{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,5]],"date-time":"2026-07-05T01:15:53Z","timestamp":1783214153103,"version":"3.54.6"},"reference-count":34,"publisher":"Elsevier BV","license":[{"start":{"date-parts":[[2026,10,1]],"date-time":"2026-10-01T00:00:00Z","timestamp":1790812800000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"},{"start":{"date-parts":[[2026,10,1]],"date-time":"2026-10-01T00:00:00Z","timestamp":1790812800000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/legal\/tdmrep-license"},{"start":{"date-parts":[[2026,10,1]],"date-time":"2026-10-01T00:00:00Z","timestamp":1790812800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-017"},{"start":{"date-parts":[[2026,10,1]],"date-time":"2026-10-01T00:00:00Z","timestamp":1790812800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"},{"start":{"date-parts":[[2026,10,1]],"date-time":"2026-10-01T00:00:00Z","timestamp":1790812800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-012"},{"start":{"date-parts":[[2026,10,1]],"date-time":"2026-10-01T00:00:00Z","timestamp":1790812800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,10,1]],"date-time":"2026-10-01T00:00:00Z","timestamp":1790812800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-004"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["elsevier.com","sciencedirect.com"],"crossmark-restriction":true},"short-container-title":["Microelectronics Journal"],"published-print":{"date-parts":[[2026,10]]},"DOI":"10.1016\/j.mejo.2026.107352","type":"journal-article","created":{"date-parts":[[2026,7,2]],"date-time":"2026-07-02T15:57:23Z","timestamp":1783007843000},"page":"107352","update-policy":"https:\/\/doi.org\/10.1016\/elsevier_cm_policy","source":"Crossref","is-referenced-by-count":0,"special_numbering":"C","title":["Wafer-YOLO: A lightweight object detection network for wafer inspection"],"prefix":"10.1016","volume":"176","author":[{"given":"Xiaotong","family":"Shu","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zhenzhi","family":"He","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jiayi","family":"Yuan","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Guo","family":"Ye","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Tianchi","family":"Chen","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Lianchao","family":"Sheng","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2932-0185","authenticated-orcid":false,"given":"Xiangning","family":"Lu","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"78","reference":[{"issue":"1","key":"10.1016\/j.mejo.2026.107352_bib1","doi-asserted-by":"crossref","first-page":"5953","DOI":"10.1038\/s41467-021-26230-x","article-title":"Wafer-scale functional circuits based on two dimensional semiconductors with fabrication optimized by machine learning","volume":"12","author":"Chen","year":"2021","journal-title":"Nat. Commun."},{"key":"10.1016\/j.mejo.2026.107352_bib2","doi-asserted-by":"crossref","first-page":"50100","DOI":"10.1109\/ACCESS.2022.3172953","article-title":"A fully automatic calibration for vision-based selective compliance assembly robot arm and its application to intelligent wafer inspection scheduling","volume":"10","author":"Su","year":"2022","journal-title":"IEEE Access"},{"issue":"2","key":"10.1016\/j.mejo.2026.107352_bib3","doi-asserted-by":"crossref","first-page":"661","DOI":"10.1007\/s40684-021-00343-6","article-title":"State of the art in defect detection based on machine vision","volume":"9","author":"Ren","year":"2022","journal-title":"International Journal of Precision Engineering and Manufacturing-Green Technology"},{"key":"10.1016\/j.mejo.2026.107352_bib4","doi-asserted-by":"crossref","DOI":"10.1016\/j.engfailanal.2022.106032","article-title":"Intelligent detection technology of flip chip based on H-SVM algorithm","volume":"134","author":"Sha","year":"2022","journal-title":"Eng. Fail. Anal."},{"key":"10.1016\/j.mejo.2026.107352_bib5","article-title":"Wafer crack detection based on yolov4 target detection method","volume":"1802","author":"Li","year":"2021","journal-title":"J. Phys. Conf."},{"issue":"3","key":"10.1016\/j.mejo.2026.107352_bib6","doi-asserted-by":"crossref","first-page":"1957","DOI":"10.1007\/s00170-022-09425-4","article-title":"Attention-based deep learning for chip-surface-defect detection","volume":"121","author":"Wang","year":"2022","journal-title":"Int. J. Adv. Manuf. Technol."