{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,29]],"date-time":"2025-09-29T12:01:35Z","timestamp":1759147295943,"version":"3.30.1"},"reference-count":23,"publisher":"Elsevier BV","issue":"12","license":[{"start":{"date-parts":[[2001,12,1]],"date-time":"2001-12-01T00:00:00Z","timestamp":1007164800000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2001,12]]},"DOI":"10.1016\/s0026-2714(01)00115-9","type":"journal-article","created":{"date-parts":[[2002,10,14]],"date-time":"2002-10-14T22:58:33Z","timestamp":1034636313000},"page":"1993-2000","source":"Crossref","is-referenced-by-count":11,"title":["Reliability of microBGA assembly using no-flow underfill"],"prefix":"10.1016","volume":"41","author":[{"given":"P.L.","family":"Tu","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Y.C.","family":"Chan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"K.C.","family":"Hung","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"78","reference":[{"issue":"2","key":"10.1016\/S0026-2714(01)00115-9_BIB1","doi-asserted-by":"crossref","first-page":"141","DOI":"10.1109\/6144.774718","article-title":"Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications","volume":"22","author":"Shi","year":"1999","journal-title":"IEEE Trans Comp Packag Technol"},{"doi-asserted-by":"crossref","unstructured":"Aoki H et al. Eutectic solder flip chip technology \u2013 bumping and assembly process development for CSP\/BGA. IEEE, Proceedings of ECTC, vol. 48. 1998. p. 325\u201331","key":"10.1016\/S0026-2714(01)00115-9_BIB2","DOI":"10.1109\/ECTC.1997.606188"},{"unstructured":"Wang L et al. Reworkable underfills for flip chip, BGA, and CSP applications. IEEE, Proceedings of the 50th ECTC, Las Vegas, USA, 2000. p. 914\u20139","key":"10.1016\/S0026-2714(01)00115-9_BIB3"},{"unstructured":"Technical information on http:\/\/www.emersoncuming.com\/e&c\/product.htm","key":"10.1016\/S0026-2714(01)00115-9_BIB4"},{"doi-asserted-by":"crossref","unstructured":"Fillion R et al. Reliability evaluation of chip-on-flex CSP devices. IEEE, 1998 International Conference on Multichip Modules and High Density Packaging. p. 242\u20136","key":"10.1016\/S0026-2714(01)00115-9_BIB5","DOI":"10.1109\/ICMCM.1998.670787"},{"doi-asserted-by":"crossref","unstructured":"Peterson DW et al. Calculation and validation of thermomechanical stresses in flip chip BGA using the ATC4.2 test vehicle. IEEE, Proceedings of the 49th ECTC, 1999. p. 1241\u20138","key":"10.1016\/S0026-2714(01)00115-9_BIB6","DOI":"10.1109\/ECTC.1999.776397"},{"doi-asserted-by":"crossref","unstructured":"Thorpe R, Baldwin DF. High throughput flip chip processing and reliability analysis using no-flow underfills. IEEE, Proceedings of the 49th ECTC, 1999. p. 419\u201325","key":"10.1016\/S0026-2714(01)00115-9_BIB7","DOI":"10.1109\/ECTC.1999.776208"},{"issue":"1","key":"10.1016\/S0026-2714(01)00115-9_BIB8","doi-asserted-by":"crossref","first-page":"8","DOI":"10.1108\/09540919910254633","article-title":"Evaluation of pre-deposited (no-flow) underfill for low-cost flip chip assembly","volume":"11","author":"Firmstone","year":"1999","journal-title":"Sold. Surf Mount Technol"},{"issue":"4","key":"10.1016\/S0026-2714(01)00115-9_BIB9","first-page":"325","article-title":"Compression flow modeling of underfill encapsulants for low cost flip chip assembly packaging","volume":"20","author":"Pascarella","year":"1998","journal-title":"IEEE, Trans CPMT Part C"},{"unstructured":"McGovern LP, Baldwin DF. Initial development work on high throughput low cost FC on board assembly process. IEEE, Proceedings of 1997 International Symposium Microelectronics. 