{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,21]],"date-time":"2026-05-21T02:49:47Z","timestamp":1779331787650,"version":"3.51.4"},"reference-count":6,"publisher":"Elsevier BV","issue":"4-5","license":[{"start":{"date-parts":[[2002,4,1]],"date-time":"2002-04-01T00:00:00Z","timestamp":1017619200000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2002,4]]},"DOI":"10.1016\/s0026-2714(02)00038-0","type":"journal-article","created":{"date-parts":[[2002,10,14]],"date-time":"2002-10-14T18:58:33Z","timestamp":1034621913000},"page":"767-777","source":"Crossref","is-referenced-by-count":11,"title":["Application of adhesive bonding techniques in hard disk drive head assembly"],"prefix":"10.1016","volume":"42","author":[{"given":"C.F.","family":"Luk","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Y.C.","family":"Chan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"K.C.","family":"Hung","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"78","reference":[{"issue":"4","key":"10.1016\/S0026-2714(02)00038-0_BIB1","doi-asserted-by":"crossref","first-page":"245","DOI":"10.1142\/S0960313197000257","article-title":"Adhesive flip chip bonding on flexible substrates","volume":"7","author":"Aschenbrenner","year":"1997","journal-title":"J Electron Manuf"},{"key":"10.1016\/S0026-2714(02)00038-0_BIB2","unstructured":"Watanabe I, Takemura K. Anisotropic conductive adhesive file for flip-chip interconnection. Electrochemical Publications; 1999"},{"key":"10.1016\/S0026-2714(02)00038-0_BIB3","unstructured":"Lyons AM, Wong CP. Recent advances and evaluation of anisotropically conductive adhesives for microelectronics assembly. Electrochemical Publications; 1999"},{"key":"10.1016\/S0026-2714(02)00038-0_BIB4","unstructured":"Mannan SH, Williams DJ, Whalley DC, Ogunjimi AO. Models to determine guidelines for the anisotropic joining process. Electrochemical Publications; 1999"},{"key":"10.1016\/S0026-2714(02)00038-0_BIB5","unstructured":"ANSYS Theory Reference. 000656. 7th ed. SAS IP. Inc.; 1996"},{"key":"10.1016\/S0026-2714(02)00038-0_BIB6","unstructured":"J. Liu. Manufacturability, reliability and failure mechanisms in conductive adhesive joining for flip-chip and surface mount applications. Electrochemical Publications; 1999"}],"container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271402000380?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271402000380?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2019,5,1]],"date-time":"2019-05-01T15:50:38Z","timestamp":1556725838000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0026271402000380"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2002,4]]},"references-count":6,"journal-issue":{"issue":"4-5","published-print":{"date-parts":[[2002,4]]}},"alternative-id":["S0026271402000380"],"URL":"https:\/\/doi.org\/10.1016\/s0026-2714(02)00038-0","relation":{},"ISSN":["0026-2714"],"issn-type":[{"value":"0026-2714","type":"print"}],"subject":[],"published":{"date-parts":[[2002,4]]}}}