{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,29]],"date-time":"2025-09-29T12:02:37Z","timestamp":1759147357357,"version":"3.30.2"},"reference-count":8,"publisher":"Elsevier BV","issue":"2","license":[{"start":{"date-parts":[[2003,2,1]],"date-time":"2003-02-01T00:00:00Z","timestamp":1044057600000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2003,2]]},"DOI":"10.1016\/s0026-2714(02)00293-7","type":"journal-article","created":{"date-parts":[[2003,1,30]],"date-time":"2003-01-30T17:32:20Z","timestamp":1043947940000},"page":"279-285","source":"Crossref","is-referenced-by-count":29,"title":["Effect of autoclave test on anisotropic conductive joints"],"prefix":"10.1016","volume":"43","author":[{"given":"C.W.","family":"Tan","sequence":"first","affiliation":[]},{"given":"Y.C.","family":"Chan","sequence":"additional","affiliation":[]},{"given":"N.H.","family":"Yeung","sequence":"additional","affiliation":[]}],"member":"78","reference":[{"key":"10.1016\/S0026-2714(02)00293-7_BIB1","unstructured":"Akira N, Kenzo T, Kazuhira I, Osamu W. Anisotropic conductive adhesive films for flip chip interconnection onto organic substrate. In: 1998 Proceedings of the IEMT\/IMC. p. 353\u201357"},{"key":"10.1016\/S0026-2714(02)00293-7_BIB2","doi-asserted-by":"crossref","unstructured":"Chan YC, Hung KC, Tang CW, Wu CML. Degradation mechanism of anisotropic conductive adhesive joints for flip chip on flex applications. In: Proceedings of the IEEE 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. p. 141\u201346","DOI":"10.1109\/ADHES.2000.860588"},{"issue":"3","key":"10.1016\/S0026-2714(02)00293-7_BIB3","doi-asserted-by":"crossref","first-page":"330","DOI":"10.1109\/33.35478","article-title":"The influence of moisture on surface properties and insulation characteristics of AlN substrate","volume":"12","author":"Yasutoshi","year":"1989","journal-title":"IEEE Trans Comp, Hybrids Manufact Technol"},{"key":"10.1016\/S0026-2714(02)00293-7_BIB4","doi-asserted-by":"crossref","unstructured":"Wong EH, Chan KC, Rajoo R, Lim TB. The mechanism and impact of hygroscopic swelling of polymeric materials in electronic packaging. In: Proceedings of the IEEE Electronic Components and Technology Conference, 2000. p. 576\u201380","DOI":"10.1109\/ECTC.2000.853216"},{"key":"10.1016\/S0026-2714(02)00293-7_BIB5","doi-asserted-by":"crossref","unstructured":"Nemeth P. Accelerated life time test methods for new package technologies. In: Proceedings of the IEEE 24th International Spring Seminar on Electronics Technology, 2001. p. 215\u201319","DOI":"10.1109\/ISSE.2001.931061"},{"issue":"2","key":"10.1016\/S0026-2714(02)00293-7_BIB6","doi-asserted-by":"crossref","first-page":"235","DOI":"10.1109\/95.705469","article-title":"Conduction mechanism in anisotropic conducting adhesive assembly","volume":"21","author":"Chuks","year":"1998","journal-title":"IEEE Trans Comp, Packaging, Manufact Technol\u2013\u2013Part A"},{"key":"10.1016\/S0026-2714(02)00293-7_BIB7","series-title":"Conductive adhesive for electronics packaging","first-page":"212","article-title":"Manufacturability, reliabiltiy and failure mechanisms in conductive adhesive joining for flip\u2013chip and surface mount applications","author":"Johan","year":"1999"},{"issue":"1\u20134","key":"10.1016\/S0026-2714(02)00293-7_BIB8","doi-asserted-by":"crossref","first-page":"67","DOI":"10.1016\/S0169-4332(02)00150-2","article-title":"Corrosion study at Cu\u2013Al interface in microelectronic packaging","volume":"191","author":"Tan","year":"2002","journal-title":"Appl Surf Sci"}],"container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271402002937?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271402002937?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2024,12,11]],"date-time":"2024-12-11T18:28:16Z","timestamp":1733941696000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0026271402002937"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2003,2]]},"references-count":8,"journal-issue":{"issue":"2","published-print":{"date-parts":[[2003,2]]}},"alternative-id":["S0026271402002937"],"URL":"https:\/\/doi.org\/10.1016\/s0026-2714(02)00293-7","relation":{},"ISSN":["0026-2714"],"issn-type":[{"type":"print","value":"0026-2714"}],"subject":[],"published":{"date-parts":[[2003,2]]}}}