{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,15]],"date-time":"2026-05-15T08:13:50Z","timestamp":1778832830834,"version":"3.51.4"},"reference-count":39,"publisher":"Elsevier BV","license":[{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/legal\/tdmrep-license"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-017"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-012"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-004"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62164002"],"award-info":[{"award-number":["62164002"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["elsevier.com","sciencedirect.com"],"crossmark-restriction":true},"short-container-title":["Microelectronics Journal"],"published-print":{"date-parts":[[2026,7]]},"DOI":"10.1016\/j.mejo.2026.107192","type":"journal-article","created":{"date-parts":[[2026,3,27]],"date-time":"2026-03-27T08:26:27Z","timestamp":1774599987000},"page":"107192","update-policy":"https:\/\/doi.org\/10.1016\/elsevier_cm_policy","source":"Crossref","is-referenced-by-count":0,"special_numbering":"C","title":["Analysis of the impact of structural parameters on natural frequency, random vibration stress, and bending stress in stacked BGA solder joints based on orthogonal experimental design"],"prefix":"10.1016","volume":"173","author":[{"given":"Dian","family":"Chen","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chunyue","family":"Huang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jingcheng","family":"Mo","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chao","family":"Gao","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Gui","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"78","reference":[{"issue":"2","key":"10.1016\/j.mejo.2026.107192_bib1","doi-asserted-by":"crossref","first-page":"119","DOI":"10.1109\/TEPM.2006.872689","article-title":"Double bump flip-chip assembly","volume":"29","author":"Yan","year":"2006","journal-title":"IEEE Trans. Electron. Packag. Manuf."},{"issue":"3","key":"10.1016\/j.mejo.2026.107192_bib2","first-page":"6","article-title":"Discussion for effects of solder joint shape and height on thermal fatigue lifetime","volume":"46","author":"Yang","year":"2017","journal-title":"Equip. Electron. Prod. Manuf."},{"key":"10.1016\/j.mejo.2026.107192_bib3","series-title":"Stress-Strain Analysis of PBGA Stacked Solder Joints with Different Loads Based on Parametric Submodeling","author":"Wang","year":"2023"},{"key":"10.1016\/j.mejo.2026.107192_bib4","series-title":"Analysis of Vibration and Damage Test of Ceramic Matrix Composites Structure","author":"Li","year":"2019"},{"issue":"35","key":"10.1016\/j.mejo.2026.107192_bib5","first-page":"5648","article-title":"Mechanism of the low-frequency vibration generated by vehicle driving effects on the human lumbar spine: a dynamic simulation analysis","volume":"22","author":"Fan","year":"2018","journal-title":"Chin. J. Tissue Eng. Res."},{"key":"10.1016\/j.mejo.2026.107192_bib6","doi-asserted-by":"crossref","DOI":"10.1016\/j.engfracmech.2024.110770","article-title":"Fatigue life prediction model for welded stainless steel connections considering mean stress under random vibration","volume":"314","author":"Wu","year":"2025","journal-title":"Eng. Fract. Mech."},{"key":"10.1016\/j.mejo.2026.107192_bib7","article-title":"Experimental and simulation analysis on the effect of vibratory stress relief on impact toughness of Q345\/316 L dissimilar steel welded joints","volume":"38","author":"Gao","year":"2024","journal-title":"Mater. Today Commun."},{"issue":"1","key":"10.1016\/j.mejo.2026.107192_bib8","first-page":"110","article-title":"Finite element analysis of dynamic impact characteristics of three-point bending specimens","author":"Li","year":"1995","journal-title":"Chin. J. Comput. Mech."},{"key":"10.1016\/j.mejo.2026.107192_bib9","doi-asserted-by":"crossref","DOI":"10.1016\/j.euromechsol.2023.105060","article-title":"Experimental and numerical investigations of a soft projectile impact three-point bending (SPITPB) test for adhesion assessment under dynamic loading","volume":"101","author":"Caisso","year":"2023","journal-title":"Eur. J. Mech. Solid."},{"issue":"4","key":"10.1016\/j.mejo.2026.107192_bib10","first-page":"8","article-title":"Study on the influence of BGA solder joint modeling on finite element simulation","volume":"50","author":"Ge","year":"2023","journal-title":"Struct. Environ. Eng."},{"issue":"16","key":"10.1016\/j.mejo.2026.107192_bib11","first-page":"202","article-title":"A study on the reliability of double-bump solder joints based on Patran and frequency domain analysis under random vibration load","volume":"36","author":"Zhang","year":"2017","journal-title":"J. Vib. Shock"},{"key":"10.1016\/j.mejo.2026.107192_bib12","series-title":"2019 IEEE CPMT Symposium Japan (ICSJ)","first-page":"129","article-title":"Research on solder joint intermittent fault reproduction based on sweep frequency vibration test","author":"Huakang","year":"2019"},{"issue":"11","key":"10.1016\/j.mejo.2026.107192_bib13","first-page":"4","article-title":"Modal analysis of interconnect chips based on full IMC solder joints","volume":"60","author":"Cao","year":"2024","journal-title":"Mod. Manuf. Technol. Equip."