{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,9]],"date-time":"2026-01-09T15:20:09Z","timestamp":1767972009119,"version":"3.49.0"},"reference-count":27,"publisher":"Elsevier BV","license":[{"start":{"date-parts":[[2017,4,1]],"date-time":"2017-04-01T00:00:00Z","timestamp":1491004800000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"funder":[{"name":"Science and Technology Research Project of Guangdong Province","award":["2015B090912002"],"award-info":[{"award-number":["2015B090912002"]}]},{"name":"Opening Project of Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory","award":["ZHD201305"],"award-info":[{"award-number":["ZHD201305"]}]}],"content-domain":{"domain":["elsevier.com","sciencedirect.com"],"crossmark-restriction":true},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2017,4]]},"DOI":"10.1016\/j.microrel.2017.03.005","type":"journal-article","created":{"date-parts":[[2017,3,19]],"date-time":"2017-03-19T00:16:57Z","timestamp":1489882617000},"page":"111-118","update-policy":"https:\/\/doi.org\/10.1016\/elsevier_cm_policy","source":"Crossref","is-referenced-by-count":46,"special_numbering":"C","title":["Fatigue life prediction of Package-on-Package stacking assembly under random vibration loading"],"prefix":"10.1016","volume":"71","author":[{"given":"Jiang","family":"Xia","sequence":"first","affiliation":[]},{"given":"GuoYuan","family":"Li","sequence":"additional","affiliation":[]},{"given":"Bin","family":"Li","sequence":"additional","affiliation":[]},{"given":"LanXian","family":"Cheng","sequence":"additional","affiliation":[]},{"given":"Bin","family":"Zhou","sequence":"additional","affiliation":[]}],"member":"78","reference":[{"key":"10.1016\/j.microrel.2017.03.005_bb0005","series-title":"Optimization of Thermomechanical Reliability of Board-level Package-on-Package Stacking Assembly","first-page":"864","volume":"29","author":"Lai","year":"2006"},{"key":"10.1016\/j.microrel.2017.03.005_bb0010","doi-asserted-by":"crossref","first-page":"14","DOI":"10.1109\/TEPM.2008.2005300","article-title":"Coupled power and thermal cycling reliability of board-level package-on-package stacking assembly","volume":"32","author":"Wang","year":"2009","journal-title":"IEEE Trans. Electron. Packag. Manuf."},{"key":"10.1016\/j.microrel.2017.03.005_bb0015","doi-asserted-by":"crossref","first-page":"226","DOI":"10.1016\/j.microrel.2013.08.020","article-title":"Random vibration reliability of BGA lead-free solder joint","volume":"54","author":"Liu","year":"2014","journal-title":"Microelectron. Reliab."},{"key":"10.1016\/j.microrel.2017.03.005_bb0020","doi-asserted-by":"crossref","first-page":"1143","DOI":"10.1016\/j.microrel.2004.01.008","article-title":"Vibration fatigue experiments of SMT solder joint","volume":"44","author":"Wang","year":"2004","journal-title":"Microelectron. Reliab."},{"key":"10.1016\/j.microrel.2017.03.005_bb0025","doi-asserted-by":"crossref","DOI":"10.1115\/1.1372318","article-title":"A methodology for fatigue prediction of electronic components under random vibration load","author":"Li","year":"2001","journal-title":"J. Electron. Packag."},{"key":"10.1016\/j.microrel.2017.03.005_bb0030","doi-asserted-by":"crossref","first-page":"351","DOI":"10.1016\/j.mechrescom.2004.03.011","article-title":"SMT solder joint's semi-experimental fatigue model","volume":"32","author":"Guo","year":"2005","journal-title":"Mech. Res. Commun."},{"key":"10.1016\/j.microrel.2017.03.005_bb0035","doi-asserted-by":"crossref","first-page":"638","DOI":"10.1016\/j.microrel.2007.11.006","article-title":"Combining vibration test with finite element analysis for the fatigue life estimation of PBGA components","volume":"48","author":"Chen","year":"2008","journal-title":"Microelectron. Reliab."},{"key":"10.1016\/j.microrel.2017.03.005_bb0040","doi-asserted-by":"crossref","DOI":"10.1115\/1.2837520","article-title":"Analysis and prediction of vibration-induced solder joint failure for a ceramic column grid array package","volume":"130","author":"Perkins","year":"2008","journal-title":"J. Electron. Packag."},{"key":"10.1016\/j.microrel.2017.03.005_bb0045","doi-asserted-by":"crossref","first-page":"649","DOI":"10.1016\/j.microrel.2010.10.003","article-title":"High-cycle fatigue life prediction for Pb-free BGA under random vibration loading","volume":"51","author":"Yu","year":"2011","journal-title":"Microelectron. Reliab."},{"key":"10.1016\/j.microrel.2017.03.005_bb0050","doi-asserted-by":"crossref","first-page":"A159","DOI":"10.1115\/1.4009458","article-title":"Cumulative damage in fatigue","volume":"12","author":"Miner","year":"1945","journal-title":"J. Appl. Mech. Tech. Phys."},{"key":"10.1016\/j.microrel.2017.03.005_bb0055","doi-asserted-by":"crossref","first-page":"107","DOI":"10.1007\/s12206-013-0946-5","article-title":"Fatigue life estimation of FBGA memory device under vibration","volume":"28","author":"Cinar","year":"2014","journal-title":"J. Mech. Sci. Technol."},{"key":"10.1016\/j.microrel.2017.03.005_bb0060","series-title":"Vibration Analysis for Electronic Equipment","author":"Steinberg","year":"2000"},{"key":"10.1016\/j.microrel.2017.03.005_bb0065","series-title":"Package-on-Package (PoP) Warpage Characteristic and Requirement","first-page":"5","author":"Wei","year":"2015"},{"key":"10.1016\/j.microrel.2017.03.005_bb0070","doi-asserted-by":"crossref","first-page":"1358","DOI":"10.1109\/TCPMT.2015.2446442","article-title":"Model for inverse determination of process and material parameters for control of package-on-package warpage","volume":"5","author":"Lall","year":"2015","journal-title":"IEEE Trans. Compon. Packag. Manuf. Technol."