1997. p. 285\u20139","key":"10.1016\/S0026-2714(01)00115-9_BIB10"},{"doi-asserted-by":"crossref","unstructured":"Wong CP et al. Characterization of a no-flow underfill encapsulant during the solder reflow process. IEEE, Proceedings of the 48th ECTC, 1998. p. 1253\u20139","key":"10.1016\/S0026-2714(01)00115-9_BIB11","DOI":"10.1109\/ECTC.1998.678898"},{"issue":"3","key":"10.1016\/S0026-2714(01)00115-9_BIB12","first-page":"450","article-title":"High performance no-flow underfills for low-cost flip-chip applications: material characterization","volume":"21","author":"Wong","year":"1998","journal-title":"IEEE Trans CPMT Part A"},{"issue":"4","key":"10.1016\/S0026-2714(01)00115-9_BIB13","doi-asserted-by":"crossref","first-page":"331","DOI":"10.1109\/6104.816104","article-title":"Recent advances in the development of no-flow underfill encapsulants \u2013 a practical approach towards the actual manufacturing application","volume":"22","author":"Shi","year":"1999","journal-title":"IEEE Trans Electron Packag Manufact"},{"issue":"1","key":"10.1016\/S0026-2714(01)00115-9_BIB14","doi-asserted-by":"crossref","first-page":"53","DOI":"10.1109\/6104.755089","article-title":"Correlation of flip chip underfill process parameters and material properties with in-process stress generation","volume":"22","author":"Palaniappan","year":"1999","journal-title":"IEEE Trans Electron Packag Manufact"},{"doi-asserted-by":"crossref","unstructured":"Chan YC, Tu PL, Hung KC. Study of the self-alignment of no-flow underfill for microBGA assembly. Microelectron Reliab 2001;41(11):1867\u201375","key":"10.1016\/S0026-2714(01)00115-9_BIB15","DOI":"10.1016\/S0026-2714(01)00041-5"},{"issue":"2","key":"10.1016\/S0026-2714(01)00115-9_BIB16","doi-asserted-by":"crossref","first-page":"287","DOI":"10.1016\/S0026-2714(00)00217-1","article-title":"Study of microBGA solder joint reliability","volume":"41","author":"Tu","year":"2001","journal-title":"Microelectron Reliab"},{"issue":"4","key":"10.1016\/S0026-2714(01)00115-9_BIB17","doi-asserted-by":"crossref","first-page":"750","DOI":"10.1109\/6040.883768","article-title":"Comparative study of microBGA reliability under bending stress","volume":"23","author":"Tu","year":"2000","journal-title":"IEEE Trans Adv Packag"},{"unstructured":"Fear DR, Morgan HS, Burcheit SN, Lau JH. The mechanics of solider alloy interconnects. New York: Van Nostrand Reinhold; 1994. p. 42\u201386, 361\u201378","key":"10.1016\/S0026-2714(01)00115-9_BIB18"},{"issue":"3","key":"10.1016\/S0026-2714(01)00115-9_BIB19","doi-asserted-by":"crossref","first-page":"391","DOI":"10.1016\/S0026-2714(98)00212-1","article-title":"Evaluation of reliability of \u03bcBGA solder joints through twisting and bending","volume":"39","author":"Perera","year":"1999","journal-title":"Microelectron Reliab"},{"unstructured":"Koyama T, Sasaki M, Wakabayashi S. Advanced CSP and substrate technologies. Proceedings of the 1996 International Symposium on Microelectronics, SPTE vol. 2920; 1996. p. 265\u201370","key":"10.1016\/S0026-2714(01)00115-9_BIB20"},{"unstructured":"Lee T, Lee J, Jung I. Finite element analysis for solder ball failure in chip scale package. Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore. July 1997. p. 39\u201343","key":"10.1016\/S0026-2714(01)00115-9_BIB21"},{"unstructured":"Hinch SW. Handbook of surface mount technology, vol. P161. UK: Longman Group; 1988","key":"10.1016\/S0026-2714(01)00115-9_BIB22"},{"doi-asserted-by":"crossref","unstructured":"Tu PL, Chan YC, et al. Vibration fatigue of \u03bcBGA solder joint. Proceedings of the 50th ECTC, IEEE, Las Vegas, USA, May 2000. p. 1369\u201375","key":"10.1016\/S0026-2714(01)00115-9_BIB23","DOI":"10.1109\/ECTC.2000.853388"}],"container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271401001159?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271401001159?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2024,12,3]],"date-time":"2024-12-03T13:44:37Z","timestamp":1733233477000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0026271401001159"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2001,12]]},"references-count":23,"journal-issue":{"issue":"12","published-print":{"date-parts":[[2001,12]]}},"alternative-id":["S0026271401001159"],"URL":"https:\/\/doi.org\/10.1016\/s0026-2714(01)00115-9","relation":{},"ISSN":["0026-2714"],"issn-type":[{"type":"print","value":"0026-2714"}],"subject":[],"published":{"date-parts":[[2001,12]]}}}