{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2022,4,3]],"date-time":"2022-04-03T17:32:48Z","timestamp":1649007168674},"reference-count":17,"publisher":"Elsevier BV","issue":"3","license":[{"start":{"date-parts":[[2002,3,1]],"date-time":"2002-03-01T00:00:00Z","timestamp":1014940800000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2002,3]]},"DOI":"10.1016\/s0026-2714(01)00135-4","type":"journal-article","created":{"date-parts":[[2002,10,14]],"date-time":"2002-10-14T22:58:33Z","timestamp":1034636313000},"page":"417-426","source":"Crossref","is-referenced-by-count":0,"title":["A novel, zone based process monitoring method for low cost MCM-D substrates manufactured on large area panels"],"prefix":"10.1016","volume":"42","author":[{"given":"Didier","family":"Cottet","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Michael","family":"Scheffler","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Gerhard","family":"Tr\u00f6ster","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"78","reference":[{"key":"10.1016\/S0026-2714(01)00135-4_BIB1","unstructured":"Esprit project 26261: LAP, Low cost large area panel processing of MCM-D substrates and packages, 1998. http:\/\/www. ife.ee.ethz.ch\/hdp\/lap"},{"key":"10.1016\/S0026-2714(01)00135-4_BIB2","unstructured":"Scheffler M, Cottet D, Grzyb J, Tr\u00f6ster G, Delaney K, Ammann N, Preyss W, Baumbach J, Poyet P, Tessier G, Bod\u00f6 P, Leisner P, Wahlstrom U, Persson S-T, Ljungqvist L, Wendel W, Epple R, Centro T, Catarsi F, Demmer P. LAP: low cost large area panel processing of MCM-D substrates and packages \u2013 achievements and results. Proceedings of the International Electronic Packaging Technical Conference, Hawaii, USA, 8\u201313 July 2001, in press"},{"key":"10.1016\/S0026-2714(01)00135-4_BIB3","doi-asserted-by":"crossref","unstructured":"Tessier T, Myszka E. Approaches in cost reducing MCM-D substrate fabrication. Proceedings of the Electronic Components and Technology Conference (ECTC'93), 1993. p. 570\u20138","DOI":"10.1109\/ECTC.1993.346710"},{"key":"10.1016\/S0026-2714(01)00135-4_BIB4","unstructured":"Laursen L, Garrou P. Consortium for intelligent large area processing CILAP. Proceedings of the International MCM Conference (MCM-Denver'95), 1995. p. 253\u20138"},{"key":"10.1016\/S0026-2714(01)00135-4_BIB5","unstructured":"Garrou PE, Tessier TG. Multichip module technology handbook, high-density, large-area-processing (LAP). New York: McGraw-Hill; 1998 (Chapter 5)"},{"key":"10.1016\/S0026-2714(01)00135-4_BIB6","unstructured":"Perfecto E, White G, Saji K, O'Donnell W, Redmond T. Manufacturing considerations for MCM-D large format fabrications. Proceedings of the International Symposium on Microelectronics (ISHM'94), 1994. p. 208\u201313"},{"key":"10.1016\/S0026-2714(01)00135-4_BIB7","unstructured":"Cottet D, Grzyb J, Tr\u00f6ster G. The impact of low cost high density substrates on RF structure integration. Proceedings of the Second International Workshop on Chip-Package Co-Design (CPD2000), Zurich, Switzerland, 14\u201315 March 2000. p. 88\u201392"},{"issue":"4","key":"10.1016\/S0026-2714(01)00135-4_BIB8","doi-asserted-by":"crossref","first-page":"661","DOI":"10.1109\/6040.883756","article-title":"Low-cost large area processing using small area substrates \u2013 a novel multitiled palletization concept for MCM-D thin film process","volume":"23","author":"Bhattacharya","year":"2000","journal-title":"Trans Adv Packaging"},{"issue":"3","key":"10.1016\/S0026-2714(01)00135-4_BIB9","doi-asserted-by":"crossref","first-page":"209","DOI":"10.1109\/6104.795856","article-title":"Run-by-run estimation-based control of meniscus coating","volume":"22","author":"Krauss","year":"1999","journal-title":"Trans Electron Packaging Manuf"},{"key":"10.1016\/S0026-2714(01)00135-4_BIB10","unstructured":"Trask P, Pillai V. Large format MCM-D processing. Proceedings of the International MCM Conference (MCM-Denver'94), 1994. p. 94\u20139"},{"key":"10.1016\/S0026-2714(01)00135-4_BIB11","doi-asserted-by":"crossref","unstructured":"Tummala RR, Rymaszewski EJ, Klopfenstein AG. Microelectronics packaging handbook, technology drivers, Part I, second edition. London: Chapman & Hall; 1997","DOI":"10.1007\/978-1-4615-6037-1"},{"issue":"6","key":"10.1016\/S0026-2714(01)00135-4_BIB12","doi-asserted-by":"crossref","first-page":"861","DOI":"10.1016\/S0026-2714(01)00020-8","article-title":"A simplified yield modelling method for design rule trade off in interconnection substrates","volume":"41","author":"Scheffler","year":"2001","journal-title":"Microelectron Reliab"},{"key":"10.1016\/S0026-2714(01)00135-4_BIB13","unstructured":"Hirt E, Scheffler M, Tr\u00f6ster G, Bernaerts G, Wendel W, Epple R. A 9:4 satellite receiver switch in MCM-C\/D technology. Proceedings of the HD International, Denver, CO, USA, 25\u201328 April 2000. p. 542\u20136"},{"issue":"4","key":"10.1016\/S0026-2714(01)00135-4_BIB14","first-page":"57","article-title":"Outlier control and yield analysis","volume":"15","author":"Ross","year":"1998","journal-title":"Texas Instrum Tech J"},{"key":"10.1016\/S0026-2714(01)00135-4_BIB15","doi-asserted-by":"crossref","unstructured":"Mirza AI, O'Donoghue G, Drake AW, Graves SC. Spatial yield modelling for semiconductor wafers. Proceedings of the IEEE\/SEMI Advanced Semiconductor Manufacturing Conference, New York, USA, 1995. p. 276\u201381","DOI":"10.1109\/ASMC.1995.484386"},{"issue":"4","key":"10.1016\/S0026-2714(01)00135-4_BIB16","doi-asserted-by":"crossref","first-page":"624","DOI":"10.1109\/6040.803455","article-title":"Warpage studies of HDI test vehicles during various thermal profiling","volume":"22","author":"Petriccione","year":"1999","journal-title":"Trans Adv Packaging"},{"key":"10.1016\/S0026-2714(01)00135-4_BIB17","series-title":"Microelectronics manufacturing diagnostics handbook","author":"Landzberg","year":"1993"}],"container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271401001354?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271401001354?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2020,1,8]],"date-time":"2020-01-08T07:19:22Z","timestamp":1578467962000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0026271401001354"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2002,3]]},"references-count":17,"journal-issue":{"issue":"3","published-print":{"date-parts":[[2002,3]]}},"alternative-id":["S0026271401001354"],"URL":"https:\/\/doi.org\/10.1016\/s0026-2714(01)00135-4","relation":{},"ISSN":["0026-2714"],"issn-type":[{"value":"0026-2714","type":"print"}],"subject":[],"published":{"date-parts":[[2002,3]]}}}