{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,8,28]],"date-time":"2024-08-28T11:52:46Z","timestamp":1724845966412},"reference-count":4,"publisher":"Elsevier BV","issue":"8","license":[{"start":{"date-parts":[[2001,8,1]],"date-time":"2001-08-01T00:00:00Z","timestamp":996624000000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2001,8]]},"DOI":"10.1016\/s0026-2714(01)00112-3","type":"journal-article","created":{"date-parts":[[2002,10,31]],"date-time":"2002-10-31T14:50:07Z","timestamp":1036075807000},"page":"1265-1272","source":"Crossref","is-referenced-by-count":1,"title":["Electromigration and electrochemical reaction mixed failure mechanism in gold interconnection system"],"prefix":"10.1016","volume":"41","author":[{"given":"Hide","family":"Murayama","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Makoto","family":"Yamazaki","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shigeru","family":"Nakajima","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"78","reference":[{"key":"10.1016\/S0026-2714(01)00112-3_BIB1","series-title":"Thin films-interdiffusion and reactions","author":"Poate","year":"1978"},{"key":"10.1016\/S0026-2714(01)00112-3_BIB2","doi-asserted-by":"crossref","unstructured":"Hummel RE, Matts Goho S, Dehoff RT. The role of thermal grooving, thermaltransport and electrotransport on the thin film metallizations. Proc IRPS (IEEE) 1984. p. 234","DOI":"10.1109\/IRPS.1984.362052"},{"key":"10.1016\/S0026-2714(01)00112-3_BIB3","doi-asserted-by":"crossref","first-page":"4888","DOI":"10.1063\/1.1663149","article-title":"Surface reactions on MOS structures","volume":"45","author":"Alessandrini","year":"1974","journal-title":"J Appl Phys"},{"key":"10.1016\/S0026-2714(01)00112-3_BIB4","doi-asserted-by":"crossref","first-page":"420","DOI":"10.1063\/1.323346","article-title":"Wetting of quartz surface by Au\u2013Si eutectic melt","volume":"48","author":"Tu","year":"1977","journal-title":"J Appl Phys"}],"container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271401001123?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271401001123?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2020,1,10]],"date-time":"2020-01-10T02:18:38Z","timestamp":1578622718000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0026271401001123"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2001,8]]},"references-count":4,"journal-issue":{"issue":"8","published-print":{"date-parts":[[2001,8]]}},"alternative-id":["S0026271401001123"],"URL":"https:\/\/doi.org\/10.1016\/s0026-2714(01)00112-3","relation":{},"ISSN":["0026-2714"],"issn-type":[{"value":"0026-2714","type":"print"}],"subject":[],"published":{"date-parts":[[2001,8]]}}}