{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,18]],"date-time":"2026-01-18T02:24:36Z","timestamp":1768703076204,"version":"3.49.0"},"reference-count":13,"publisher":"Elsevier BV","issue":"5","license":[{"start":{"date-parts":[[2003,5,1]],"date-time":"2003-05-01T00:00:00Z","timestamp":1051747200000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2003,5]]},"DOI":"10.1016\/s0026-2714(03)00035-0","type":"journal-article","created":{"date-parts":[[2003,4,30]],"date-time":"2003-04-30T23:34:13Z","timestamp":1051745653000},"page":"741-749","source":"Crossref","is-referenced-by-count":48,"title":["Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill"],"prefix":"10.1016","volume":"43","author":[{"given":"Tong Yan","family":"Tee","sequence":"first","affiliation":[]},{"given":"Chek Lim","family":"Kho","sequence":"additional","affiliation":[]},{"given":"Daniel","family":"Yap","sequence":"additional","affiliation":[]},{"given":"Carol","family":"Toh","sequence":"additional","affiliation":[]},{"given":"Xavier","family":"Baraton","sequence":"additional","affiliation":[]},{"given":"Zhaowei","family":"Zhong","sequence":"additional","affiliation":[]}],"member":"78","reference":[{"key":"10.1016\/S0026-2714(03)00035-0_BIB1","unstructured":"Wang T, Chew TH, Lum C, Chew YX, Miao P, Foo L. Assessment of flip chip assembly and reliability via reflowable underfill. In: Proc 51st Electronic Components and Technology Conference, ECTC, USA, 2001"},{"key":"10.1016\/S0026-2714(03)00035-0_BIB2","doi-asserted-by":"crossref","unstructured":"Wong EH, Chan KC, Rajoo R, Lim TB. The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging. In: Proc 50th Electronic Components and Technology Conference, ECTC, Las Vegas, NE, 2000. p. 576\u201380","DOI":"10.1109\/ECTC.2000.853216"},{"key":"10.1016\/S0026-2714(03)00035-0_BIB3","doi-asserted-by":"crossref","unstructured":"Fukuzawa I, Ishiguro S, Nanbu S. Moisture resistance degradation of plastic LSI\u2019s by reflow soldering. In: Proc IRPS, 1985. p. 192\u20137","DOI":"10.1109\/IRPS.1985.362097"},{"key":"10.1016\/S0026-2714(03)00035-0_BIB4","unstructured":"Wong EH, Teo YC, Lim TB. Moisture diffusion and vapour pressure modeling of IC packaging. In: Proc 48th Electronic Components and Technology Conference, ECTC, USA, 1998. p. 1372\u20138"},{"key":"10.1016\/S0026-2714(03)00035-0_BIB5","unstructured":"Tee TY, Fan XJ, Lim TB. Modeling of whole field vapor pressure during reflow for flip chip BGA and wire bond PBGA packages. In: Proc 1st EMAP Conference, Singapore, 1999. p. 38\u201345"},{"key":"10.1016\/S0026-2714(03)00035-0_BIB6","unstructured":"Tee TY, Ng HS. Whole field vapor pressure modeling of QFN during reflow with coupled hygro-mechanical and thermo-mechanical stresses. In: Proc 52nd Electronic Components and Technology Conference, ECTC, San Diego, CA, 2002. p. 1552\u20139"},{"key":"10.1016\/S0026-2714(03)00035-0_BIB7","unstructured":"Wong EH, Chan KC, Tee TY, Rajoo R. Comprehensive treatment of moisture induced failure in IC packaging. In: Proc 3rd IEMT\/IMC, Tokyo, Japan, 1999. p. 176\u201381"},{"issue":"3","key":"10.1016\/S0026-2714(03)00035-0_BIB8","first-page":"274","article-title":"Moisture absorption and desorption predictions for plastic ball grid array packages","volume":"20","author":"Galloway","year":"1997","journal-title":"IEEE Trans. CPMT A"},{"issue":"2","key":"10.1016\/S0026-2714(03)00035-0_BIB9","first-page":"186","article-title":"Moisture diffusion and heat transfer in plastic IC packages","volume":"19","author":"Tay","year":"1996","journal-title":"IEEE Trans. CPMT A"},{"key":"10.1016\/S0026-2714(03)00035-0_BIB10","unstructured":"Joint IPC\/JEDEC Standard J-STD-020B. Moisture\/reflow sensitivity classification for nonhermetic solid state surface mount devices. Electronic Industries Alliance, 2002"},{"key":"10.1016\/S0026-2714(03)00035-0_BIB11","doi-asserted-by":"crossref","unstructured":"Kitano M, Nishimura A, Kawai S. Analysis of package cracking during reflow soldering process. In: Proc IRPS, 1988. p. 90\u20135","DOI":"10.1109\/IRPS.1988.362205"},{"key":"10.1016\/S0026-2714(03)00035-0_BIB12","doi-asserted-by":"crossref","first-page":"787","DOI":"10.1002\/(SICI)1097-4628(19990131)71:5<787::AID-APP12>3.0.CO;2-A","article-title":"Moisture diffusion in epoxy systems","volume":"71","author":"Vanlandingham","year":"1999","journal-title":"J. Appl. Polym. Sci."},{"issue":"15","key":"10.1016\/S0026-2714(03)00035-0_BIB13","doi-asserted-by":"crossref","first-page":"1465","DOI":"10.1177\/002199839302701503","article-title":"Synergistic thermal-moisture damage mechanisms of epoxies and their carbon fiber composites","volume":"27","author":"Zheng","year":"1993","journal-title":"J. Compos. Mater."}],"container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271403000350?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271403000350?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2020,3,18]],"date-time":"2020-03-18T07:18:58Z","timestamp":1584515938000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0026271403000350"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2003,5]]},"references-count":13,"journal-issue":{"issue":"5","published-print":{"date-parts":[[2003,5]]}},"alternative-id":["S0026271403000350"],"URL":"https:\/\/doi.org\/10.1016\/s0026-2714(03)00035-0","relation":{},"ISSN":["0026-2714"],"issn-type":[{"value":"0026-2714","type":"print"}],"subject":[],"published":{"date-parts":[[2003,5]]}}}