{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2023,12,8]],"date-time":"2023-12-08T12:23:55Z","timestamp":1702038235163},"reference-count":6,"publisher":"Elsevier BV","issue":"1","license":[{"start":{"date-parts":[[2003,1,1]],"date-time":"2003-01-01T00:00:00Z","timestamp":1041379200000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2003,1]]},"DOI":"10.1016\/s0026-2714(02)00282-2","type":"journal-article","created":{"date-parts":[[2003,3,4]],"date-time":"2003-03-04T16:29:22Z","timestamp":1046795362000},"page":"173-177","source":"Crossref","is-referenced-by-count":6,"title":["A physical approach on SCOBIC investigation in VLSI"],"prefix":"10.1016","volume":"43","author":[{"given":"T.","family":"Beauch\u00eane","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"D.","family":"Lewis","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"F.","family":"Beaudoin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"V.","family":"Pouget","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"P.","family":"Perdu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"P.","family":"Fouillat","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Y.","family":"Danto","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"78","reference":[{"issue":"9\u201310","key":"10.1016\/S0026-2714(02)00282-2_BIB1","doi-asserted-by":"crossref","first-page":"1557","DOI":"10.1016\/S0026-2714(01)00177-9","article-title":"Silicon thinning and polishing on packaged devices","volume":"41","author":"Beaudoin","year":"2001","journal-title":"Microelectron Reliab"},{"issue":"6","key":"10.1016\/S0026-2714(02)00282-2_BIB2","doi-asserted-by":"crossref","DOI":"10.1109\/23.983195","article-title":"Backside laser testing of ICs for SET sensitivity evaluation","volume":"48","author":"Lewis","year":"2001","journal-title":"IEEE Trans Nucl Sci"},{"issue":"9\u201310","key":"10.1016\/S0026-2714(02)00282-2_BIB3","doi-asserted-by":"crossref","first-page":"1539","DOI":"10.1016\/S0026-2714(01)00167-6","article-title":"Backside localization of current leakage faults using thermal laser stimulation","volume":"41","author":"Desplats","year":"2001","journal-title":"Microelectron. Reliab."},{"key":"10.1016\/S0026-2714(02)00282-2_BIB4","article-title":"Application of single contact optical beam induced currents (SCOBIC) for backside failure analysis","author":"Palaniappan","year":"2000","journal-title":"ISTFA"},{"key":"10.1016\/S0026-2714(02)00282-2_BIB5","article-title":"Single contact optical beam induced currents (SCOBIC)\u2013\u2013A new failure analysis technique","author":"Chin","year":"2000","journal-title":"IRPS"},{"key":"10.1016\/S0026-2714(02)00282-2_BIB6","unstructured":"Nikawa K et al. Verification and improvement of the optical beam induced resistance change (OBIRCH) method. Proceedings of the 20th International Symposium for Testing and Failure Analysis, 1994. p. 11\u20136"}],"container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271402002822?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271402002822?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2019,3,31]],"date-time":"2019-03-31T12:53:00Z","timestamp":1554036780000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0026271402002822"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2003,1]]},"references-count":6,"journal-issue":{"issue":"1","published-print":{"date-parts":[[2003,1]]}},"alternative-id":["S0026271402002822"],"URL":"https:\/\/doi.org\/10.1016\/s0026-2714(02)00282-2","relation":{},"ISSN":["0026-2714"],"issn-type":[{"value":"0026-2714","type":"print"}],"subject":[],"published":{"date-parts":[[2003,1]]}}}