},{"issue":"3","key":"10.1016\/j.mejo.2026.107352_bib7","first-page":"262","article-title":"CC-De-YOLO: a multiscale object detection method for wafer surface defect","volume":"49","author":"Ma","year":"2024","journal-title":"Found. Comput. Decis. Sci."},{"issue":"12","key":"10.1016\/j.mejo.2026.107352_bib8","doi-asserted-by":"crossref","DOI":"10.1088\/1402-4896\/ad8cad","article-title":"Optimized YOLOv8 based on SGW for surface defect detection of silicon wafer","volume":"99","author":"Zhu","year":"1994","journal-title":"Phys. Scri."},{"issue":"2","key":"10.1016\/j.mejo.2026.107352_bib9","doi-asserted-by":"crossref","first-page":"110","DOI":"10.1007\/s00530-025-02152-2","article-title":"YOLO-TCS: an enhanced multi-scale network for traffic sign detection integrating multi-level feature fusion and attention","volume":"32","author":"Yu","year":"2026","journal-title":"Multimed. Syst."},{"key":"10.1016\/j.mejo.2026.107352_bib10","doi-asserted-by":"crossref","DOI":"10.1016\/j.knosys.2026.115859","article-title":"Adaptive-PVT: unlocking the power of adaptive mechanisms for medical image segmentation","volume":"342","author":"Zhang","year":"2026","journal-title":"Knowl. Base Syst."},{"issue":"1","key":"10.1016\/j.mejo.2026.107352_bib11","doi-asserted-by":"crossref","first-page":"12","DOI":"10.1002\/(SICI)1097-4571(199401)45:1<12::AID-ASI2>3.0.CO;2-L","article-title":"The relationship between recall and precision","volume":"45","author":"Buckland","year":"2018","journal-title":"J. Am. Soc. Inf. Sci."},{"issue":"3","key":"10.1016\/j.mejo.2026.107352_bib12","doi-asserted-by":"crossref","first-page":"220","DOI":"10.1038\/s42256-023-00626-4","article-title":"Parameter-efficient fine-tuning of large-scale pre-trained language models","volume":"5","author":"Ding","year":"2023","journal-title":"Nat. Mach. Intell."},{"key":"10.1016\/j.mejo.2026.107352_bib13","series-title":"British Machine Vision Virtual Conference","article-title":"High-speed light-weight cnn inference via strided convolutions on a pixel processor array","author":"Liu","year":"2020"},{"key":"10.1016\/j.mejo.2026.107352_bib14","series-title":"Yolov10: Real-Time end-to-end Object Detection","author":"Wang","year":"2024"},{"key":"10.1016\/j.mejo.2026.107352_bib15","series-title":"Proceedings of the 2021 International Conference on Multimedia Retrieval","article-title":"NMS-loss: learning with non-maximum suppression for crowded pedestrian detection","author":"Luo","year":"2021"},{"key":"10.1016\/j.mejo.2026.107352_bib16","series-title":"Proceedings of the IEEE\/CVF Conference on Computer Vision and Pattern Recognition","first-page":"12021","article-title":"Run, don't walk: chasing higher FLOPS for faster neural networks","author":"Chen","year":"2023"},{"issue":"9","key":"10.1016\/j.mejo.2026.107352_bib17","first-page":"2642","article-title":"Vehicle detection and tracking algorithm based on improved feature extraction","volume":"18","author":"Ge","year":"2024","journal-title":"KSII Trans. Internet Inf. Syst."},{"key":"10.1016\/j.mejo.2026.107352_bib18","series-title":"Proceedings of the IEEE\/CVF Conference on Computer Vision and Pattern Recognition","first-page":"16519","article-title":"Bottleneck transformers for visual recognition","author":"Srinivas","year":"2021"},{"key":"10.1016\/j.mejo.2026.107352_bib19","series-title":"Resnet in Resnet: Generalizing Residual Architectures","author":"Targ","year":"2016"},{"issue":"11","key":"10.1016\/j.mejo.2026.107352_bib20","doi-asserted-by":"crossref","first-page":"8210","DOI":"10.1109\/TNNLS.2022.3144163","article-title":"MHSA-Net: multihead self-attention network for occluded person re-identification","volume":"34","author":"Tan","year":"2022","journal-title":"IEEE Transact. Neural Networks Learn. Syst."},{"key":"10.1016\/j.mejo.2026.107352_bib21","series-title":"Proceedings of the IEEE Conference on Computer Vision and Pattern Recognition","first-page":"1251","article-title":"Deep learning with depthwise separable convolutions","author":"Chollet","year":"2017"},{"key":"10.1016\/j.mejo.2026.107352_bib22","doi-asserted-by":"crossref","unstructured":"Zhang Q, Jiang Z, Lu Q, et al. Split to be Slim: an Overlooked Redundancy in Vanilla Convolution. arXiv preprint arXiv:2006 2020: 12085.","DOI":"10.24963\/ijcai.2020\/442"},{"issue":"3","key":"10.1016\/j.mejo.2026.107352_bib23","doi-asserted-by":"crossref","first-page":"706","DOI":"10.1109\/JSSC.2007.916618","article-title":"A 10 000 fps CMOS sensor with massively parallel image processing","volume":"43","author":"Dubois","year":"2008","journal-title":"IEEE J. Solid State Circ."