{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,19]],"date-time":"2025-10-19T14:52:53Z","timestamp":1760885573698,"version":"3.40.3"},"reference-count":22,"publisher":"Elsevier BV","issue":"1","license":[{"start":{"date-parts":[[2013,1,1]],"date-time":"2013-01-01T00:00:00Z","timestamp":1356998400000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2013,1]]},"DOI":"10.1016\/j.microrel.2012.07.028","type":"journal-article","created":{"date-parts":[[2012,8,15]],"date-time":"2012-08-15T16:06:10Z","timestamp":1345046770000},"page":"174-181","source":"Crossref","is-referenced-by-count":40,"title":["High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force"],"prefix":"10.1016","volume":"53","author":[{"given":"Xin","family":"Li","sequence":"first","affiliation":[]},{"given":"Gang","family":"Chen","sequence":"additional","affiliation":[]},{"given":"Xu","family":"Chen","sequence":"additional","affiliation":[]},{"given":"Guo-Quan","family":"Lu","sequence":"additional","affiliation":[]},{"given":"Lei","family":"Wang","sequence":"additional","affiliation":[]},{"given":"Yun-Hui","family":"Mei","sequence":"additional","affiliation":[]}],"member":"78","reference":[{"key":"10.1016\/j.microrel.2012.07.028_b0005","doi-asserted-by":"crossref","first-page":"824","DOI":"10.1007\/s11663-010-9365-5","article-title":"A review on die attach materials for sic-based high-temperature power devices","volume":"41","author":"Chin","year":"2010","journal-title":"Metall Mater Trans B"},{"key":"10.1016\/j.microrel.2012.07.028_b0010","doi-asserted-by":"crossref","first-page":"1333","DOI":"10.1007\/s11664-007-0230-5","article-title":"Low-temperature sintering with nano-silver paste in die-attached interconnection","volume":"36","author":"Wang","year":"2007","journal-title":"J Electron Mater"},{"key":"10.1016\/j.microrel.2012.07.028_b0015","doi-asserted-by":"crossref","first-page":"457","DOI":"10.1109\/TCPMT.2010.2100432","article-title":"Die attach materials for high temperature applications: a review","volume":"1","author":"Manikam","year":"2011","journal-title":"IEEE Trans Compon Pack Technol"},{"key":"10.1016\/j.microrel.2012.07.028_b0130","doi-asserted-by":"crossref","unstructured":"Klein JW. Silicon and gallium arsenide in high temperature electronics applications, URSI international symposium on signals, systems and electronics; 1995. p. 157\u2013162.","DOI":"10.1109\/ISSSE.1995.497957"},{"key":"10.1016\/j.microrel.2012.07.028_b0025","doi-asserted-by":"crossref","first-page":"27","DOI":"10.1108\/09540910410537309","article-title":"Strategies for improving reliability of solder joints on power semiconductor devices","volume":"16","author":"Lu","year":"2004","journal-title":"Solder Surf Mount Technol"},{"key":"10.1016\/j.microrel.2012.07.028_b0030","doi-asserted-by":"crossref","first-page":"279","DOI":"10.1109\/TEPM.2002.807719","article-title":"Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow","volume":"25","author":"Zhang","year":"2002","journal-title":"IEEE Trans Electron Pack"},{"key":"10.1016\/j.microrel.2012.07.028_b0035","doi-asserted-by":"crossref","first-page":"436","DOI":"10.1109\/TDMR.2006.882196","article-title":"Thermomechanical reliability of low-temperature sintered silver die-attached SiC power device assembly","volume":"6","author":"Bai","year":"2006","journal-title":"IEEE Trans Dev Mater Reliab"},{"key":"10.1016\/j.microrel.2012.07.028_b0040","doi-asserted-by":"crossref","first-page":"589","DOI":"10.1109\/TCAPT.2005.853167","article-title":"Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material","volume":"29","author":"Bai","year":"2006","journal-title":"IEEE Trans Compon Pack Technol"},{"key":"10.1016\/j.microrel.2012.07.028_b0045","doi-asserted-by":"crossref","first-page":"667","DOI":"10.1023\/A:1008914424013","article-title":"A study on sintering and microstructure development of fritless silver thick film conductors","volume":"11","author":"Rane","year":"2000","journal-title":"J Mater Sci Mater Electron"},{"key":"10.1016\/j.microrel.2012.07.028_b0050","doi-asserted-by":"crossref","first-page":"2805","DOI":"10.1111\/j.1151-2916.1998.tb02700.x","article-title":"Effects of silver-paste formulation on camber development during the cofiring of a silver-based, low-temperature-cofired ceramic package","volume":"81","author":"Chang","year":"1998","journal-title":"J Am Ceram Soc"},{"key":"10.1016\/j.microrel.2012.07.028_b0055","doi-asserted-by":"crossref","first-page":"4","DOI":"10.1109\/6040.746536","article-title":"Silver metallization for advanced interconnects","volume":"22","author":"Manepalli","year":"1999","journal-title":"IEEE Trans Adv Pack"},{"key":"10.1016\/j.microrel.2012.07.028_b0060","unstructured":"Lu GQ, Calata JN, Zhang ZY, Bai JG. A lead-free, low-temperature sintering die-attachment technique for high performance and high-temperature packaging. In: Proceeding of the 6th IEEE CPMT conference on high density microsystem design and packaging and component failure analysis; 2004. p. 42\u20136."