{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,7,23]],"date-time":"2024-07-23T19:52:06Z","timestamp":1721764326246},"reference-count":12,"publisher":"Elsevier BV","issue":"12","license":[{"start":{"date-parts":[[2002,12,1]],"date-time":"2002-12-01T00:00:00Z","timestamp":1038700800000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2002,12]]},"DOI":"10.1016\/s0026-2714(02)00116-6","type":"journal-article","created":{"date-parts":[[2002,11,11]],"date-time":"2002-11-11T21:13:38Z","timestamp":1037049218000},"page":"1903-1911","source":"Crossref","is-referenced-by-count":10,"title":["Procedure for design optimization of a T-cap flip chip package"],"prefix":"10.1016","volume":"42","author":[{"given":"Chin-Yu","family":"Ni","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"De-Shin","family":"Liu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ching-Yang","family":"Chen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"78","reference":[{"key":"10.1016\/S0026-2714(02)00116-6_BIB1","first-page":"81","article-title":"Comparing flip-chip and wire-bond interconnection technologies","author":"Elenius","year":"2000","journal-title":"Chip Scale Rev."},{"key":"10.1016\/S0026-2714(02)00116-6_BIB2","doi-asserted-by":"crossref","first-page":"171","DOI":"10.1115\/1.2905682","article-title":"Approximation evaluation of the elastic thermal stresses in a thin film fabricated on a very thick circular substrate","volume":"116","author":"Suhir","year":"1994","journal-title":"J. Electron Package, Trans. ASME"},{"key":"10.1016\/S0026-2714(02)00116-6_BIB3","doi-asserted-by":"crossref","first-page":"88","DOI":"10.1115\/1.2792073","article-title":"How compliant should a die-attachment be to protect the chip from substrate bowing","volume":"117","author":"Suhir","year":"1995","journal-title":"J. Electron Package, Trans. ASME"},{"key":"10.1016\/S0026-2714(02)00116-6_BIB4","doi-asserted-by":"crossref","first-page":"105","DOI":"10.1115\/1.2905497","article-title":"The effects of adhesive nonlinearity on thermal stress in layered components","volume":"116","author":"Yin","year":"1994","journal-title":"J. Electron Package, Trans. ASME"},{"key":"10.1016\/S0026-2714(02)00116-6_BIB5","doi-asserted-by":"crossref","first-page":"153","DOI":"10.1115\/1.2792083","article-title":"Interfacial thermal stresses in layered structures: the stepped edge problem","volume":"117","author":"Yin","year":"1995","journal-title":"J. Electron Package, Trans. ASME"},{"key":"10.1016\/S0026-2714(02)00116-6_BIB6","first-page":"299","article-title":"A parameteric study of flip chip reliability based on solder fatigue modeling","author":"Popelar","year":"1997","journal-title":"IEEE\/CPMT Int. Electron Manuf. Tech. Symp."},{"key":"10.1016\/S0026-2714(02)00116-6_BIB7","first-page":"193","article-title":"Effect of material and geometry parameters on the thermo-mechanical reliability of flip-chip assemblies","author":"Michaelides","year":"1998","journal-title":"InterSociety Conf. Thermal Phenom."},{"key":"10.1016\/S0026-2714(02)00116-6_BIB8","first-page":"153","article-title":"Thermo-mechanical reliability of flip chip structures used in DCA and CSP","volume":"100","author":"Schubert","year":"1998","journal-title":"Int. Symp. Adv. Packag. Mater."},{"key":"10.1016\/S0026-2714(02)00116-6_BIB9","doi-asserted-by":"crossref","first-page":"309","DOI":"10.1115\/1.2792638","article-title":"Process induced stresses of a flip-chip packaging by sequential processing modeling technique","volume":"120","author":"Wang","year":"1998","journal-title":"J. Electron Packag, Trans. ASME"},{"issue":"2","key":"10.1016\/S0026-2714(02)00116-6_BIB10","doi-asserted-by":"crossref","first-page":"323","DOI":"10.1109\/95.705481","article-title":"The effect of underfill epoxy on warpage in flip-chip assemblies","volume":"21","author":"Zhang","year":"1998","journal-title":"IEEE Trans. Compon. Pack A"},{"key":"10.1016\/S0026-2714(02)00116-6_BIB11","series-title":"Solder joint reliability of BGA CSP flip-chip and fine pitch SMT assemblies","author":"Lau","year":"1997"},{"key":"10.1016\/S0026-2714(02)00116-6_BIB12","series-title":"Design and analysis of experiments","author":"Montgomery","year":"2000"}],"container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271402001166?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271402001166?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2019,4,4]],"date-time":"2019-04-04T17:23:53Z","timestamp":1554398633000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0026271402001166"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2002,12]]},"references-count":12,"journal-issue":{"issue":"12","published-print":{"date-parts":[[2002,12]]}},"alternative-id":["S0026271402001166"],"URL":"https:\/\/doi.org\/10.1016\/s0026-2714(02)00116-6","relation":{},"ISSN":["0026-2714"],"issn-type":[{"value":"0026-2714","type":"print"}],"subject":[],"published":{"date-parts":[[2002,12]]}}}