{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,2]],"date-time":"2025-12-02T14:57:32Z","timestamp":1764687452561},"reference-count":11,"publisher":"Elsevier BV","issue":"8","license":[{"start":{"date-parts":[[2001,8,1]],"date-time":"2001-08-01T00:00:00Z","timestamp":996624000000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2001,8]]},"DOI":"10.1016\/s0026-2714(01)00109-3","type":"journal-article","created":{"date-parts":[[2002,10,31]],"date-time":"2002-10-31T14:50:07Z","timestamp":1036075807000},"page":"1231-1236","source":"Crossref","is-referenced-by-count":2,"title":["Scanning probe microscopy in semiconductor failure analysis"],"prefix":"10.1016","volume":"41","author":[{"given":"B","family":"Ebersberger","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"A","family":"Olbrich","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"C","family":"Boit","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"78","reference":[{"key":"10.1016\/S0026-2714(01)00109-3_BIB1","doi-asserted-by":"crossref","first-page":"R23","DOI":"10.1063\/1.350466","volume":"71","author":"K\u00f6lzer","year":"1992","journal-title":"J Appl Phys"},{"issue":"5","key":"10.1016\/S0026-2714(01)00109-3_BIB2","doi-asserted-by":"crossref","first-page":"1659","DOI":"10.1149\/1.1838533","volume":"145","author":"Elbel","year":"1998","journal-title":"J Electrochem Soc"},{"key":"10.1016\/S0026-2714(01)00109-3_BIB3","doi-asserted-by":"crossref","unstructured":"Ebersberger B, Boit C, Benzinger H, Gunther E. IEEE International Reliability Physics Proceedings, 34th Annual, Dallas, Texas, 1996. p. 126","DOI":"10.1109\/RELPHY.1996.492072"},{"key":"10.1016\/S0026-2714(01)00109-3_BIB4","doi-asserted-by":"crossref","first-page":"3114","DOI":"10.1063\/1.122690","volume":"73","author":"Olbrich","year":"1998","journal-title":"Appl Phys Lett"},{"key":"10.1016\/S0026-2714(01)00109-3_BIB5","unstructured":"Olbrich A, Ebersberger B, Boit C, Vancea J, Hoffmann H. European Symposium on Reliability of Electronic Devices, Failure Physics and Analysis (ESREF 1999)"},{"key":"10.1016\/S0026-2714(01)00109-3_BIB6","unstructured":"Olbrich A, Ebersberger B, Boit C, Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis (ISTFA\/2000), Seattle, Washington, 2000"},{"key":"10.1016\/S0026-2714(01)00109-3_BIB7","doi-asserted-by":"crossref","first-page":"234","DOI":"10.1116\/1.587146","volume":"12","author":"Criegern","year":"1994","journal-title":"J Vac Sci Technol B"},{"key":"10.1016\/S0026-2714(01)00109-3_BIB8","doi-asserted-by":"crossref","first-page":"471","DOI":"10.1146\/annurev.matsci.29.1.471","volume":"29","author":"Williams","year":"1999","journal-title":"Ann Rev Mater Sci"},{"key":"10.1016\/S0026-2714(01)00109-3_BIB9","doi-asserted-by":"crossref","first-page":"1699","DOI":"10.1116\/1.579754","volume":"13","author":"DeWolf","year":"1995","journal-title":"J Vac Sci Technol A"},{"key":"10.1016\/S0026-2714(01)00109-3_BIB10","doi-asserted-by":"crossref","unstructured":"Fiege G, Feige V, Phang J, Maywald M, Gorlich S, Balk L. ESREF 1998. p. 957","DOI":"10.1016\/S0026-2714(98)00086-9"},{"key":"10.1016\/S0026-2714(01)00109-3_BIB11","doi-asserted-by":"crossref","first-page":"975","DOI":"10.1016\/S0026-2714(99)00133-X","volume":"39","author":"Bae","year":"1999","journal-title":"Microelectron Reliab"}],"container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271401001093?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271401001093?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2019,4,27]],"date-time":"2019-04-27T05:50:13Z","timestamp":1556344213000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0026271401001093"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2001,8]]},"references-count":11,"journal-issue":{"issue":"8","published-print":{"date-parts":[[2001,8]]}},"alternative-id":["S0026271401001093"],"URL":"https:\/\/doi.org\/10.1016\/s0026-2714(01)00109-3","relation":{},"ISSN":["0026-2714"],"issn-type":[{"value":"0026-2714","type":"print"}],"subject":[],"published":{"date-parts":[[2001,8]]}}}