},{"key":"10.1016\/j.microrel.2017.03.005_bb0075","doi-asserted-by":"crossref","first-page":"1850","DOI":"10.1016\/j.microrel.2011.07.087","article-title":"Experiment and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending","volume":"51","author":"Shi","year":"2011","journal-title":"Microelectron. Reliab."},{"key":"10.1016\/j.microrel.2017.03.005_bb0080","doi-asserted-by":"crossref","first-page":"1870","DOI":"10.1016\/j.microrel.2012.06.089","article-title":"Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods","volume":"52","author":"Shi","year":"2012","journal-title":"Microelectron. Reliab."},{"key":"10.1016\/j.microrel.2017.03.005_bb0085","doi-asserted-by":"crossref","first-page":"754","DOI":"10.1016\/j.microrel.2009.03.022","article-title":"Vibration reliability test and finite element analysis for flip chip solder joints","volume":"49","author":"Che","year":"2009","journal-title":"Microelectron. Reliab."},{"key":"10.1016\/j.microrel.2017.03.005_bb0090","doi-asserted-by":"crossref","first-page":"2374","DOI":"10.1007\/s10854-015-2693-0","article-title":"Failure study of solder joints subjected to random vibration loading at different temperatures","volume":"26","author":"Zhang","year":"2015","journal-title":"J. Mater. Sci. Mater. Electron."},{"key":"10.1016\/j.microrel.2017.03.005_bb0095","doi-asserted-by":"crossref","first-page":"735","DOI":"10.1016\/j.microrel.2011.11.015","article-title":"Failure mechanism of FBGA solder joints in memory module subjected to harmonic excitation","volume":"52","author":"Cinar","year":"2012","journal-title":"Microelectron. Reliab."},{"key":"10.1016\/j.microrel.2017.03.005_bb0100","doi-asserted-by":"crossref","first-page":"319","DOI":"10.1109\/TCAPT.2009.2036834","article-title":"Harmonic and random vibration durability of SAC305 and Sn37Pb solder alloys","volume":"33","author":"Zhou","year":"2010","journal-title":"IEEE Trans. Components Packag. Technol."},{"key":"10.1016\/j.microrel.2017.03.005_bb0105","doi-asserted-by":"crossref","first-page":"1300","DOI":"10.1109\/ECTC.2013.6575740","article-title":"Combined vibration and thermal cycling fatigue analysis for SAC305 lead free solder assemblies","author":"Pang","year":"2013","journal-title":"2013 IEEE 63RD Electron. Components Technol. Conf. (ECTC)"},{"key":"10.1016\/j.microrel.2017.03.005_bb0110","series-title":"Harmonic Vibration Testing of Electronic Components Attached to Printed Wiring Boards With SAC305 and Eutectic SnPb Solder","author":"Paquette","year":"2010"},{"key":"10.1016\/j.microrel.2017.03.005_bb0115","series-title":"Electronic Components and Technology Conference","first-page":"1403","article-title":"PoP (Package-on-Package) stacking yield loss study","author":"Ishibashi","year":"2007"},{"key":"10.1016\/j.microrel.2017.03.005_bb0120","series-title":"Introduction to Random Vibrations and Spectral Analysis","first-page":"285","author":"Newland","year":"1975"},{"key":"10.1016\/j.microrel.2017.03.005_bb0125","first-page":"1593","article-title":"Fatigue under wide band random stresses","author":"Light","year":"1980","journal-title":"J. Struct. Div."},{"key":"10.1016\/j.microrel.2017.03.005_bb0130","doi-asserted-by":"crossref","first-page":"867","DOI":"10.1016\/j.ijfatigue.2004.10.007","article-title":"Spectral methods for lifetime prediction under wide-band stationary random processes","volume":"27","author":"Benasciutti","year":"2005","journal-title":"Int. J. Fatigue"},{"key":"10.1016\/j.microrel.2017.03.005_bb0135","doi-asserted-by":"crossref","DOI":"10.1016\/S0142-1123(02)00032-4","article-title":"Cycle distribution and fatigue damage under broad-band random loading","author":"Tovo","year":"2002","journal-title":"Int. J. Fatigue"}],"container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271417300495?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271417300495?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2022,7,26]],"date-time":"2022-07-26T17:14:44Z","timestamp":1658855684000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0026271417300495"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,4]]},"references-count":27,"alternative-id":["S0026271417300495"],"URL":"https:\/\/doi.org\/10.1016\/j.microrel.2017.03.005","relation":{},"ISSN":["0026-2714"],"issn-type":[{"value":"0026-2714","type":"print"}],"subject":[],"published":{"date-parts":[[2017,4]]},"assertion":[{"value":"Elsevier","name":"publisher","label":"This article is maintained by"},{"value":"Fatigue life prediction of Package-on-Package stacking assembly under random vibration loading","name":"articletitle","label":"Article Title"},{"value":"Microelectronics Reliability","name":"journaltitle","label":"Journal Title"},{"value":"https:\/\/doi.org\/10.1016\/j.microrel.2017.03.005","name":"articlelink","label":"CrossRef DOI link to publisher maintained version"},{"value":"article","name":"content_type","label":"Content Type"},{"value":"\u00a9 2017 Elsevier Ltd. All rights reserved.","name":"copyright","label":"Copyright"}]}}