journal-article","created":{"date-parts":[[2026,2,28]],"date-time":"2026-02-28T07:48:17Z","timestamp":1772264897000},"page":"107124","update-policy":"https:\/\/doi.org\/10.1016\/elsevier_cm_policy","source":"Crossref","is-referenced-by-count":0,"special_numbering":"C","title":["Deep trench capacitor embedded in 3D-IC multi-wafer hybrid bonding package for power delivery network optimization"],"prefix":"10.1016","volume":"173","author":[{"given":"Sheng","family":"Hu","sequence":"first","affiliation":[]},{"given":"Huajun","family":"Sun","sequence":"additional","affiliation":[]},{"given":"Jun","family":"Zhou","sequence":"additional","affiliation":[]},{"given":"Qiong","family":"Zhan","sequence":"additional","affiliation":[]},{"given":"Peng","family":"Sun","sequence":"additional","affiliation":[]},{"given":"Beibei","family":"Sheng","sequence":"additional","affiliation":[]},{"given":"Peng","family":"Zhu","sequence":"additional","affiliation":[]},{"given":"Changtian","family":"Cao","sequence":"additional","affiliation":[]},{"given":"Daohong","family":"Yang","sequence":"additional","affiliation":[]},{"given":"Xiangshui","family":"Miao","sequence":"additional","affiliation":[]}],"member":"78","reference":[{"key":"10.1016\/j.mejo.2026.107124_bib1","series-title":"2022 23rd International Conference on Electronic Packaging Technology (ICEPT), Dalian, China","first-page":"1","article-title":"Design and simulation of deep trench capacitor on high-performance silicon interposer","author":"Song","year":"2022"},{"key":"10.1016\/j.mejo.2026.107124_bib2","series-title":"2022 IEEE International Solid-State Circuits Conference (ISSCC)","first-page":"1","article-title":"184QPS\/W 64Mb\/mm23D Logic-to-DRAM hybrid bonding with process-near-memory engine for recommendation system","author":"Niu","year":"2022"},{"key":"10.1016\/j.mejo.2026.107124_bib3","first-page":"1431","article-title":"Novel RDL design of wafer-level packaging for signal\/power integrity in LPDDR4 application","volume":"8","author":"Wu","year":"2018"},{"key":"10.1016\/j.mejo.2026.107124_bib4","series-title":"2020 50tt European Microwave Conference (EuMC), Utrecht, Netherlands","first-page":"260","article-title":"Power delivery network impedance profile and voltage droop optimization","author":"Moreno-Mojica","year":"2021"},{"issue":"4","key":"10.1016\/j.mejo.2026.107124_bib5","doi-asserted-by":"crossref","first-page":"2077","DOI":"10.1109\/TED.2021.3058226","article-title":"3-D CMOS chip stacking for security ICs featuring backside buried metal power delivery networks with distributed capacitance","volume":"68","author":"Monta","year":"2021","journal-title":"IEEE Trans. Electron. Dev."},{"key":"10.1016\/j.mejo.2026.107124_bib6","series-title":"2020 IEEE 701b Electronic Components and Technology Conference(ECTC), Orlando, FL, USA","first-page":"1358","article-title":"Power integrity performance gain of a noval integrated stack capacitor (ISC) solution for high-end computing applications","author":"Song","year":"2020"},{"key":"10.1016\/j.mejo.2026.107124_bib7","series-title":"2020 IEEE 70 Electronic Components and Technology Conference(ECTC), Orlando FL, USA","first-page":"380","article-title":"Design and analysis of Logic-HBM2E power delivery system on CoWoS@ platform with deep trench capacitor","author":"Chen","year":"2020"},{"key":"10.1016\/j.mejo.2026.107124_bib8","series-title":"2022 IEEE 72nd Electronic Components and Technology Conference(ECTC), S\u0101n Diego, CA, USA","first-page":"283","article-title":"Functional Interposer Embedded with Multi-Terminal Si Capacitor for 2.5D\/3D Applications Using Planarization and Bumpless Chip-on-Wafer(COW)","author":"Satake","year":"2022"},{"issue":"8","key":"10.1016\/j.mejo.2026.107124_bib9","doi-asserted-by":"crossref","first-page":"4453","DOI":"10.1109\/TED.2022.3186657","article-title":"A holistic evaluation of buried power rails and back-side power for Sub-5 nm technology nodes","volume":"69","author":"Nibhanupudi","year":"2022","journal-title":"IEEE Trans. Electron. Dev."