{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,3]],"date-time":"2026-05-03T01:52:56Z","timestamp":1777773176993,"version":"3.51.4"},"reference-count":11,"publisher":"Elsevier BV","issue":"3","license":[{"start":{"date-parts":[[2002,3,1]],"date-time":"2002-03-01T00:00:00Z","timestamp":1014940800000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2002,3]]},"DOI":"10.1016\/s0026-2714(02)00003-3","type":"journal-article","created":{"date-parts":[[2002,10,14]],"date-time":"2002-10-14T18:58:33Z","timestamp":1034621913000},"page":"375-380","source":"Crossref","is-referenced-by-count":13,"title":["The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method"],"prefix":"10.1016","volume":"42","author":[{"given":"T.Y.","family":"Lin","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"W.S.","family":"Leong","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"K.H.","family":"Chua","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"R.","family":"Oh","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Y.","family":"Miao","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"J.S.","family":"Pan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"J.W.","family":"Chai","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"78","reference":[{"key":"10.1016\/S0026-2714(02)00003-3_BIB1","series-title":"Manufacturing techniques for surface mounted assemblies","first-page":"372","author":"Klein Wassink","year":"1995"},{"key":"10.1016\/S0026-2714(02)00003-3_BIB2","unstructured":"Lin TY, Leong WS. Root cause analysis of non-stick on lead (NSOL) and verification of TQFP176 etched leadframe. Lucent internal report, 2000"},{"key":"10.1016\/S0026-2714(02)00003-3_BIB3","doi-asserted-by":"crossref","first-page":"1199","DOI":"10.1016\/S0026-2714(00)00047-0","article-title":"An investigation on the plasma treatment of integrated circuit bond pads","volume":"40","author":"Chong","year":"2000","journal-title":"Microelectron. Reliab."},{"key":"10.1016\/S0026-2714(02)00003-3_BIB4","series-title":"Proceedings of the International Symposium on Testing and Failure Analysis, ISTFA","first-page":"165","article-title":"Characterizing integrated circuit bond pads","author":"Lowry","year":"1992"},{"issue":"10","key":"10.1016\/S0026-2714(02)00003-3_BIB5","first-page":"227","article-title":"Reliability effects of fluorine contamination of aluminum bonding pads on semiconductor chips","volume":"26","author":"Graves","year":"1983","journal-title":"Solid State Technol."},{"key":"10.1016\/S0026-2714(02)00003-3_BIB6","unstructured":"Kawanobe T, Miyamoto K, Seino M, Shoji S. Bondability of silver plating on IC leadframe. In: 35th Proceedings on IEEE Electronic Components Conference, Washington, DC, 20\u201322 May 1985. p. 314\u20138"},{"key":"10.1016\/S0026-2714(02)00003-3_BIB7","doi-asserted-by":"crossref","first-page":"419","DOI":"10.1109\/TPHP.1977.1135223","article-title":"Reliability Study of wire bonds to silver plating surfaces","volume":"PHP-13","author":"James","year":"1977","journal-title":"IEEE Trans. Parts Hybrids Packag."},{"key":"10.1016\/S0026-2714(02)00003-3_BIB8","doi-asserted-by":"crossref","first-page":"993","DOI":"10.1002\/(SICI)1096-9918(199911)27:11<993::AID-SIA666>3.0.CO;2-J","article-title":"XPS study of incident angle effects on ion-beam modification of InP surfaces by 6 keV O2+","volume":"27","author":"Pan","year":"1999","journal-title":"Surf. Interf. Anal."},{"key":"10.1016\/S0026-2714(02)00003-3_BIB9","doi-asserted-by":"crossref","first-page":"1799","DOI":"10.1557\/JMR.1998.0254","article-title":"AES and XPS analysis of angle of incidence effects of ion-beam-induced nitridation of GaAs","volume":"13","author":"Pan","year":"1998","journal-title":"J. Mater. Res."},{"key":"10.1016\/S0026-2714(02)00003-3_BIB10","unstructured":"Statgraphics\u00aeplus manual on experimental design, Version 1. Manugistics Inc.; 1995"},{"key":"10.1016\/S0026-2714(02)00003-3_BIB11","unstructured":"Lin TY et al. The evaluation of copper migration during the die attach curing and wire bonding process. To be presented in ECTC'2002, San Diego, CA, USA"}],"container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271402000033?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271402000033?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2019,4,27]],"date-time":"2019-04-27T21:52:43Z","timestamp":1556401963000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0026271402000033"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2002,3]]},"references-count":11,"journal-issue":{"issue":"3","published-print":{"date-parts":[[2002,3]]}},"alternative-id":["S0026271402000033"],"URL":"https:\/\/doi.org\/10.1016\/s0026-2714(02)00003-3","relation":{},"ISSN":["0026-2714"],"issn-type":[{"value":"0026-2714","type":"print"}],"subject":[],"published":{"date-parts":[[2002,3]]}}}