{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2022,3,30]],"date-time":"2022-03-30T23:23:06Z","timestamp":1648682586387},"reference-count":12,"publisher":"Elsevier BV","issue":"3","license":[{"start":{"date-parts":[[2003,3,1]],"date-time":"2003-03-01T00:00:00Z","timestamp":1046476800000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2003,3]]},"DOI":"10.1016\/s0026-2714(02)00318-9","type":"journal-article","created":{"date-parts":[[2003,3,4]],"date-time":"2003-03-04T16:29:22Z","timestamp":1046795362000},"page":"481-486","source":"Crossref","is-referenced-by-count":33,"title":["Behaviour of anisotropic conductive joints under mechanical loading"],"prefix":"10.1016","volume":"43","author":[{"given":"C.W.","family":"Tan","sequence":"first","affiliation":[]},{"given":"Y.C.","family":"Chan","sequence":"additional","affiliation":[]},{"given":"N.H.","family":"Yeung","sequence":"additional","affiliation":[]}],"member":"78","reference":[{"issue":"2","key":"10.1016\/S0026-2714(02)00318-9_BIB1","first-page":"250","article-title":"Statistic of electric conductance through anisotropically conductive adhesive","volume":"24","author":"Fu","year":"2000","journal-title":"IEEE Trans. Component Packaging Technol."},{"key":"10.1016\/S0026-2714(02)00318-9_BIB2","unstructured":"Chang DD, Fulton JA, Lyons AM, Nis JR. Design considerations for the implementation of anisotropically conductive adhesive interconnections. In: Proceedings of Nepcon W., 1992. p. 1381"},{"key":"10.1016\/S0026-2714(02)00318-9_BIB3","doi-asserted-by":"crossref","first-page":"226","DOI":"10.1109\/95.705468","article-title":"Design and understanding of anisotropic conductive films (ACFs) for LCD packaging","volume":"21","author":"Yim","year":"1998","journal-title":"IEEE Trans. Component Packaging Technol.\u2013\u2013Part A"},{"key":"10.1016\/S0026-2714(02)00318-9_BIB4","doi-asserted-by":"crossref","unstructured":"Nagai A, Takemure K, Isaka K, Watanabe O, Kojima K, Matsuda K, Watanabe I. Anisotropic conductive adhesive films for flip chip interconnection onto organic substrates. In: Proceedings of IEMT\/IMC, 1998. p. 353\u20137","DOI":"10.1109\/IEMTIM.1998.704675"},{"issue":"1","key":"10.1016\/S0026-2714(02)00318-9_BIB5","doi-asserted-by":"crossref","first-page":"10","DOI":"10.1109\/6040.909619","article-title":"Effect of cooling rate on the isothermal fatigue behavior of CBGA solder joints in shear","volume":"24","author":"Fan","year":"2001","journal-title":"IEEE Trans. Adv. Packaging"},{"key":"10.1016\/S0026-2714(02)00318-9_BIB6","doi-asserted-by":"crossref","unstructured":"Chan YC, Hung KC, Tang CW, Wu CML. Degradation mechanism of anisotropic conductive adhesive joints for flip chip on flex applications. In: Proceedings of IEEE 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. p. 141\u20136","DOI":"10.1109\/ADHES.2000.860588"},{"issue":"2","key":"10.1016\/S0026-2714(02)00318-9_BIB7","doi-asserted-by":"crossref","first-page":"209","DOI":"10.1109\/6144.774733","article-title":"Fracture behaviour of isotropically conductive adhesives","volume":"22","author":"Gupta","year":"1999","journal-title":"IEEE Trans. Components Packaging. Technol."},{"issue":"4","key":"10.1016\/S0026-2714(02)00318-9_BIB8","doi-asserted-by":"crossref","first-page":"285","DOI":"10.1016\/S0143-7496(96)00016-4","article-title":"On the failure mechanism of anisotropically conductive adhesive joints on copper metallisation","volume":"16","author":"Liu","year":"1996","journal-title":"Int. J. Adhes. Adhes."},{"key":"10.1016\/S0026-2714(02)00318-9_BIB9","series-title":"Deformation and fracture behavior of polymers","author":"Grellmann","year":"2001"},{"key":"10.1016\/S0026-2714(02)00318-9_BIB10","unstructured":"Gomatam R, Sancaktar E, Boismier D, Schue D, Malik I. Behavior of electronically conductive filled adhesive joints under cyclic loading part 1: Experimental approach. In: Proceedings of International Symposium on Advanced Packaging Materials, 2001. p. 6\u201312"},{"issue":"2","key":"10.1016\/S0026-2714(02)00318-9_BIB11","doi-asserted-by":"crossref","first-page":"191","DOI":"10.1109\/6144.774731","article-title":"Continuous electrical resistance monitoring, pull strength, and fatigue life of isotropically conductive adhesive joints","volume":"22","author":"Constable","year":"1999","journal-title":"IEEE Trans. Compon. Packag. Technol."},{"key":"10.1016\/S0026-2714(02)00318-9_BIB12","doi-asserted-by":"crossref","unstructured":"Liong S, Wong CP. An alternative to epoxy resin for application in isotropically conductive adhesive. In: Proceedings of International Symposium on Advanced Packaging Materials, 2001. p. 13\u20138","DOI":"10.1109\/ISAOM.2001.916541"}],"container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271402003189?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271402003189?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2019,3,27]],"date-time":"2019-03-27T05:24:39Z","timestamp":1553664279000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0026271402003189"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2003,3]]},"references-count":12,"journal-issue":{"issue":"3","published-print":{"date-parts":[[2003,3]]}},"alternative-id":["S0026271402003189"],"URL":"https:\/\/doi.org\/10.1016\/s0026-2714(02)00318-9","relation":{},"ISSN":["0026-2714"],"issn-type":[{"value":"0026-2714","type":"print"}],"subject":[],"published":{"date-parts":[[2003,3]]}}}