},{"issue":"2","key":"10.1016\/j.mejo.2026.107192_bib14","first-page":"161","article-title":"Simulation study on reliability of solder joints in PoP package subjected to temperature cycling and random vibration load","volume":"44","author":"Pan","year":"2024","journal-title":"Res. Prog. SSE"},{"key":"10.1016\/j.mejo.2026.107192_bib15","series-title":"2010 11th International Conference on Electronic Packaging Technology & High Density Packaging","first-page":"616","article-title":"Vibration durability modeling and dynamic response analysis of pbga mixed solder joints","author":"Zhou","year":"2010"},{"issue":"8","key":"10.1016\/j.mejo.2026.107192_bib16","first-page":"800","article-title":"Influence of solder joint morphology on vibration stress of surface-mounted leads components","volume":"40","author":"He","year":"2021","journal-title":"Electron. Compon. Mater."},{"key":"10.1016\/j.mejo.2026.107192_bib17","series-title":"2018 19th International Conference on Electronic Packaging Technology (ICEPT)","first-page":"1019","article-title":"Random vibration analysis of BGA with different size of the SAC0307 solder joint[C]","author":"Shen","year":"2018"},{"key":"10.1016\/j.mejo.2026.107192_bib18","series-title":"2012 13th International Conference on Electronic Packaging Technology & High Density Packaging","first-page":"1150","article-title":"Reliability of Pb-free BGA solder joints under random vibration[C]","author":"Wang","year":"2012"},{"key":"10.1016\/j.mejo.2026.107192_bib19","series-title":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","first-page":"455","article-title":"Analysis of solder joint shape parameters on the stress and strain of the solder joint in the random vibration condition[C]","author":"Hua","year":"2016"},{"issue":"2","key":"10.1016\/j.mejo.2026.107192_bib20","first-page":"13","article-title":"Stress and strain distribution of lead-free solder joints with compliant layer in wafer level chip scale package under random vibration based on orthogonal design[J]","volume":"37","author":"Liang","year":"2016","journal-title":"Trans. China Weld. Inst."},{"key":"10.1016\/j.mejo.2026.107192_bib21","article-title":"Multi-objective optimization study of stacked BGA solder joints under coupled bending-vibration load and crosstalk effects","author":"Wu","year":"2024","journal-title":"IEEE Trans. Compon. Packag. Manuf. Technol."},{"key":"10.1016\/j.mejo.2026.107192_bib22","doi-asserted-by":"crossref","DOI":"10.1016\/j.mejo.2023.105844","article-title":"Refined simulation method and failure study of BGA package structure based on image drive","volume":"138","author":"Hou","year":"2023","journal-title":"Microelectron. J."},{"key":"10.1016\/j.mejo.2026.107192_bib23","series-title":"2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)","first-page":"522","article-title":"SAC305 solder fatigue crack propagation under 3-point bending cycle test condition[C]","author":"Zhang","year":"2022"},{"key":"10.1016\/j.mejo.2026.107192_bib24","series-title":"2019 20th International Conference on Electronic Packaging Technology (ICEPT)","first-page":"1","article-title":"Study on chip component no-fillet solder joint stress and strain under three point bending[C]","author":"Gao","year":"2019"},{"issue":"8","key":"10.1016\/j.mejo.2026.107192_bib25","first-page":"23","article-title":"Stress-strain analysis of micro-scale ball grid array solder joints on embedded substrate under three-point bending","volume":"39","author":"Yin","year":"2018","journal-title":"Trans. China Weld. Inst."},{"issue":"2","key":"10.1016\/j.mejo.2026.107192_bib26","doi-asserted-by":"crossref","first-page":"478","DOI":"10.1109\/TCAPT.2008.921650","article-title":"Reliability and failure analysis of lead-free solder joints for PBGA package under a cyclic bending load","volume":"31","author":"Kim","year":"2008","journal-title":"IEEE Trans. Compon. Packag. Technol."},{"key":"10.1016\/j.mejo.2026.107192_bib27","series-title":"2020 21st International Conference on Electronic Packaging Technology (ICEPT)","first-page":"1","article-title":"Finite element analysis and optimization of stress and strain of QFN solder joints under three-point bending[C]","author":"Liu","year":"2020"},{"key":"10.1016\/j.mejo.2026.107192_bib28","article-title":"Torsional stress analysis and optimization of SOP solder joints using SnBiInZn high-entropy alloy solder","author":"Wang","year":"2025","journal-title":"Microelectron. J."},{"key":"10.1016\/j.mejo.2026.107192_bib29","doi-asserted-by":"crossref","DOI":"10.1016\/j.mejo.2025.106838","article-title":"Analysis and prediction of bending-torsion coupled stress in BGA stacked solder joints considering interaction effects","author":"Mo","year":"2025","journal-title":"Microelectron. J."