},{"issue":"2","key":"10.1016\/j.mejo.2026.107352_bib24","doi-asserted-by":"crossref","first-page":"17","DOI":"10.1145\/3003665.3003669","article-title":"Database meets deep learning: challenges and opportunities","volume":"42","author":"Wang","year":"2016","journal-title":"ACM Sigmod Record"},{"issue":"10","key":"10.1016\/j.mejo.2026.107352_bib25","doi-asserted-by":"crossref","first-page":"2314","DOI":"10.1109\/JSSC.2006.881557","article-title":"A 6.2-GFlops floating-point multiply-accumulator with conditional normalization","volume":"41","author":"Vangal","year":"2006","journal-title":"IEEE J. Solid State Circ."},{"key":"10.1016\/j.mejo.2026.107352_bib26","series-title":"Proceedings of the IEEE\/CVF Conference on Computer Vision and Pattern Recognition","article-title":"YOLOv7: trainable bag-of-freebies sets new state-of-the-art for real-time object detectors","author":"Wang","year":"2023"},{"key":"10.1016\/j.mejo.2026.107352_bib27","article-title":"A modified YOLOv8 detection network for UAV aerial image recognition","volume":"304","author":"Li","year":"2023","journal-title":"Drones"},{"key":"10.1016\/j.mejo.2026.107352_bib28","doi-asserted-by":"crossref","unstructured":"Wang Y, Yeh H, Mark Y. Yolov9: Learning what you Want to Learn Using Programmable Gradient Information. arxiv preprint arxiv:2402 2024: 13616.","DOI":"10.1007\/978-3-031-72751-1_1"},{"key":"10.1016\/j.mejo.2026.107352_bib29","doi-asserted-by":"crossref","first-page":"107984","DOI":"10.52202\/079017-3429","article-title":"Yolov10: real-time end-to-end object detection","volume":"37","author":"Wang","year":"2024","journal-title":"Adv. Neural Inf. Process. Syst."},{"key":"10.1016\/j.mejo.2026.107352_bib30","series-title":"Yolov11: an Overview of the Key Architectural Enhancements","author":"Khanam","year":"2024"},{"key":"10.1016\/j.mejo.2026.107352_bib31","series-title":"Yolov12: Attention-Centric real-time Object Detectors","author":"Tian","year":"2025"},{"issue":"3","key":"10.1016\/j.mejo.2026.107352_bib32","first-page":"280","article-title":"Thin mobilenet: an enhanced mobilenet architecture. 2019 IEEE 10th annual ubiquitous computing, electronics & mobile communication conference (UEMCON)","volume":"5","author":"Sinha","year":"2019","journal-title":"IEEE"},{"key":"10.1016\/j.mejo.2026.107352_bib33","series-title":"Proceedings of the IEEE\/CVF Conference on Computer Vision and Pattern Recognition","first-page":"1580","article-title":"Ghostnet: more features from cheap operations","author":"Sinha","year":"2020"},{"key":"10.1016\/j.mejo.2026.107352_bib34","series-title":"Proceedings of the IEEE\/CVF Conference on Computer Vision and Pattern Recognition","first-page":"15909","article-title":"Repvit: revisiting mobile cnn from vit perspective","author":"Wang","year":"2024"}],"container-title":["Microelectronics Journal"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S1879239126003085?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S1879239126003085?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2026,7,5]],"date-time":"2026-07-05T00:30:11Z","timestamp":1783211411000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S1879239126003085"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,10]]},"references-count":34,"alternative-id":["S1879239126003085"],"URL":"https:\/\/doi.org\/10.1016\/j.mejo.2026.107352","relation":{},"ISSN":["1879-2391"],"issn-type":[{"value":"1879-2391","type":"print"}],"subject":[],"published":{"date-parts":[[2026,10]]},"assertion":[{"value":"Elsevier","name":"publisher","label":"This article is maintained by"},{"value":"Wafer-YOLO: A lightweight object detection network for wafer inspection","name":"articletitle","label":"Article Title"},{"value":"Microelectronics Journal","name":"journaltitle","label":"Journal Title"},{"value":"https:\/\/doi.org\/10.1016\/j.mejo.2026.107352","name":"articlelink","label":"CrossRef DOI link to publisher maintained version"},{"value":"article","name":"content_type","label":"Content Type"},{"value":"\u00a9 2026 Elsevier Ltd. All rights are reserved, including those for text and data mining, AI training, and similar technologies.","name":"copyright","label":"Copyright"}],"article-number":"107352"}}