},{"key":"10.1016\/j.mejo.2026.107124_bib10","series-title":"2020 IEEE 70\u1d50 Electronic Components and Technology Conference(ECTC), Orlando, FL, USA","first-page":"2295","article-title":"Deep trench capacitors in silicon interconnect fabric","author":"Kannan","year":"2020"},{"key":"10.1016\/j.mejo.2026.107124_bib11","series-title":"2021 Symposium on VLSI Circuits, Kyoto, Japan","first-page":"1","article-title":"Design and technology solutions for 3D integrated high performance systems","author":"Van der Plas","year":"2021"},{"key":"10.1016\/j.mejo.2026.107124_bib12","series-title":"2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA","first-page":"1383","article-title":"Modeling and characterization of Through-Silicon-Vias(TSVs) in radio frequency regime in an active interposer technology","author":"Rahimi","year":"2020"},{"issue":"1","key":"10.1016\/j.mejo.2026.107124_bib13","doi-asserted-by":"crossref","first-page":"23","DOI":"10.1109\/TSM.2012.2236369","article-title":"Through-Silicon-via fabrication technologies, passives extraction, and electrical modeling for 3-D integration\/packaging","volume":"26","author":"Xu","year":"2013","journal-title":"IEEE Trans. Semicond. Manuf."},{"issue":"7","key":"10.1016\/j.mejo.2026.107124_bib14","doi-asserted-by":"crossref","first-page":"894","DOI":"10.1109\/TVLSI.2008.2000454","article-title":"Effective Radii of On-Chip decoupling capacitors","volume":"16","author":"Popovich","year":"2008","journal-title":"IEEE Trans. Very Large Scale Integr. Syst."},{"issue":"11","key":"10.1016\/j.mejo.2026.107124_bib15","doi-asserted-by":"crossref","first-page":"3218","DOI":"10.1109\/TVLSI.2016.2549275","article-title":"A study of 3-D power delivery networks with multiple clock domains","volume":"24","author":"Todri-Sanial","year":"2016","journal-title":"IEEE Trans. Very Large Scale Integr. Syst."}],"container-title":["Microelectronics Journal"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S1879239126000809?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S1879239126000809?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2026,5,1]],"date-time":"2026-05-01T08:03:20Z","timestamp":1777622600000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S1879239126000809"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,7]]},"references-count":15,"alternative-id":["S1879239126000809"],"URL":"https:\/\/doi.org\/10.1016\/j.mejo.2026.107124","relation":{},"ISSN":["1879-2391"],"issn-type":[{"value":"1879-2391","type":"print"}],"subject":[],"published":{"date-parts":[[2026,7]]},"assertion":[{"value":"Elsevier","name":"publisher","label":"This article is maintained by"},{"value":"Deep trench capacitor embedded in 3D-IC multi-wafer hybrid bonding package for power delivery network optimization","name":"articletitle","label":"Article Title"},{"value":"Microelectronics Journal","name":"journaltitle","label":"Journal Title"},{"value":"https:\/\/doi.org\/10.1016\/j.mejo.2026.107124","name":"articlelink","label":"CrossRef DOI link to publisher maintained version"},{"value":"article","name":"content_type","label":"Content Type"},{"value":"\u00a9 2026 Elsevier Ltd. All rights are reserved, including those for text and data mining, AI training, and similar technologies.","name":"copyright","label":"Copyright"}],"article-number":"107124"}}