{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,9]],"date-time":"2026-04-09T01:00:22Z","timestamp":1775696422422,"version":"3.50.1"},"reference-count":4,"publisher":"Elsevier BV","issue":"2","license":[{"start":{"date-parts":[[2003,2,1]],"date-time":"2003-02-01T00:00:00Z","timestamp":1044057600000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"},{"start":{"date-parts":[[2003,2,1]],"date-time":"2003-02-01T00:00:00Z","timestamp":1044057600000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/legal\/tdmrep-license"},{"start":{"date-parts":[[2003,2,1]],"date-time":"2003-02-01T00:00:00Z","timestamp":1044057600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-017"},{"start":{"date-parts":[[2003,2,1]],"date-time":"2003-02-01T00:00:00Z","timestamp":1044057600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"},{"start":{"date-parts":[[2003,2,1]],"date-time":"2003-02-01T00:00:00Z","timestamp":1044057600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-012"},{"start":{"date-parts":[[2003,2,1]],"date-time":"2003-02-01T00:00:00Z","timestamp":1044057600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2003,2,1]],"date-time":"2003-02-01T00:00:00Z","timestamp":1044057600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-004"}],"content-domain":{"domain":["elsevier.com","sciencedirect.com"],"crossmark-restriction":true},"short-container-title":["Microelectronics Journal"],"published-print":{"date-parts":[[2003,2]]},"DOI":"10.1016\/s0026-2692(02)00154-4","type":"journal-article","created":{"date-parts":[[2003,1,30]],"date-time":"2003-01-30T17:32:20Z","timestamp":1043947940000},"page":"109-113","update-policy":"https:\/\/doi.org\/10.1016\/elsevier_cm_policy","source":"Crossref","is-referenced-by-count":11,"title":["Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration"],"prefix":"10.1016","volume":"34","author":[{"given":"Y.S.","family":"Zheng","sequence":"first","affiliation":[]},{"given":"Q.","family":"Guo","sequence":"additional","affiliation":[]},{"given":"Y.J","family":"Su","sequence":"additional","affiliation":[]},{"given":"P.D.","family":"Foo","sequence":"additional","affiliation":[]}],"member":"78","reference":[{"issue":"3","key":"10.1016\/S0026-2692(02)00154-4_BIB1","doi-asserted-by":"crossref","first-page":"300","DOI":"10.1109\/66.857939","article-title":"The cleaning at a back surface and edge of a wafer for introducing Cu metallization process","volume":"13","author":"Itoh","year":"2000","journal-title":"IEEE Transactions on Semiconductor Manufacturing"},{"key":"10.1016\/S0026-2692(02)00154-4_BIB2","first-page":"95","article-title":"Removing postash polymer residue from BEOL structures using inorganic chemical","author":"Archer","year":"2001","journal-title":"Micro"},{"key":"10.1016\/S0026-2692(02)00154-4_BIB3","first-page":"107","article-title":"Meeting ITRS roadmap challenges with low-k dielectric etching","author":"Thomas","year":"2001","journal-title":"Solid State Technology"},{"key":"10.1016\/S0026-2692(02)00154-4_BIB4","first-page":"77","article-title":"Top surface imaging improves copper process resolution","author":"Gadson","year":"2001","journal-title":"Solid State Technology"}],"container-title":["Microelectronics Journal"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026269202001544?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026269202001544?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2024,7,5]],"date-time":"2024-07-05T18:20:35Z","timestamp":1720203635000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0026269202001544"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2003,2]]},"references-count":4,"journal-issue":{"issue":"2","published-print":{"date-parts":[[2003,2]]}},"alternative-id":["S0026269202001544"],"URL":"https:\/\/doi.org\/10.1016\/s0026-2692(02)00154-4","relation":{},"ISSN":["1879-2391"],"issn-type":[{"value":"1879-2391","type":"print"}],"subject":[],"published":{"date-parts":[[2003,2]]},"assertion":[{"value":"Elsevier","name":"publisher","label":"This article is maintained by"},{"value":"Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration","name":"articletitle","label":"Article Title"},{"value":"Microelectronics Journal","name":"journaltitle","label":"Journal Title"},{"value":"https:\/\/doi.org\/10.1016\/S0026-2692(02)00154-4","name":"articlelink","label":"CrossRef DOI link to publisher maintained version"},{"value":"converted-article","name":"content_type","label":"Content Type"},{"value":"Copyright \u00a9 2002 Elsevier Science Ltd. All rights are reserved, including those for text and data mining, AI training, and similar technologies.","name":"copyright","label":"Copyright"}]}}