{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,15]],"date-time":"2025-10-15T09:55:05Z","timestamp":1760522105433},"reference-count":0,"publisher":"Elsevier BV","issue":"9-11","license":[{"start":{"date-parts":[[2002,9,1]],"date-time":"2002-09-01T00:00:00Z","timestamp":1030838400000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2002,9]]},"DOI":"10.1016\/s0026-2714(02)00161-0","type":"journal-article","created":{"date-parts":[[2003,5,13]],"date-time":"2003-05-13T01:38:09Z","timestamp":1052789889000},"page":"1415-1420","source":"Crossref","is-referenced-by-count":20,"title":["Fast temperature cycling and electromigration induced thin film cracking in multilevel interconnection: experiments and modeling"],"prefix":"10.1016","volume":"42","author":[{"given":"H.V.","family":"Nguyen","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"C.","family":"Salm","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"J.","family":"Vroemen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"J.","family":"Voets","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"B.","family":"Krabbenborg","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"J.","family":"Bisschop","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"A.J.","family":"Mouthaan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"F.G.","family":"Kuper","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"78","container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271402001610?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271402001610?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2020,3,13]],"date-time":"2020-03-13T16:54:42Z","timestamp":1584118482000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0026271402001610"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2002,9]]},"references-count":0,"journal-issue":{"issue":"9-11","published-print":{"date-parts":[[2002,9]]}},"alternative-id":["S0026271402001610"],"URL":"https:\/\/doi.org\/10.1016\/s0026-2714(02)00161-0","relation":{},"ISSN":["0026-2714"],"issn-type":[{"value":"0026-2714","type":"print"}],"subject":[],"published":{"date-parts":[[2002,9]]}}}