{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2023,9,28]],"date-time":"2023-09-28T19:25:14Z","timestamp":1695929114663},"reference-count":10,"publisher":"Elsevier BV","issue":"3","license":[{"start":{"date-parts":[[2003,3,1]],"date-time":"2003-03-01T00:00:00Z","timestamp":1046476800000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2003,3]]},"DOI":"10.1016\/s0026-2714(02)00273-1","type":"journal-article","created":{"date-parts":[[2003,3,4]],"date-time":"2003-03-04T16:29:22Z","timestamp":1046795362000},"page":"445-451","source":"Crossref","is-referenced-by-count":18,"title":["Comparison of different flex materials in high density flip chip on flex applications"],"prefix":"10.1016","volume":"43","author":[{"given":"Petteri","family":"Palm","sequence":"first","affiliation":[]},{"given":"Jarmo","family":"M\u00e4\u00e4tt\u00e4nen","sequence":"additional","affiliation":[]},{"given":"Yannick","family":"De Maquill\u00e9","sequence":"additional","affiliation":[]},{"given":"Alain","family":"Picault","sequence":"additional","affiliation":[]},{"given":"Jan","family":"Vanfleteren","sequence":"additional","affiliation":[]},{"given":"Bj\u00f6rn","family":"Vandecasteele","sequence":"additional","affiliation":[]}],"member":"78","reference":[{"key":"10.1016\/S0026-2714(02)00273-1_BIB1","unstructured":"Savolainen P. Solder-filled anisotropically conductive adhesives in electronic interconnections. PhD Thesis, 1996, HUT, Espoo, Finland"},{"issue":"3","key":"10.1016\/S0026-2714(02)00273-1_BIB2","doi-asserted-by":"crossref","DOI":"10.1108\/13565369910293297","article-title":"Assembly and reliability of flip chip on boards using ACA\u2019s or eutectic solder with underfill","volume":"16","author":"Zhong","year":"1999","journal-title":"Microelectron. Int."},{"key":"10.1016\/S0026-2714(02)00273-1_BIB3","unstructured":"M\u00e4\u00e4tt\u00e4nen J, Palm P, Tuominen A. Conductive model of anisotropically conductive adhesives. IMAPS Nordic, 10\u201313 September 2000, Helsingor, Denmark"},{"key":"10.1016\/S0026-2714(02)00273-1_BIB4","series-title":"Printed circuits handbook","article-title":"Materials for flexible circuits","author":"Sheldahl","year":"1996"},{"key":"10.1016\/S0026-2714(02)00273-1_BIB5","doi-asserted-by":"crossref","unstructured":"Palm P, M\u00e4\u00e4tt\u00e4nen J, Picault A, De Maguille Y. The evaluation of different base materials for high density flip chip on flex applications. In: 13th European Microelectronics and Packaging Conference. IMAPS, 30 May\u20131 June, Strasbourg, France","DOI":"10.1108\/13565360110405866"},{"key":"10.1016\/S0026-2714(02)00273-1_BIB6","unstructured":"M\u00e4\u00e4tt\u00e4nen J, Palm P, Tuominen A, Ristolainen E. Development of high density flip chip on flex process using anisotropically conductive adhesives. In: 2000 IEMT\/IMC Symposium, 18\u201321 April, Omiya, Japan"},{"key":"10.1016\/S0026-2714(02)00273-1_BIB7","doi-asserted-by":"crossref","unstructured":"Aschenbrenner R, Mie\u00dfner R, Reichl H. Adhesive flip chip bonding on flexible substrates. In: IEEE International Symposium on Polymer Electronics Packaging, PEP 97, 26\u201330 October 1997, N\u00f6rrk\u00f6ping, Sweden","DOI":"10.1109\/PEP.1997.656478"},{"key":"10.1016\/S0026-2714(02)00273-1_BIB8","unstructured":"M\u00e4\u00e4tt\u00e4nen J, Palm P, Tuominen A, Puhakka K, Reliability of the flip chip on flex application using anisotropically conductive adhesives EMIT-2K. In: International Conference on Emerging Microelectronics and Interconnection Technologies, 21\u201324 February 2000, Bangalore, India"},{"key":"10.1016\/S0026-2714(02)00273-1_BIB9","unstructured":"M\u00e4\u00e4tt\u00e4nen J, Palm P, Tuominen A, Puhakka K. Development of flip chip on flex process using ansisotropically conductive adhesives. In: The 36th IMAPS Nordic Annual Conference, 19\u201322 September 1999, Helsinki, Finland"},{"key":"10.1016\/S0026-2714(02)00273-1_BIB10","unstructured":"Palm P, M\u00e4\u00e4tt\u00e4nen J, Tuominen A, Ristolainen E. Reliability of high density flip chip on flex interconnection. In: IMAPS-Europe Prague 2000, 18\u201320 June 2000, Prague, Czech Republic"}],"container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271402002731?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271402002731?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2019,3,30]],"date-time":"2019-03-30T10:55:01Z","timestamp":1553943301000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0026271402002731"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2003,3]]},"references-count":10,"journal-issue":{"issue":"3","published-print":{"date-parts":[[2003,3]]}},"alternative-id":["S0026271402002731"],"URL":"https:\/\/doi.org\/10.1016\/s0026-2714(02)00273-1","relation":{},"ISSN":["0026-2714"],"issn-type":[{"value":"0026-2714","type":"print"}],"subject":[],"published":{"date-parts":[[2003,3]]}}}