},{"key":"10.1016\/j.mejo.2026.107192_bib30","doi-asserted-by":"crossref","DOI":"10.1016\/j.mejo.2025.106661","article-title":"Stress analysis and optimization of QFN solder joints under bending-torsion coupled conditions based on the SSA","volume":"159","author":"Wei","year":"2025","journal-title":"Microelectron. J."},{"key":"10.1016\/j.mejo.2026.107192_bib31","doi-asserted-by":"crossref","DOI":"10.1016\/j.microrel.2024.115415","article-title":"Effect of creep, fatigue and random vibration on the integrity of solder joints in BGA package","volume":"157","author":"Depiver","year":"2024","journal-title":"Microelectron. Reliab."},{"key":"10.1016\/j.mejo.2026.107192_bib32","doi-asserted-by":"crossref","first-page":"222","DOI":"10.1016\/j.engfailanal.2018.02.025","article-title":"Analysis of the effects of vibration modes on fatigue damage in high-speed train bogie frames","volume":"89","author":"Lu","year":"2018","journal-title":"Eng. Fail. Anal."},{"key":"10.1016\/j.mejo.2026.107192_bib33","doi-asserted-by":"crossref","DOI":"10.1016\/j.probengmech.2024.103640","article-title":"An amplitude probability density function model under broadband multimodal stochastic vibration fatigue response","volume":"77","author":"Zhu","year":"2024","journal-title":"Probab. Eng. Mech."},{"key":"10.1016\/j.mejo.2026.107192_bib34","series-title":"2018 Prognostics and System Health Management Conference (PHM-Chongqing)","first-page":"675","article-title":"Study on failure simulation and fatigue life prediction of BGA solder joint under random vibration[C]","author":"Zhang","year":"2018"},{"issue":"3","key":"10.1016\/j.mejo.2026.107192_bib35","doi-asserted-by":"crossref","first-page":"665","DOI":"10.1007\/s00477-014-0970-8","article-title":"General correlation analysis: a new algorithm and application","volume":"29","author":"Zhou","year":"2015","journal-title":"Stoch. Environ. Res. Risk Assess."},{"issue":"1","key":"10.1016\/j.mejo.2026.107192_bib36","doi-asserted-by":"crossref","first-page":"43","DOI":"10.1007\/s10854-024-14127-6","article-title":"Research on vibration reliability of solder joint based on modal experiment of PCBA","volume":"36","author":"Liu","year":"2025","journal-title":"J. Mater. Sci. Mater. Electron."},{"issue":"11","key":"10.1016\/j.mejo.2026.107192_bib37","doi-asserted-by":"crossref","first-page":"1132","DOI":"10.1140\/epjp\/s13360-021-02102-7","article-title":"A simulation-based study on the effect of package parameters on the random vibration behavior of electronic packages","volume":"136","author":"Gharaibeh","year":"2021","journal-title":"Eur. Phys. J. Plus"},{"key":"10.1016\/j.mejo.2026.107192_bib38","doi-asserted-by":"crossref","DOI":"10.1016\/j.mejo.2024.106484","article-title":"Enhancing the reliability of CSP solder joints under thermal cycling conditions through particle swarm optimization of an improved BP neural network","volume":"154","author":"Zhu","year":"2024","journal-title":"Microelectron. J."},{"key":"10.1016\/j.mejo.2026.107192_bib39","doi-asserted-by":"crossref","DOI":"10.1016\/j.mejo.2025.106596","article-title":"Reliability analysis of PoP stacked solder joints under thermal cycling load based on the optimal equivalent model","volume":"158","author":"Gao","year":"2025","journal-title":"Microelectron. J."}],"container-title":["Microelectronics Journal"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S1879239126001487?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S1879239126001487?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2026,5,15]],"date-time":"2026-05-15T08:02:08Z","timestamp":1778832128000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S1879239126001487"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,7]]},"references-count":39,"alternative-id":["S1879239126001487"],"URL":"https:\/\/doi.org\/10.1016\/j.mejo.2026.107192","relation":{},"ISSN":["1879-2391"],"issn-type":[{"value":"1879-2391","type":"print"}],"subject":[],"published":{"date-parts":[[2026,7]]},"assertion":[{"value":"Elsevier","name":"publisher","label":"This article is maintained by"},{"value":"Analysis of the impact of structural parameters on natural frequency, random vibration stress, and bending stress in stacked BGA solder joints based on orthogonal experimental design","name":"articletitle","label":"Article Title"},{"value":"Microelectronics Journal","name":"journaltitle","label":"Journal Title"},{"value":"https:\/\/doi.org\/10.1016\/j.mejo.2026.107192","name":"articlelink","label":"CrossRef DOI link to publisher maintained version"},{"value":"article","name":"content_type","label":"Content Type"},{"value":"\u00a9 2026 Elsevier Ltd. All rights are reserved, including those for text and data mining, AI training, and similar technologies.","name":"copyright","label":"Copyright"}],"article-number":"107192"}}