{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,23]],"date-time":"2026-03-23T10:57:51Z","timestamp":1774263471664,"version":"3.50.1"},"reference-count":8,"publisher":"Elsevier BV","issue":"1","license":[{"start":{"date-parts":[[2002,1,1]],"date-time":"2002-01-01T00:00:00Z","timestamp":1009843200000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2002,1]]},"DOI":"10.1016\/s0026-2714(01)00226-8","type":"journal-article","created":{"date-parts":[[2002,10,14]],"date-time":"2002-10-14T22:58:33Z","timestamp":1034636313000},"page":"135-140","source":"Crossref","is-referenced-by-count":63,"title":["Improving thermal performance of miniature heat pipe for notebook PC cooling"],"prefix":"10.1016","volume":"42","author":[{"given":"Seok Hwan","family":"Moon","sequence":"first","affiliation":[]},{"given":"Gunn","family":"Hwang","sequence":"additional","affiliation":[]},{"given":"Ho Gyeong","family":"Yun","sequence":"additional","affiliation":[]},{"given":"Tae Goo","family":"Choy","sequence":"additional","affiliation":[]},{"given":"Young II","family":"Kang","sequence":"additional","affiliation":[]}],"member":"78","reference":[{"issue":"3","key":"10.1016\/S0026-2714(01)00226-8_BIB1","doi-asserted-by":"crossref","first-page":"284","DOI":"10.4218\/etrij.98.0198.0303","article-title":"Transient characteristics of a two-phase thermosyphon loop for multichip module","volume":"20","author":"Nam","year":"1998","journal-title":"ETRI J"},{"key":"10.1016\/S0026-2714(01)00226-8_BIB2","first-page":"64","article-title":"Cooling of CPU using micro heat pipe","volume":"9","author":"Eguchi","year":"1997","journal-title":"Fujikura Co Tech Note"},{"key":"10.1016\/S0026-2714(01)00226-8_BIB3","unstructured":"Xie H. The use of heat pipes in the cooling of portables with high power packages. Thermacore Co. Technical Note, 1995"},{"key":"10.1016\/S0026-2714(01)00226-8_BIB4","doi-asserted-by":"crossref","first-page":"595","DOI":"10.1115\/1.2910428","article-title":"Steady-state modeling and testing of a micro heat pipe","volume":"112","author":"Babin","year":"1990","journal-title":"J Heat Transfer"},{"key":"10.1016\/S0026-2714(01)00226-8_BIB5","first-page":"19","article-title":"Thermal analysis of a micro heat pipes","volume":"236","author":"Kurustalev","year":"1993","journal-title":"J Heat Transfer"},{"key":"10.1016\/S0026-2714(01)00226-8_BIB6","unstructured":"Moon SH, Choi CG, Hwang G, Choy TG. Experimental study on performance of a miniature heat pipe with woven wire wick. Las Vegas ITherm 2000, 2000;2:129\u201333"},{"key":"10.1016\/S0026-2714(01)00226-8_BIB7","unstructured":"Moon SH, Kim CJ, Kim BH, Hong SE, Lee JS. An experimental study on the performance limitation of a micro heat pipe with triangular cross-section. 11th Int Heat Pipe Conf, 1999"},{"key":"10.1016\/S0026-2714(01)00226-8_BIB8","unstructured":"Mochizuki M. Advanced cooling system using miniature heat pipes and high aspect ratio fins for electronics cooling. Korea Second Heat Pipe Workshop; 1998. p. 11\u201320"}],"container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271401002268?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271401002268?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2019,5,3]],"date-time":"2019-05-03T06:51:36Z","timestamp":1556866296000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0026271401002268"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2002,1]]},"references-count":8,"journal-issue":{"issue":"1","published-print":{"date-parts":[[2002,1]]}},"alternative-id":["S0026271401002268"],"URL":"https:\/\/doi.org\/10.1016\/s0026-2714(01)00226-8","relation":{},"ISSN":["0026-2714"],"issn-type":[{"value":"0026-2714","type":"print"}],"subject":[],"published":{"date-parts":[[2002,1]]}}}