},{"key":"10.1016\/j.microrel.2012.07.028_b0115","doi-asserted-by":"crossref","first-page":"86","DOI":"10.1016\/j.msea.2005.06.013","article-title":"Experimental study on ratcheting behavior of eutectic tin\u2013lead solder under multiaxial loading","volume":"406","author":"Chen","year":"2005","journal-title":"Mater Sci Eng A"},{"key":"10.1016\/j.microrel.2012.07.028_b0120","doi-asserted-by":"crossref","first-page":"6417","DOI":"10.1016\/j.msea.2010.07.012","article-title":"Uniaxial ratcheting and fatigue behaviors of low-temperature sintered nano-scale silver paste at room and high temperatures","volume":"527","author":"Wang","year":"2010","journal-title":"Mater Sci Eng A"},{"key":"10.1016\/j.microrel.2012.07.028_b0075","doi-asserted-by":"crossref","first-page":"1574","DOI":"10.1007\/s11664-008-0516-2","article-title":"Tensile behaviors and ratcheting effects of partially sintered chip-attachment films of a nanoscale silver paste","volume":"37","author":"Chen","year":"2008","journal-title":"J Electron Mater"},{"key":"10.1016\/j.microrel.2012.07.028_b0125","doi-asserted-by":"crossref","unstructured":"Knoerr M, Kraft S, Schletz A. Reliability assessment of sintered nano-silver die attachment for power semiconductors. In: 12th Electronics packaging technology conference; 2010. p. 56\u201361.","DOI":"10.1109\/EPTC.2010.5702605"},{"key":"10.1016\/j.microrel.2012.07.028_b0085","unstructured":"CARE Measure & Control Co., Ltd., <http:\/\/www.care-mc.com\/index.html>."},{"key":"10.1016\/j.microrel.2012.07.028_b0090","doi-asserted-by":"crossref","first-page":"481","DOI":"10.1016\/S0026-2714(02)00318-9","article-title":"Behaviour of anisotropic conductive joints under mechanical loading","volume":"43","author":"Tan","year":"2003","journal-title":"Microelectro Reliab"},{"key":"10.1016\/j.microrel.2012.07.028_b0095","doi-asserted-by":"crossref","first-page":"1448","DOI":"10.1016\/j.ijfatigue.2007.10.002","article-title":"Ratchetting: recent progresses in phenomenon observation, constitutive modeling and application","volume":"30","author":"Kang","year":"2008","journal-title":"Int J Fatigue"},{"key":"10.1016\/j.microrel.2012.07.028_b0100","first-page":"1","article-title":"Recent progress in constitutive modeling for ratchetting","volume":"3","author":"Ohno","year":"1997","journal-title":"Mater Sci Res Int"},{"key":"10.1016\/j.microrel.2012.07.028_b0105","doi-asserted-by":"crossref","first-page":"120","DOI":"10.1108\/09540911211214695","article-title":"Mechanical property evaluation of nano-silver paste sintered joint using lap-shear test","volume":"24","author":"Li","year":"2012","journal-title":"Solder Surf Mount Technol"},{"key":"10.1016\/j.microrel.2012.07.028_b0110","doi-asserted-by":"crossref","first-page":"2451","DOI":"10.1016\/S0022-5096(99)00014-9","article-title":"Damage evolution governed by microcrack nucleation with application to the fatigue of 63Sn\u201337Pb solder","volume":"47","author":"Stolkarts","year":"1999","journal-title":"J Mech Phys Solids"}],"container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271412003794?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271412003794?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2025,4,6]],"date-time":"2025-04-06T22:26:08Z","timestamp":1743978368000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0026271412003794"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,1]]},"references-count":22,"journal-issue":{"issue":"1","published-print":{"date-parts":[[2013,1]]}},"alternative-id":["S0026271412003794"],"URL":"https:\/\/doi.org\/10.1016\/j.microrel.2012.07.028","relation":{},"ISSN":["0026-2714"],"issn-type":[{"type":"print","value":"0026-2714"}],"subject":[],"published":{"date-parts":[[2013,1]]}}}