{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,15]],"date-time":"2026-05-15T08:14:31Z","timestamp":1778832871001,"version":"3.51.4"},"reference-count":21,"publisher":"Elsevier BV","license":[{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/legal\/tdmrep-license"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-017"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-012"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-004"}],"funder":[{"DOI":"10.13039\/501100006606","name":"Natural Science Foundation of Tianjin Municipality","doi-asserted-by":"publisher","award":["24JCZDJC00690"],"award-info":[{"award-number":["24JCZDJC00690"]}],"id":[{"id":"10.13039\/501100006606","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2024YFB4207000"],"award-info":[{"award-number":["2024YFB4207000"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["elsevier.com","sciencedirect.com"],"crossmark-restriction":true},"short-container-title":["Microelectronics Journal"],"published-print":{"date-parts":[[2026,7]]},"DOI":"10.1016\/j.mejo.2026.107135","type":"journal-article","created":{"date-parts":[[2026,2,26]],"date-time":"2026-02-26T16:11:57Z","timestamp":1772122317000},"page":"107135","update-policy":"https:\/\/doi.org\/10.1016\/elsevier_cm_policy","source":"Crossref","is-referenced-by-count":0,"special_numbering":"C","title":["An aging monitoring method of IGBT module bond wires based on active filter gain"],"prefix":"10.1016","volume":"173","author":[{"given":"Mingxing","family":"Du","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wei","family":"Han","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Haiqing","family":"Gu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"78","reference":[{"key":"10.1016\/j.mejo.2026.107135_bib1","doi-asserted-by":"crossref","first-page":"167","DOI":"10.1016\/j.mejo.2016.05.001","article-title":"Analytical PSpice model for SiC MOSFET based high power modules","volume":"53","author":"Johannesson","year":"2016","journal-title":"Microelectron. J."},{"key":"10.1016\/j.mejo.2026.107135_bib2","doi-asserted-by":"crossref","DOI":"10.1016\/j.mejo.2025.106671","article-title":"4H-SiC semi-superjunction IGBT with split-gate and back-side trench heterojunction for low loss and low EMI noise","volume":"159","author":"Wu","year":"2025","journal-title":"Microelectron. J."},{"key":"10.1016\/j.mejo.2026.107135_bib3","doi-asserted-by":"crossref","DOI":"10.1016\/j.mejo.2025.106974","article-title":"Novel 4H-SiC IGBT design for improved turn-on performance and dV\/dt controllability based on space charge modulation","volume":"167","author":"Wu","year":"2026","journal-title":"Microelectron. J."},{"issue":"6","key":"10.1016\/j.mejo.2026.107135_bib4","doi-asserted-by":"crossref","first-page":"2040","DOI":"10.1109\/TEMC.2019.2953055","article-title":"A survey of active EMI filters for conducted EMI noise reduction in power electronic converters","volume":"61","author":"Narayanasamy","year":"2019","journal-title":"IEEE Trans. Electromagn C."},{"issue":"1","key":"10.1016\/j.mejo.2026.107135_bib5","doi-asserted-by":"crossref","first-page":"1084","DOI":"10.1109\/JESTPE.2021.3112576","article-title":"Investigation of Cascade connection method to improve the insertion loss of DM active EMI filters","volume":"10","author":"Zhou","year":"2022","journal-title":"IEEE J. Emerg. Select. Topics Power Electron."},{"issue":"11","key":"10.1016\/j.mejo.2026.107135_bib6","doi-asserted-by":"crossref","first-page":"14353","DOI":"10.1109\/TPEL.2024.3435940","article-title":"Insertion loss analysis and optimization of a current based common-mode active EMI filter","volume":"39","author":"Liu","year":"2024","journal-title":"IEEE Trans. Power Electron."},{"key":"10.1016\/j.mejo.2026.107135_bib7","doi-asserted-by":"crossref","DOI":"10.1016\/j.mejo.2024.106430","article-title":"Scalable, low-power and high-performance active-RC complex band-pass\/low-pass filter with automatic frequency tuning applied to the internet of things","volume":"153","author":"Yuan","year":"2024","journal-title":"Microelectron. J."},{"issue":"6","key":"10.1016\/j.mejo.2026.107135_bib8","doi-asserted-by":"crossref","first-page":"1309","DOI":"10.1109\/TPEL.2003.818829","article-title":"A new active common-mode EMI filter for PWM inverter","volume":"18","author":"Son","year":"2003","journal-title":"IEEE Trans. Power Electron."},{"key":"10.1016\/j.mejo.2026.107135_bib9","series-title":"1987 IEEE Power Electronics Specialists Conference","first-page":"195","article-title":"Design of active ripple filters for power circuits operating in the 1\u201310 MHz range","author":"LaWhite","year":"1987"},{"issue":"4","key":"10.1016\/j.mejo.2026.107135_bib10","doi-asserted-by":"crossref","first-page":"1034","DOI":"10.1109\/TPEL.2009.2033601","article-title":"Investigation of hybrid EMI filters for common-mode EMI suppression in a motor drive system","volume":"25","author":"Wang","year":"2010","journal-title":"IEEE Trans. Power Electron."