{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,19]],"date-time":"2025-09-19T10:45:42Z","timestamp":1758278742055},"reference-count":9,"publisher":"Elsevier BV","issue":"2","license":[{"start":{"date-parts":[[2003,2,1]],"date-time":"2003-02-01T00:00:00Z","timestamp":1044057600000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2003,2]]},"DOI":"10.1016\/s0026-2714(02)00263-9","type":"journal-article","created":{"date-parts":[[2003,1,30]],"date-time":"2003-01-30T17:32:20Z","timestamp":1043947940000},"page":"307-318","source":"Crossref","is-referenced-by-count":19,"title":["Modified micro\u2013macro thermo-mechanical modelling of ceramic ball grid array packages"],"prefix":"10.1016","volume":"43","author":[{"given":"Bart","family":"Vandevelde","sequence":"first","affiliation":[]},{"given":"Dominiek","family":"Degryse","sequence":"additional","affiliation":[]},{"given":"Eric","family":"Beyne","sequence":"additional","affiliation":[]},{"given":"Eric","family":"Roose","sequence":"additional","affiliation":[]},{"given":"Dorina","family":"Corlatan","sequence":"additional","affiliation":[]},{"given":"Guido","family":"Swaelen","sequence":"additional","affiliation":[]},{"given":"Geert","family":"Willems","sequence":"additional","affiliation":[]},{"given":"Filip","family":"Christiaens","sequence":"additional","affiliation":[]},{"given":"Alcatel","family":"Bell","sequence":"additional","affiliation":[]},{"given":"Dirk","family":"Vandepitte","sequence":"additional","affiliation":[]},{"given":"Martine","family":"Baelmans","sequence":"additional","affiliation":[]}],"member":"78","reference":[{"issue":"5","key":"10.1016\/S0026-2714(02)00263-9_BIB1","doi-asserted-by":"crossref","first-page":"597","DOI":"10.1147\/rd.375.0597","article-title":"Attachment of solder ball connect (SBC) packages to circuit cards","volume":"37","author":"Ries","year":"1993","journal-title":"IBM J. Res. Develop."},{"key":"10.1016\/S0026-2714(02)00263-9_BIB2","doi-asserted-by":"crossref","unstructured":"Ingalls E, Cole M, Jozwiak J, Milkovich C, Stack J. Improvement in reliability with CCGA column density increase to 1 mm pitch. In: Electronic Components and Technology Conference 1998. p. 1298\u2013304","DOI":"10.1109\/ECTC.1998.678910"},{"key":"10.1016\/S0026-2714(02)00263-9_BIB3","doi-asserted-by":"crossref","unstructured":"Master RN, Dolbear TP. Ceramic ball grid array for AMD K6 microprocessor application. In: ECTC 98, Seattle, Washington, USA. p. 702\u20136","DOI":"10.1109\/ECTC.1998.678775"},{"key":"10.1016\/S0026-2714(02)00263-9_BIB4","unstructured":"Martin GB, Cole Marie S, Brofman JP, Goldmann Lewis S. The effect of substrate thickness on CBGA fatigue life, SMT Conference 97"},{"issue":"5","key":"10.1016\/S0026-2714(02)00263-9_BIB5","doi-asserted-by":"crossref","first-page":"585","DOI":"10.1147\/rd.375.0585","article-title":"Finite element analysis for solder ball connect (SBC) structural design optimisation","volume":"37","author":"Corbin","year":"1993","journal-title":"IBM J. Res. Develop."},{"key":"10.1016\/S0026-2714(02)00263-9_BIB6","unstructured":"Degryse D, Vandevelde B, Beyne E. Simulation of solder joint reliability for CBGA packages. In: 13th European Microelectronics and Packaging Conference, 30 May\u20131 June, Strasbourg, France, 2001"},{"key":"10.1016\/S0026-2714(02)00263-9_BIB7","unstructured":"Vandevelde B. Thermo-mechanical modelling of solder joint reliability for electronic package systems. PhD thesis work, Catholic University of Leuven and IMEC, March 2002"},{"key":"10.1016\/S0026-2714(02)00263-9_BIB8","unstructured":"Manual of MARC-MSC software (www.mscsoftware.com)"},{"key":"10.1016\/S0026-2714(02)00263-9_BIB9","unstructured":"Manual of LMS Optimus software (www.lms.com)"}],"container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271402002639?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271402002639?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2019,3,30]],"date-time":"2019-03-30T10:55:03Z","timestamp":1553943303000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0026271402002639"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2003,2]]},"references-count":9,"journal-issue":{"issue":"2","published-print":{"date-parts":[[2003,2]]}},"alternative-id":["S0026271402002639"],"URL":"https:\/\/doi.org\/10.1016\/s0026-2714(02)00263-9","relation":{},"ISSN":["0026-2714"],"issn-type":[{"value":"0026-2714","type":"print"}],"subject":[],"published":{"date-parts":[[2003,2]]}}}