},{"issue":"1","key":"10.1016\/j.mejo.2026.107135_bib11","doi-asserted-by":"crossref","first-page":"268","DOI":"10.1109\/TEMC.2020.2991862","article-title":"An effective EMTR-based high-impedance fault location method for transmission lines","volume":"63","author":"An","year":"2021","journal-title":"IEEE Trans. Electromagn C."},{"issue":"2","key":"10.1016\/j.mejo.2026.107135_bib12","doi-asserted-by":"crossref","first-page":"1899","DOI":"10.1109\/TPEL.2019.2916358","article-title":"Application of EMR signature in health assessment and monitoring of IGBT-based converters","volume":"35","author":"Biswas","year":"2020","journal-title":"IEEE Trans. Power Electron."},{"issue":"4","key":"10.1016\/j.mejo.2026.107135_bib13","doi-asserted-by":"crossref","first-page":"742","DOI":"10.1109\/TEMC.2006.882859","article-title":"Multiple slope switching waveform approximation to improve conducted EMI spectral analysis of power converters","volume":"48","author":"Meng","year":"2006","journal-title":"IEEE Trans. Electromagn C."},{"issue":"5","key":"10.1016\/j.mejo.2026.107135_bib14","doi-asserted-by":"crossref","first-page":"1577","DOI":"10.1109\/TIE.2006.882009","article-title":"Power converter EMI analysis including IGBT nonlinear switching transient model","volume":"53","author":"Jin","year":"2006","journal-title":"IEEE Trans. Ind. Electron."},{"issue":"4","key":"10.1016\/j.mejo.2026.107135_bib15","doi-asserted-by":"crossref","first-page":"639","DOI":"10.1109\/TDMR.2021.3125344","article-title":"Aging monitoring method of bond wires-based on phase-frequency characteristics of differential mode conducted interference signal for IGBT module","volume":"21","author":"Chu","year":"2021","journal-title":"IEEE Trans. Device Mater. Reliab."},{"issue":"4","key":"10.1016\/j.mejo.2026.107135_bib16","doi-asserted-by":"crossref","first-page":"1274","DOI":"10.1109\/TEMC.2021.3052904","article-title":"Aging monitoring of bond wires based on differential mode conducted interference spectrum for IGBT module","volume":"63","author":"Chu","year":"2021","journal-title":"IEEE Trans. Electromagn C."},{"issue":"2","key":"10.1016\/j.mejo.2026.107135_bib17","doi-asserted-by":"crossref","first-page":"223","DOI":"10.1109\/TDMR.2025.3548979","article-title":"The influence of bond wire aging on DM EMI noise in IGBT converters considering high-frequency ringing","volume":"25","author":"Gao","year":"2025","journal-title":"IEEE Trans. Device Mater. Reliab."},{"key":"10.1016\/j.mejo.2026.107135_bib18","series-title":"2023 IEEE Electric Ship Technologies Symposium (ESTS)","first-page":"477","article-title":"Investigation of SiC MOSFET aging effects on common-mode EMI emissions","author":"Mannan","year":"2023"},{"key":"10.1016\/j.mejo.2026.107135_bib19","doi-asserted-by":"crossref","first-page":"71535","DOI":"10.1109\/ACCESS.2020.2983084","article-title":"A new EMI modeling method for mixed-mode noise analysis in three-phase inverter system","volume":"8","author":"Zhou","year":"2020","journal-title":"IEEE Access"},{"issue":"1","key":"10.1016\/j.mejo.2026.107135_bib20","doi-asserted-by":"crossref","first-page":"148","DOI":"10.1109\/TCPMT.2023.3342617","article-title":"Monitoring void fatigue in solder layer of IGBT module based on common mode interference spectrum","volume":"14","author":"Gao","year":"2024","journal-title":"IEEE Trans. Compon. Packag. Manuf. Technol."},{"key":"10.1016\/j.mejo.2026.107135_bib21","series-title":"2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (Wipda)","first-page":"51","article-title":"Thermally triggered SiC MOSFET aging effect on conducted EMI","author":"Pu","year":"2018"}],"container-title":["Microelectronics Journal"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S1879239126000913?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S1879239126000913?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2026,5,15]],"date-time":"2026-05-15T08:01:18Z","timestamp":1778832078000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S1879239126000913"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,7]]},"references-count":21,"alternative-id":["S1879239126000913"],"URL":"https:\/\/doi.org\/10.1016\/j.mejo.2026.107135","relation":{},"ISSN":["1879-2391"],"issn-type":[{"value":"1879-2391","type":"print"}],"subject":[],"published":{"date-parts":[[2026,7]]},"assertion":[{"value":"Elsevier","name":"publisher","label":"This article is maintained by"},{"value":"An aging monitoring method of IGBT module bond wires based on active filter gain","name":"articletitle","label":"Article Title"},{"value":"Microelectronics Journal","name":"journaltitle","label":"Journal Title"},{"value":"https:\/\/doi.org\/10.1016\/j.mejo.2026.107135","name":"articlelink","label":"CrossRef DOI link to publisher maintained version"},{"value":"article","name":"content_type","label":"Content Type"},{"value":"\u00a9 2026 Published by Elsevier Ltd.","name":"copyright","label":"Copyright"}],"article-number":"107135"}}